Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.
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MT9HTF12872AZ-667H1
Micron Technology
DRAMs; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.45 ns
333 MHz
COMMON
R-PDMA-N240
e3
9663676416 bit
72
1
240
134217728 words
128M
70 Cel
0 Cel
128MX72
3-STATE
PLASTIC/EPOXY
DIMM
DIMM240,40
RECTANGULAR
MICROELECTRONIC ASSEMBLY
1.8
Not Qualified
8192
.063 Amp
Other Memory ICs
2520 mA
NO
CMOS
COMMERCIAL
MATTE TIN
NO LEAD
1 mm
DUAL
MT9HTF12872AZ-80EH1
.4 ns
400 MHz
2250 mA
MT9HTF6472PKZ-667G1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 244; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-PDMA-N244
4831838208 bit
DDR DRAM MODULE
244
67108864 words
64M
64MX72
DIMM244,24
DRAMs
1260 mA
.6 mm
MT9HVF12872PZ-80EH1
1890 mA
MT9HVF6472PZ-667G1
MT9JSF25672AZ-1G4D1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
SINGLE BANK PAGE BURST
.255 ns
SELF REFRESH; WD-MAX
667 MHz
R-XDMA-N240
e4
133.35 mm
19327352832 bit
268435456 words
256M
SYNCHRONOUS
256MX72
UNSPECIFIED
1.5
30.5 mm
YES
.108 Amp
3285 mA
1.575 V
1.425 V
GOLD
2.7 mm
MT16JTF25664HZ-1G4G1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 204; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-PDMA-N204
17179869184 bit
64
204
256MX64
DIMM204,24
.192 Amp
4016 mA
MT16JTF25664HZ-1G6G1
800 MHz
4896 mA
MT47H512M8WTR-3:C
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 63; Package Code: FBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-PBGA-B63
4294967296 bit
DDR2 DRAM
8
63
536870912 words
512M
85 Cel
512MX8
FBGA
BGA63,9X11,32
GRID ARRAY, FINE PITCH
OTHER
BALL
.8 mm
BOTTOM
MT8JTF12864HZ-1G4G1
8589934592 bit
128MX64
.096 Amp
3920 mA
MT8JTF12864HZ-1G6G1
Micron Technology's MT8JTF12864HZ-1G6G1 is a 128MX64 DDR DRAM MODULE with 204 terminals, operating at 800 MHz. It has a memory density of 8589934592 bits and supports a max clock frequency of 800 MHz. Ideal for commercial applications requiring high-speed data processing and storage capabilities.
.225 ns
4800 mA
IS42S16320D-7BLI-TR
Integrated Silicon Solution
IS42S16320D-7BLI-TR by Integrated Silicon Solution is a 32MX16 DRAM with synchronous operation, self-refresh capability, and common I/O type. It features a max clock frequency of 143 MHz and is ideal for industrial applications requiring high-speed memory access in thin profile packages.
FOUR BANK PAGE BURST
5.4 ns
AUTO/SELF REFRESH
143 MHz
1,2,4,8
R-PBGA-B54
e1
13 mm
536870912 bit
CACHE DRAM MODULE
16
3
54
33554432 words
32M
-40 Cel
32MX16
TFBGA
BGA54,9X9,32
GRID ARRAY, THIN PROFILE, FINE PITCH
260
3.3
1.2 mm
1,2,4,8,FP
.004 Amp
220 mA
3.6 V
3 V
INDUSTRIAL
TIN SILVER COPPER
30
8 mm
IS42S32160D-7BLI-TR
IS42S32160D-7BLI-TR by Integrated Silicon Solution is a 16MX32 DRAM with 3.3V supply, operating at 143 MHz clock frequency. Ideal for industrial applications, it offers synchronous operation, self-refresh capability, and common I/O type for efficient data processing.
R-PBGA-B90
32
90
16777216 words
16M
16MX32
BGA90,9X15,32
300 mA
MT41K1G8THE-15E:D
DDR3L DRAM; Temperature Grade: OTHER; No. of Terminals: 78; Package Code: TFBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
DUAL BANK PAGE BURST
SELF REFRESH
R-PBGA-B78
12 mm
DDR3L DRAM
78
1073741824 words
1G
1GX8
1.45 V
1.283 V
1.35
10.5 mm
MT41K1G8TRF-125:E
MT41K1G8TRF-125:E by Micron Technology is a DDR3L DRAM with 1GX8 organization, operating at 800 MHz. It features a thin profile grid array package and consumes up to 243 mA of current. Ideal for applications requiring high-speed synchronous memory with common I/O type and self-refresh capability.
