Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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MT48LC2M32B2TG6IT:GTR
Micron Technology
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 86; Package Code: TSSOP; Refresh Cycles: 4096; Package Shape: RECTANGULAR;
5.5 ns
166 MHz
COMMON
1,2,4,8
R-PDSO-G86
67108864 bit
SYNCHRONOUS DRAM
32
86
2097152 words
2M
85 Cel
-40 Cel
2MX32
3-STATE
PLASTIC/EPOXY
TSSOP
TSSOP86,.46,20
RECTANGULAR
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
3.3
Not Qualified
4096
1,2,4,8,FP
.002 Amp
DRAMs
225 mA
YES
CMOS
INDUSTRIAL
GULL WING
.5 mm
DUAL
MT4VDDT3264HIY-335J1
DDR DRAM MODULE; Temperature Grade: INDUSTRIAL; No. of Terminals: 200; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.7 ns
167 MHz
R-PDMA-N200
2147483648 bit
DDR DRAM MODULE
64
200
33554432 words
32M
32MX64
DIMM
DIMM200,24
MICROELECTRONIC ASSEMBLY
2.5
8192
1620 mA
NO
NO LEAD
.6 mm
MT48H8M32LFB5-75AT:H
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 90; Package Code: FBGA; Refresh Cycles: 4096; Package Shape: RECTANGULAR;
5.4 ns
133 MHz
R-PBGA-B90
268435456 bit
90
8388608 words
8M
105 Cel
8MX32
FBGA
BGA90,9X15,32
GRID ARRAY, FINE PITCH
1.8
.00001 Amp
85 mA
BALL
.8 mm
BOTTOM
IS42S32800G-6BLI-TR
Integrated Silicon Solution
IS42S32800G-6BLI-TR by Integrated Silicon Solution is a 8MX32 Synchronous DRAM with a memory density of 268435456 bit. It operates at a max clock frequency of 166 MHz and has a temperature grade of INDUSTRIAL. It is commonly used in applications requiring high-speed data storage and retrieval, such as networking equipment and industrial control systems.
.003 Amp
350 mA
IS42S32400F-6TLI-TR
IS42S32400F-6TLI-TR by Integrated Silicon Solution is a 3.3V DRAM with 4MX32 organization, operating at 166 MHz. It features a small outline package and is ideal for industrial applications requiring high memory density and fast access times.
e3
134217728 bit
3
4194304 words
4M
4MX32
260
180 mA
MATTE TIN
30
IS42S81600F-7TLI-TR
IS42S81600F-7TLI-TR by Integrated Silicon Solution is a 16MX8 Synchronous DRAM with 3.3V supply, 143 MHz clock frequency, and -40 to 85°C operating temperature range. Ideal for industrial applications requiring high memory density and fast access times in a small outline package.
143 MHz
R-PDSO-G54
8
54
16777216 words
16M
16MX8
TSOP
TSOP54,.46,32
SMALL OUTLINE, THIN PROFILE
100 mA
IS42S16800F-6TLI-TR
IS42S16800F-6TLI-TR by Integrated Silicon Solution is an 8MX16 SYNCHRONOUS DRAM with 3.3V supply, 166 MHz clock frequency, and -40 to 85 °C operating temp. Ideal for industrial applications requiring high-speed memory access in a small outline package.
16
8MX16
120 mA
IS42S83200G-7BLI-TR
IS42S83200G-7BLI-TR by Integrated Silicon Solution is a 32MX8 Synchronous DRAM with 3.3V supply, 85°C max temp, and 143 MHz clock frequency. Ideal for industrial applications requiring high memory density and fast access times.
S-PBGA-B54
32MX8
BGA54,9X9,32
SQUARE
.004 Amp
130 mA
MT42L64M32D1LF-18IT:C
Micron Technology's MT42L64M32D1LF-18IT:C is a LPDDR2 DRAM with 168 terminals, operating at 533 MHz. It has a memory density of 2147483648 bits and supports sequential burst lengths of 4, 8, and 16. Ideal for industrial applications requiring high-speed data processing in temperatures ranging from -40 to 85°C.
