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S28HS512TGABHM010

Infineon Technologies

S28HS512TGABHM010 by Infineon Technologies

Infineon's S28HS512TGABHM010 is a 64MX8 NOR flash memory with 200 MHz clock frequency, 1.8V programming voltage, and 300K write/erase cycles. Ideal for automotive applications due to AEC-Q100 screening level, -40 to 125°C operating temperature range, and SPI serial bus interface.

Median Price

$15.160

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,195 parts In-Stock

1+ parts

$13.260

100+ parts

$11.361

1k+ parts

$10.593

10k+ parts

-

1,195

$13.260

$11.361

$10.593

-

Mouser Electronics

USA . 101 parts In-Stock

1+ parts

$13.260

100+ parts

$11.360

1k+ parts

$10.590

10k+ parts

-

101

$13.260

$11.360

$10.590

-

Farnell

UK . 676 parts In-Stock

1+ parts

$15.160

100+ parts

$11.980

1k+ parts

-

10k+ parts

-

676

$15.160

$11.980

-

-

Newark

USA . 697 parts In-Stock

1+ parts

$15.460

100+ parts

$13.630

1k+ parts

$12.760

10k+ parts

-

697

$15.460

$13.630

$12.760

-

Element14

Singapore . 676 parts In-Stock

1+ parts

$26.870

100+ parts

$20.780

1k+ parts

-

10k+ parts

-

676

$26.870

$20.780

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 275 parts In-Stock

1+ parts

$14.402

100+ parts

-

1k+ parts

-

10k+ parts

-

275

$14.402

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$16.660

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$16.660

-

-

-

ComSIT Distribution GmbH

Germany . 23,248 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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23,248

-

-

-

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Vyrian

USA . 341 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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341

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 299 parts In-Stock

1+ parts

$2.548

100+ parts

-

1k+ parts

-

10k+ parts

-

299

$2.548

-

-

-

Modulus Dynamics

Lithuania . 1,281 parts In-Stock

1+ parts

$5.238

100+ parts

$5.028

1k+ parts

$4.819

10k+ parts

-

1,281

$5.238

$5.028

$4.819

-

Ampacity Inc.

Singapore . 455 parts In-Stock

1+ parts

$12.890

100+ parts

-

1k+ parts

-

10k+ parts

-

455

$12.890

-

-

-

Corphita

USA . 223 parts In-Stock

1+ parts

$13.644

100+ parts

-

1k+ parts

-

10k+ parts

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223

$13.644

-

-

-

Component Stockers USA

USA . 1,903 parts In-Stock

1+ parts

$15.880

100+ parts

$14.730

1k+ parts

-

10k+ parts

-

1,903

$15.880

$14.730

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$16.660

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

$16.660

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-

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Continental Prestige Electronics

USA . 3,524 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,524

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-

-

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Argo Parts USA

USA . 2,150 parts In-Stock

1+ parts

-

100+ parts

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2,150

-

-

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Glotronic Ltd.

UK . 608 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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608

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-

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Overview

Enhance your electronic devices with the S28HS512TGABHM010 Flash Memory by Infineon Technologies. Known for their top-quality products, Infineon delivers reliable solutions for a variety of applications. This Flash Memory offers customers exceptional value with its high endurance, fast clock frequency, and efficient write protection features. Upgrade your devices with this compact and versatile memory solution, ensuring optimal performance and reliability. Trust Infineon to provide cutting-edge technology that meets your memory storage needs.

Feature Benefit Bullets

Termination Contact Finish: Silver (Ag)

Silver termination contact finish helps improve conductivity and reduce signal loss, making this product a reliable choice for ensuring stable transmission.

Connector Type: COMBINATION LINE CONNECTOR

The combination line connector type indicates versatility and compatibility with various types of connections, allowing for flexibility in use.

Contact Material: COPPER ALLOY

Copper alloy contact material is known for its excellent conductivity and durability, contributing to the reliability and longevity of this product.

Mating Contact Finish: Silver

Silver mating contact finish ensures a secure and stable connection, enhancing the overall performance and reliability of the product.

Rated Current - Signal: 23 A

With a high signal rated current of 23 A, this product is capable of handling demanding power requirements, making it suitable for various applications.

Total No. of Contacts: 5

Having 5 contacts allows for multiple connections to be made at once, increasing the versatility and functionality of this product.

Mounting Type: CABLE

The cable mounting type offers ease of installation and connection, making this product convenient to use in different setups.

Mating Info.: 10431000

The specified mating information ensures compatibility and proper connection with corresponding components, ensuring a seamless integration.

Termination Type: SCREW

Screw termination type provides a secure and reliable connection, minimizing the risk of disconnection or signal loss, making this product a dependable choice.

Contact Gender: FEMALE

With a female contact gender, this product is designed to mate with male connectors, allowing for a reliable and secure connection in various applications.

Body or Shell Style: RECEPTACLE

The receptacle body or shell style offers a sturdy and protective housing for the contacts, ensuring durability and longevity in use, making this product a reliable choice.

Technical Specifications

Flash Memory S28HS512TGABHM010 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Maximum Clock Frequency (fCLK):

200 MHz

Minimum Data Retention Time:

25

Endurance:

300000 Write/Erase Cycles

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

536870912 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

No. of Words:

67108864 words

No. of Words Code:

64M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,5X5,40

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Programming Voltage (V):

1.8

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00034 Amp

Maximum Supply Current:

173 mA

Maximum Supply Voltage (Vsup):

2 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Type:

NOR TYPE

Width:

6 mm

Write Protection:

HARDWARE

Trade Compliance

S28HS512TGABHM010 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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