e0
11.5 mm
BGA78,9X13,32
.036 Amp
243 mA
TIN LEAD SILVER
9.5 mm
MT41K2G4TRF-125:E
DDR3L DRAM; Temperature Grade: OTHER; No. of Terminals: 78; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
4
2147483648 words
2G
2GX4
MT16KTF51264AZ-1G4M1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; Package Code: DIMM; Width: 4 mm; Organization: 512MX64; Length: 133.35 mm;
AUTO/SELF REFRESH; WD-MAX
34359738368 bit
512MX64
4 mm
MT8JTF25664HZ-1G4M1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; Package Code: DIMM; Access Mode: SINGLE BANK PAGE BURST; Maximum Seated Height: 30.15 mm; No. of Functions: 1;
67.6 mm
30.15 mm
3.8 mm
IS43DR16160A-3DBLI-TR
IS43DR16160A-3DBLI-TR by Integrated Silicon Solution is a 16MX16 DDR2 DRAM with 333 MHz clock frequency. Operating at 1.8V, it offers 16M words and supports synchronous mode with self-refresh capability. Ideal for industrial applications requiring high memory density and fast access times.
4,8
R-PBGA-B84
12.5 mm
268435456 bit
84
16MX16
BGA84,9X15,32
.005 Amp
330 mA
1.9 V
1.7 V
MT48LC4M16A2P-75:GTR
Micron Technology's MT48LC4M16A2P-75:GTR is a 3.3V Synchronous DRAM with 4MX16 organization, operating at 70°C max temp. It features self-refresh mode, small outline package, and dual terminal position. Ideal for commercial applications requiring fast access time and high memory density.
R-PDSO-G54
22.22 mm
67108864 bit
SYNCHRONOUS DRAM
4194304 words
4M
4MX16
TSOP2
SMALL OUTLINE, THIN PROFILE
Matte Tin (Sn)
GULL WING
10.16 mm
W9725G6KB25I
Winbond Electronics
Winbond Electronics' W9725G6KB25I is a DDR2 DRAM with 16Mx16 organization, operating at 400MHz. It features a 1.8V supply voltage, 84 terminals in a thin profile grid array package, and supports synchronous operation. Ideal for industrial applications requiring high-speed memory with common I/O type and self-refresh capability.
NOT SPECIFIED
.006 Amp
135 mA
W9825G6JB-6I
W9825G6JB-6I by Winbond Electronics is a 16MX16 Synchronous DRAM with 16777216 words and 268435456 bit memory density. It operates at a max clock frequency of 166 MHz, suitable for industrial applications requiring fast data processing and common I/O type. With a thin profile package style and self-refresh capability, it offers reliable performance in various electronic devices.
5 ns
166 MHz
S-PBGA-B54
SQUARE
.002 Amp
80 mA
W9825G6JB-6
W9825G6JB-6 by Winbond Electronics is a 16MX16 Synchronous DRAM with 16777216 words and 268435456 bit memory density. It operates at a max clock frequency of 166 MHz, suitable for applications requiring high-speed data processing such as networking equipment and industrial automation systems.
MT48H8M32LFB5-75IT:H
Micron Technology's MT48H8M32LFB5-75IT:H is a 8MX32 DRAM with 133 MHz clock frequency, 85 mA supply current, and 85°C max operating temp. Ideal for industrial applications requiring high-speed synchronous memory with common I/O type and self-refresh capability.
133 MHz
8388608 words
8M
8MX32
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
4096
.00001 Amp
85 mA
1.95 V
MT16LSDF6464HY-13EG1
SYNCHRONOUS DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: DIMM; Package Shape: RECTANGULAR; Length: 67.585 mm;
R-XZMA-N144
67.585 mm
SYNCHRONOUS DRAM MODULE
144
65 Cel
64MX64
31.88 mm
Gold (Au)
ZIG-ZAG
TMS4030JL
Texas Instruments
TMS4030JL by Texas Instruments is a 4Kx1 DRAM with 4096-bit memory density, 300ns max access time, and 64 refresh cycles. It has separate I/O type and operates in commercial temperature range. Ideal for applications requiring low-power memory solutions in industrial electronics.
300 ns
SEPARATE
R-XDIP-T22
4096 bit
22
4096 words
4K
4KX1
CERAMIC
DIP
DIP22,.4
IN-LINE
60 mA
MOS
THROUGH-HOLE
2.54 mm
TMS45169-70DZ
TMS45169-70DZ by Texas Instruments is a 256Kx16 EDO DRAM with 70ns access time, 512 refresh cycles, and 3-STATE output. It operates at a voltage of 5V and has a max standby current of 0.001A. Commonly used in commercial applications requiring high-speed memory solutions.
