Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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MTA9ASF51272AZ-2G1A1
Micron Technology
DDR4 DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 284; Package Code: DIMM; Package Shape: RECTANGULAR; No. of Words: 536870912 words;
SINGLE BANK PAGE BURST
AUTO/SELF REFRESH; WD-MAX
R-XDMA-N284
133.35 mm
38654705664 bit
DDR4 DRAM MODULE
72
1
284
536870912 words
512M
SYNCHRONOUS
85 Cel
0 Cel
512MX72
UNSPECIFIED
DIMM
RECTANGULAR
MICROELECTRONIC ASSEMBLY
31.38 mm
YES
1.26 V
1.14 V
1.2
NO
CMOS
OTHER
NO LEAD
DUAL
2.61 mm
MTA18ADF2G72PDZ-3G2E1
DDR4 DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED;
DUAL BANK PAGE BURST
1600 MHz
COMMON
8
R-XDMA-N288
133.25 mm
154618822656 bit
288
2147483648 words
2G
95 Cel
2GX72
DIMM288,24
18.9 mm
.6 mm
3.9 mm
MTA36ASF2G72PZ-2G6F1
DDR4 DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Technology: CMOS;
1333 MHz
31.4 mm
MTA16ATF2G64AZ-3G2J1
Micron Technology's MTA16ATF2G64AZ-3G2J1 is a DDR4 DRAM MODULE with 2GX64 organization, operating at 1612 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory performance in microelectronic assemblies.
1612 MHz
137438953472 bit
64
2GX64
NOT SPECIFIED
MTA16ATF2G64HZ-3G2J1
DDR4 DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 260; Package Code: DIMM; Package Shape: RECTANGULAR; Technology: CMOS;
R-XDMA-N260
69.6 mm
260
30.13 mm
3.7 mm
MTA4ATF51264AZ-3G2J1
DDR4 DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Interleaved Burst Length: 4,8;
1612.903 MHz
4,8
34359738368 bit
512MX64
2.7 mm
MTA9ASF2G72PZ-3G2B1
DDR4 DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Additional Features: AUTO/SELF REFRESH; WD-MAX;
MTA18ASF2G72PZ-3G2J3
Micron Technology's MTA18ASF2G72PZ-3G2J3 is a DDR4 DRAM MODULE with 2GX72 organization, operating at up to 1600 MHz clock frequency. It features a memory density of 154618822656 bits and is suitable for applications requiring high-speed synchronous memory access in servers or data centers.
OPEN-DRAIN
DIMM288,33
MTA16ATF4G64AZ-3G2B1
DDR4 DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Package Style (Meter): MICROELECTRONIC ASSEMBLY;
274877906944 bit
4294967296 words
4G
4GX64
MTA4ATF1G64AZ-3G2B1
DDR4 DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; No. of Words: 1073741824 words;
68719476736 bit
1073741824 words
1G
1GX64
MTA9ASF1G72PZ-2G6B1
DDR4 DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Maximum Operating Temperature: 95 Cel;
77309411328 bit
1GX72
31.55 mm
MTA18ASF2G72PZ-2G6D1
DDR4 DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Output Characteristics: OPEN-DRAIN;
.45 Amp
3600 mA
MTA18ASF2G72PKTZ-2G6B1
DDR4 DRAM MODULE; Temperature Grade: INDUSTRIAL; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
80 mm
-40 Cel
30.15 mm
INDUSTRIAL
.5 mm
4 mm
MTA18ASF2G72PDZ-3G2E1
MTA18ASF2G72PDZ-3G2E1 by Micron Technology is a DDR4 DRAM MODULE with 2GX72 organization, operating at 1600 MHz. It features a memory density of 154618822656 bits and supports DUAL BANK PAGE BURST access mode. Ideal for high-performance computing applications requiring fast data processing and storage capabilities.
MTA18ASF2G72XF1Z-2G6V21AB
5.8 mm
MTA36ASF8G72PZ-3G2B2
618475290624 bit
8589934592 words
8G
8GX72
MTA4ATF1G64HZ-3G2B1
DDR4 DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 260; Package Code: DIMM; Package Shape: RECTANGULAR; JESD-30 Code: R-XDMA-N260;
AUTO/SELF REFRESH
MTA9ASF1G72PZ-3G2E2
DDR4 DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Memory Width: 72;
.198 Amp
1710 mA
MTA8ATF2G64HZ-3G2E1
DDR4 DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 260; Package Code: DIMM; Package Shape: RECTANGULAR; Memory Width: 64;
MTA18ASF2G72PDZ-3G2J3
Micron Technology's MTA18ASF2G72PDZ-3G2J3 is a DDR4 DRAM MODULE with 2GX72 organization, 1600 MHz clock frequency, and 154618822656 bit memory density. It operates synchronously at 1.2V and is ideal for high-performance computing applications requiring fast data processing.
MTA72ASS16G72PSZ-3S2B1
Micron Technology's MTA72ASS16G72PSZ-3S2B1 is a DDR4 DRAM MODULE with 16GX72 organization, 1600 MHz clock frequency, and 1236950581248 bit memory density. It operates synchronously at 1.2V, suitable for high-performance computing applications requiring fast data processing and storage capabilities.
1236950581248 bit
17179869184 words
16G
16GX72
MTA18ASF2G72HBZ-3G2E1
DDR4 DRAM MODULE; No. of Terminals: 260; Package Code: DIMM; Package Shape: RECTANGULAR; No. of Ports: 1; Maximum Operating Temperature: 105 Cel;
R-XZMA-N260
105 Cel
.468 Amp
1989 mA
ZIG-ZAG
MTA4ATF1G64HZ-3G2E1
Micron Technology's MTA4ATF1G64HZ-3G2E1 is a DDR4 DRAM MODULE with 1GX64 organization, operating at up to 1600 MHz. It features self-refresh capability and synchronous operation, making it ideal for high-performance computing applications.