533 MHz
4,8,16
S-PBGA-B168
LPDDR2 DRAM
168
BGA168,23X23,20
1.2,1.8
.000025 Amp
220 mA
MT48H16M16LFBF-75IT:H
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
FOUR BANK PAGE BURST
AUTO/SELF REFRESH
R-PBGA-B54
e1
9 mm
1
SYNCHRONOUS
16MX16
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
1 mm
1.95 V
1.7 V
TIN SILVER COPPER
8 mm
MT46H128M16LFCK-5IT:A
LPDDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 60; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
5 ns
208 MHz
2,4,8,16
R-PBGA-B60
11.5 mm
LPDDR1 DRAM
60
134217728 words
128M
128MX16
BGA60,9X10,32
10 mm
MT46H128M16LFCK-6IT:A
115 mA
MT46H128M32L2KQ-5IT:A
LPDDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 168; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: SQUARE;
12 mm
4294967296 bit
128MX32
.75 mm
150 mA
Tin/Silver/Copper (Sn/Ag/Cu)
MT46H128M32L2MC-5IT:A
LPDDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 240; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: SQUARE;
S-PBGA-B240
14 mm
240
BGA240,27X27,20
MT46H256M32L4JV-5IT:A
8589934592 bit
268435456 words
256M
256MX32
MT46H256M32L4JV-6IT:A
140 mA
MT46H64M32LFCM-5IT:A
LPDDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 90; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
13 mm
67108864 words
64M
64MX32
.01 Amp
MT46H64M32LFCM-6IT:A
MT46H64M32LFMA-5IT:A
LPDDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Memory Density: 2147483648 bit;
.7 mm
MT46H64M32LFMA-6IT:A
MT46V32M16CV-5BIT:J
MT46V32M16CV-5BIT:J by Micron Technology is a 32MX16 DDR1 DRAM with 536870912 bit memory density. It operates at 200 MHz clock frequency, has 3-STATE output characteristics, and supports FOUR BANK PAGE BURST access mode. Ideal for industrial applications requiring fast data processing and high memory capacity.
200 MHz
2,4,8
e0
12.5 mm
536870912 bit
DDR1 DRAM
32MX16
TBGA
BGA60,9X12,40/32
GRID ARRAY, THIN PROFILE
235
2.6
1.2 mm
.005 Amp
230 mA
2.7 V
2.5 V
Tin/Lead/Silver (Sn/Pb/Ag)
MT46V32M16TG-5BIT:J
DDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: TSSOP; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-PDSO-G66
22.22 mm
66
TSSOP66,.46
Tin/Lead (Sn/Pb)
.65 mm
10.16 mm
IS42S16320D-7BLI
IS42S16320D-7BLI by Integrated Silicon Solution is a 32MX16 Synchronous DRAM with a max clock frequency of 143 MHz. It is commonly used in industrial applications and operates at a temperature range of -40 to 85 °C.
TFBGA
GRID ARRAY, THIN PROFILE, FINE PITCH
3.6 V
3 V
IS42S32160D-7BLI
IS42S32160D-7BLI by Integrated Silicon Solution is a 16MX32 SYNCHRONOUS DRAM with 3.3V supply, operating at 143 MHz clock frequency. Ideal for INDUSTRIAL applications, it features FOUR BANK PAGE BURST access mode and offers a memory density of 536870912 bit.
16MX32
300 mA
IS42S32800G-7BLI
IS42S32800G-7BLI by Integrated Silicon Solution is a 8MX32 Synchronous DRAM with a memory density of 268435456 bit. It operates at a max clock frequency of 143 MHz and has a min operating temperature of -40 °C. It is commonly used in industrial applications requiring high-speed memory access.
270 mA
IS42S86400D-7TLI
IS42S86400D-7TLI by Integrated Silicon Solution is a 64MX8 Synchronous DRAM with 3.3V supply, operating at 143MHz clock frequency. Ideal for industrial applications requiring high memory density and fast access times.