70 ns
R-PDSO-J40
4194304 bit
EDO DRAM
40
262144 words
256K
256KX16
SOJ
SOJ40,.44
SMALL OUTLINE
5
512
.001 Amp
160 mA
J BEND
1.27 mm
MT16HTF51264HZ-800C1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 200; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-XZMA-N200
200
DIMM200,24
IS42S16800F-5TLI
IS42S16800F-5TLI by Integrated Silicon Solution is a 8MX16 Synchronous DRAM with 3.3V supply voltage, operating at up to 200 MHz clock frequency. Ideal for industrial applications requiring fast access times and high memory density.
200 MHz
134217728 bit
8MX16
TSOP54,.46,32
130 mA
IS42S16800F-6TL
IS42S16800F-6TL by Integrated Silicon Solution is a 8MX16 Synchronous DRAM with 166 MHz clock frequency. It operates at 3.3V, has 4096 refresh cycles, and supports common I/O type. Ideal for commercial applications requiring fast memory access and low standby current consumption.
120 mA
IS42S16800F-7BL
IS42S16800F-7BL by Integrated Silicon Solution is an 8MX16 Synchronous DRAM with 143 MHz clock frequency. It operates at 3.3V, has a memory density of 134217728 bits, and supports four bank page burst access mode. Ideal for applications requiring high-speed data processing in commercial temperature environments.
100 mA
MT16HTF25664HIZ-667H1
Micron Technology's MT16HTF25664HIZ-667H1 is a 256MX64 DDR DRAM MODULE with 333 MHz clock frequency. It operates synchronously at 1.8V, featuring self-refresh capability and dual bank page burst access mode. Ideal for industrial applications requiring high memory density and fast data processing.
.112 Amp
3440 mA
MT41K512M8RH-125:E
Micron Technology's MT41K512M8RH-125:E is a DDR3L DRAM with 512MX8 organization, operating at 800 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access in devices like smartphones and tablets.
MULTI BANK PAGE BURST
95 Cel
.016 Amp
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
9 mm
MT41K256M16HA-125:E
Micron Technology's MT41K256M16HA-125:E is a DDR3L DRAM with 256MX16 organization, operating at 800 MHz. It features synchronous operation, self-refresh capability, and a low supply voltage of 1.35V. Ideal for applications requiring high-speed memory access in compact electronic devices.
R-PBGA-B96
14 mm
96
256MX16
BGA96,9X16,32
MT18VDDT12872AY-40BF1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 184; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.7 ns
R-XDMA-N184
184
DIMM184
2.6
31.9 mm
4095 mA
2.7 V
2.5 V
MT4JTF25664AZ-1G6E1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Technology: CMOS;
UPD48288209AFF-E24-DW1-A
Renesas Electronics
DDR1 DRAM; No. of Terminals: 144; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 400 MHz; Surface Mount: YES;
AUTO REFRESH; IT ALSO REQUIRES AT 2.5V
2,4,8
R-PBGA-B144
e6
18.5 mm
301989888 bit
DDR1 DRAM
9
32MX9
BGA
BGA144,12X18,40/32
GRID ARRAY
1.8,2.5
1.17 mm
TIN BISMUTH
11 mm
UPD48288236AFF-E18-DW1-A
DDR1 DRAM; No. of Terminals: 144; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 533 MHz; Memory Width: 36;
533 MHz
36
8MX36
UPD48288236AFF-E33-DW1
DDR1 DRAM; No. of Terminals: 144; Package Code: BGA; Package Shape: RECTANGULAR; Memory Width: 36; JESD-30 Code: R-PBGA-B144;
300 MHz
MT18JSF51272PKZ-1G4K1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Length: 82 mm;
82 mm
38654705664 bit
512MX72
MT47R128M8CF-25:H
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 60; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Ports: 1;
R-PBGA-B60
10 mm
1073741824 bit
60
128MX8
1.5 V
1.55
MT47R256M4CF-25E:H
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 60; Package Code: TFBGA; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
256MX4
MT47R64M16HR-25:H
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 84; Package Code: TFBGA; Package Shape: RECTANGULAR; Memory Width: 16;
64MX16
MT47R64M16HR-25E:H
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 84; Package Code: TFBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
MT48H16M16LFBF-6:H
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 54; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
90 mA
MT48H16M16LFBF-6IT:H
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
MT48H16M16LFBF-75:H
MT48H8M32LFB5-6:H
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 90; Package Code: VFBGA; Refresh Cycles: 4096; Package Shape: RECTANGULAR;
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