30
MTA16ATF4G64HZ-3G2E1
DDR4 DRAM MODULE; No. of Terminals: 260; Package Code: DIMM; JESD-30 Code: R-XDMA-N260; Memory Density: 274877906944 bit; Terminal Position: DUAL;
.608 Amp
1808 mA
MTA36ASF8G72LZ-3G2B1
DDR4 DRAM MODULE; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 1600 MHz; JESD-30 Code: R-XDMA-N288;
1.548 Amp
5058 mA
MTA18ASF2G72HZ-2G6E1
Micron Technology's MTA18ASF2G72HZ-2G6E1 is a DDR4 DRAM MODULE with 2GX72 organization, operating at 1333 MHz. It features a memory density of 154618822656 bit and supports DUAL BANK PAGE BURST access mode. Ideal for applications requiring high-speed synchronous memory with self-refresh capability.
3-STATE
1881 mA
MTA8ATF2G64HZ-3G2E2
Micron Technology's MTA8ATF2G64HZ-3G2E2 is a DDR4 DRAM MODULE with 2GX64 organization, operating at 1600 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access in microelectronic assemblies.
DIMM260,20
.304 Amp
1480 mA
MTA36ASF4G72PZ-2G6B2
DDR4 DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Sequential Burst Length: 8;
309237645312 bit
4GX72
.792 Amp
3996 mA
MTA9ASF1G72PZ-2G9E1
Micron Technology's MTA9ASF1G72PZ-2G9E1 is a DDR4 DRAM MODULE with 1GX72 organization, operating at up to 1466 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access in servers or data centers.
1466 MHz
1665 mA
MTA18ASF2G72PZ-2G9E1
Micron Technology's MTA18ASF2G72PZ-2G9E1 is a DDR4 DRAM MODULE with 2GX72 organization, operating at 1466 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory performance in servers or data centers.
.396 Amp
3870 mA
MTA36ASF4G72PZ-3G2E7
4536 mA
MTA8ATF1G64AZ-2G3A1
DDR4 DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 1.2;
1204 MHz
MTA8ATF1G64AZ-2G6E1
DDR4 DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Width: 2.7 mm;
MTA8ATF1G64AZ-3G2E1
DDR4 DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; No. of Ports: 1;
MTA18ASF2G72PDZ-2G6E1
Micron's MTA18ASF2G72PDZ-2G6E1 DDR4 DRAM module features 2GX72 organization, 1333 MHz clock frequency, and 154618822656-bit memory density. Ideal for servers, data centers, and high-performance computing applications requiring synchronous operation and self-refresh capabilities.
MTA18ASF2G72PDZ-2G9E1
Micron Technology's MTA18ASF2G72PDZ-2G9E1 is a DDR4 DRAM MODULE with 2GX72 organization, 1466 MHz clock frequency, and 154618822656-bit memory density. It operates synchronously at 1.2V, featuring dual-bank page burst access mode. Ideal for high-performance computing applications requiring fast data processing and storage capabilities.
MTA18ASF2G72PZ-3G2E2
4140 mA
MTA18ASF2G72PDZ-2G3D1
DDR4 DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Terminal Form: NO LEAD;
MTA36ASF4G72PZ-2G3D1
DDR4 DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; JESD-30 Code: R-XDMA-N288;
MTA36ASF4G72PZ-2G9E2
4266 mA
MTA18ADF2G72AZ-3G2R1
DDR4 DRAM MODULE; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Terminal Form: NO LEAD; Maximum Supply Current: 1737 mA;
1612.9 MHz
.54 Amp
1737 mA
MTA8ATF2G64AZ-3G2F1
MTA8ATF2G64AZ-3G2F1 by Micron Technology is a DDR4 DRAM MODULE with 2GX64 organization, operating at 1600 MHz. It features a memory width of 64 bits and density of 137.44 Gb, suitable for applications requiring high-speed synchronous memory like servers and workstations.
31.25 mm
1336 mA
MTA18ASF4G72AZ-3G2F1
DDR4 DRAM MODULE; No. of Terminals: 288; Terminal Form: NO LEAD; No. of Words: 4294967296 words; Organization: 4GX72; Package Body Material: UNSPECIFIED;
MTA18ADF4G72PZ-3G2F1
DDR4 DRAM MODULE; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Maximum Operating Temperature: 95 Cel; Additional Features: AUTO/SELF REFRESH;
.756 Amp
1845 mA
MTA18ASF4G72HZ-3G2F1
Micron Technology's MTA18ASF4G72HZ-3G2F1 is a DDR4 DRAM module with 4GX72 organization, operating at 1612.9 MHz. It features synchronous operation, self-refresh capability, and a common I/O type. Ideal for high-performance computing applications requiring fast data processing and storage.
.684 Amp
MTA16ATF4G64HZ-3G2F1
Micron's MTA16ATF4G64HZ-3G2F1 is a DDR4 DRAM module with 4GX64 organization, 64-bit memory width, and 274877906944 bit memory density. It operates synchronously with self-refresh capability and dual bank page burst access mode. Ideal for applications requiring high-speed data processing in compact systems.
AUTO REFRESH AND SELF REFRESH; WIDTH MAX
MTA36ASF4G72PBZ-3G2E1
DDR4 DRAM MODULE; No. of Terminals: 288; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR; Memory Width: 72;
8192
.72 Amp
4698 mA
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