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S25FL512SAGMFIR11

Infineon Technologies

S25FL512SAGMFIR11 by Infineon Technologies

Infineon's S25FL512SAGMFIR11 is a 64MX8 NOR Flash Memory with 133 MHz clock frequency, SPI serial bus, and 100000 write/erase cycles. It operates at -40 to 85 °C, ideal for industrial applications requiring high endurance and fast data transfer. The small outline package with gull wing terminals makes it suitable for space-constrained designs.

Median Price

$5.997

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 770 parts In-Stock

1+ parts

$6.310

100+ parts

-

1k+ parts

-

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770

$6.310

-

-

-

Arrow

USA . 65 parts In-Stock

1+ parts

$6.849

100+ parts

$5.773

1k+ parts

$4.814

10k+ parts

$4.766

65

$6.849

$5.773

$4.814

$4.766

Mouser Electronics

USA . 1,094 parts In-Stock

1+ parts

$7.850

100+ parts

$6.510

1k+ parts

$4.920

10k+ parts

-

1,094

$7.850

$6.510

$4.920

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Flip Electronics (Authorized)

USA . 31,196 parts In-Stock

1+ parts

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31,196

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DigiKey

USA . 2,610 parts In-Stock

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-

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$4.920

10k+ parts

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2,610

-

-

$4.920

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Verical

USA . 2,610 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$5.684

10k+ parts

-

2,610

-

-

$5.684

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Rochester

USA . 374 parts In-Stock

1+ parts

-

100+ parts

$4.210

1k+ parts

$3.770

10k+ parts

$3.540

374

-

$4.210

$3.770

$3.540

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 640 parts In-Stock

1+ parts

$4.636

100+ parts

-

1k+ parts

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640

$4.636

-

-

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Flip Electronics

USA . 28,835 parts In-Stock

1+ parts

-

100+ parts

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28,835

-

-

-

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Vyrian

USA . 4,622 parts In-Stock

1+ parts

-

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4,622

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

-

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300

-

-

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IBS Electronics

USA . 141 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.466

10k+ parts

$6.367

141

-

-

$6.466

$6.367

Prism Electronics

USA . 3 parts In-Stock

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-

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 210 parts In-Stock

1+ parts

$2.976

100+ parts

-

1k+ parts

-

10k+ parts

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210

$2.976

-

-

-

Semicontronic

India . 4,322 parts In-Stock

1+ parts

$4.180

100+ parts

$4.076

1k+ parts

$4.055

10k+ parts

-

4,322

$4.180

$4.076

$4.055

-

Corphita

USA . 241 parts In-Stock

1+ parts

$4.392

100+ parts

-

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-

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241

$4.392

-

-

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Component Stockers USA

USA . 5,408 parts In-Stock

1+ parts

$7.010

100+ parts

$6.410

1k+ parts

$6.720

10k+ parts

-

5,408

$7.010

$6.410

$6.720

-

Modulus Dynamics

Lithuania . 4,338 parts In-Stock

1+ parts

$8.048

100+ parts

$7.726

1k+ parts

$7.404

10k+ parts

-

4,338

$8.048

$7.726

$7.404

-

Corohmni

South Africa . 173 parts In-Stock

1+ parts

$8.048

100+ parts

-

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-

10k+ parts

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173

$8.048

-

-

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$8.289

100+ parts

$7.875

1k+ parts

$7.875

10k+ parts

-

5,000

$8.289

$7.875

$7.875

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QUARKTWIN TECHNOLOGY LTD

USA . 20,370 parts In-Stock

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20,370

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Authorized Procurement Solutions

USA . 6,800 parts In-Stock

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6,800

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Perfect Parts

USA . 5,600 parts In-Stock

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5,600

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A-Z Elektronik GmbH

Germany . 5,537 parts In-Stock

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5,537

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GreenTree Electronics

Israel . 5,000 parts In-Stock

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5,000

-

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Argo Parts USA

USA . 3,396 parts In-Stock

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3,396

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Continental Prestige Electronics

USA . 2,681 parts In-Stock

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2,681

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RC Electronics

USA . 1,420 parts In-Stock

1+ parts

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100+ parts

$7.720

1k+ parts

$7.050

10k+ parts

$6.840

1,420

-

$7.720

$7.050

$6.840

Glotronic Ltd.

UK . 492 parts In-Stock

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492

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Bastille Electronics

Australia . 63 parts In-Stock

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63

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Overview

Unlock endless possibilities with the S25FL512SAGMFIR11 by Infineon Technologies. Crafted with precision and expertise, this flash memory device offers unparalleled quality and reliability. Ideal for a wide range of applications, this product is designed to enhance performance and efficiency. With a focus on value and innovation, Infineon Technologies delivers a solution that exceeds expectations. Experience seamless operation and seamless integration with the S25FL512SAGMFIR11 - the ultimate choice for your memory needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the flash memory lightweight and durable, ideal for portable devices.

Surface Mount: YES

Being surface mountable, this flash memory is easy to integrate into circuit boards, saving space and simplifying assembly.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures efficient and synchronized data transfer, improving overall performance.

Maximum Clock Frequency (fCLK): 133 MHz

With a high clock frequency, this flash memory can handle data at a faster rate, enhancing system speed and responsiveness.

Memory Density: 512753664 bit

The high memory density allows for storing a large amount of data in a compact form factor, making it suitable for applications with high storage requirements.

Endurance: 100000 Write/Erase Cycles

The high endurance rating ensures the longevity and reliability of the flash memory, making it suitable for repeated read/write operations.

Technical Specifications

Flash Memory S25FL512SAGMFIR11 attributes and parameters. Explore more Flash Memory devices from Infineon Technologies

Specs

Alternate Memory Width:

4

Maximum Clock Frequency (fCLK):

133 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

10.3 mm

Memory Density:

512753664 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

No. of Words:

64094208 words

No. of Words Code:

64M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64MX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.0003 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

100 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Type:

NOR TYPE

Width:

7.5 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

S25FL512SAGMFIR11 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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