64MX8
TSOP2
MT46H16M16LFBF-6AT:H
LPDDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 60; Package Code: BGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
BGA
GRID ARRAY
MT46H8M16LFBF-6AT:K
LPDDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 60; Package Code: BGA; Refresh Cycles: 4096; Package Shape: RECTANGULAR;
90 mA
MT47H32M16HR-25EAAT:G
DDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 84; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.45 ns
400 MHz
4,8
R-PBGA-B84
DDR2 DRAM
84
BGA84,9X15,32
NOT SPECIFIED
AEC-Q100
.007 Amp
215 mA
1.9 V
MT47H32M16HR-25EAIT:G
MT47H64M8CF-25EAIT:G
DDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 60; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
BGA60,9X11,32
MT48LC16M16A2P-7EIT:G
Micron Technology's MT48LC16M16A2P-7EIT:G is a 16MX16 Synchronous DRAM with 3.3V supply, operating at 143MHz. It features common I/O type, self-refresh mode, and industrial temperature grade. Ideal for applications requiring fast memory access in harsh environments.
.0025 Amp
Matte Tin (Sn)
MT41J256M16RE-15EIT:D
Micron Technology's MT41J256M16RE-15EIT:D is a DDR3 DRAM with 256MX16 organization, operating at 667 MHz. It features a 1.5V supply voltage and offers a memory density of 4294967296 bits. Ideal for industrial applications requiring high-speed synchronous memory with common I/O type and self-refresh capability.
MULTI BANK PAGE BURST
.255 ns
667 MHz
R-PBGA-B96
DDR3 DRAM
96
256MX16
BGA96,9X16,32
1.5
.02 Amp
285 mA
1.575 V
1.425 V
W9825G2JB-6I
Winbond Electronics
Winbond Electronics' W9825G2JB-6I is an 8MX32 Synchronous DRAM with 166 MHz clock frequency, suitable for industrial applications. Features include 3.3V supply voltage, 90 terminals in a thin profile grid array package, and common I/O type with self-refresh capability.
3/3.3
MT41J128M16HA-15EAAT:D
Micron Technology's MT41J128M16HA-15EAAT:D is a DDR3 DRAM with 128MX16 organization, operating at 667 MHz. It features a thin profile grid array package and operates in industrial temperature range. Ideal for applications requiring high-speed synchronous memory with common I/O type and self-refresh capability.
.012 Amp
425 mA
MT41J128M16HA-15EAIT:D
DDR3 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 96; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
MT41J256M8HX-15EAAT:D
MT41J256M8HX-15EAAT:D by Micron Technology is a DDR3 DRAM with 256MX8 organization, operating at a max clock frequency of 667 MHz. It is commonly used in industrial applications requiring high memory density and fast access times.
R-PBGA-B78
78
256MX8
BGA78,9X13,32
385 mA
MT41J256M8HX-15EAIT:D
Micron Technology's MT41J256M8HX-15EAIT:D is a DDR3 DRAM with 256MX8 organization, operating at 667 MHz. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for industrial applications requiring high memory density and fast access times.
.225 ns
MT46V32M16CY-5BLIT:J
Micron Technology's MT46V32M16CY-5BLIT:J is a DDR1 DRAM with 32MX16 organization, 200 MHz clock frequency, and 85°C operating temperature. It is used in industrial applications requiring common I/O type, synchronous operation, and self-refresh capability.
MT46V32M16TG-5B:J
2.3 V
MT46V64M8CV-5BIT:J
DDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 60; Package Code: TBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
MT46V64M8CY-5BIT:J
MT46V64M8P-5BIT:J
MT46V64M8P-5BLIT:J
MT46V64M8TG-5BIT:J
MT48LC2M32B2TG-6AIT:J
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 86; Package Code: TSOP2; Refresh Cycles: 4096; Package Shape: RECTANGULAR;
TIN LEAD
MT48LC4M16A2P-7EIT:J
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: TSOP2; Refresh Cycles: 4096; Package Shape: RECTANGULAR;
4MX16
MT48LC4M32B2B5-7IT:G
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 90; Package Code: VFBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
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