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XCZU7EV-2FBVB900I

Xilinx

XCZU7EV-2FBVB900I by Xilinx

The Xilinx XCZU7EV-2FBVB900I is a CMOS microprocessor circuit with 900 terminals in a grid array package. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. Ideal for industrial applications requiring high processing power and temperature resilience.

Median Price

$4,964.505

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Mouser Electronics

USA . 3 parts In-Stock

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DigiKey

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Digiode

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VNN

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Nova Conductors

Japan . 700 parts In-Stock

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Cyclops Electronics Ltd

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AZTECH Wire

Italy . 614 parts In-Stock

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Corohmni

South Africa . 3,148 parts In-Stock

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Modulus Dynamics

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Qasali Group International

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Aztec Data Supply Inc.

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One Stop Electronics

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Semicontronic

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Corphita

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Ampacity Inc.

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Overview

Unleash the power of innovation with the XCZU7EV-2FBVB900I by Xilinx. As a leader in the industry, Xilinx delivers top-quality products that exceed expectations. This versatile microprocessor circuit is perfect for a wide range of applications, offering unparalleled performance and reliability. With a temperature range of -40°C to 100°C, 900 terminals, and a sleek rectangular package design, this product is designed to meet the needs of any project. Experience the benefits of cutting-edge technology and unleash your creativity with the XCZU7EV-2FBVB900I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and resistance to environmental factors, making the product suitable for a wide range of applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage tolerance provides flexibility in power input options, ensuring compatibility with various power sources.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into circuit designs, optimizing board space utilization and layout efficiency.

No. of Terminals: 900

The large number of terminals enables connectivity to multiple components, supporting complex circuit configurations and functionality.

Package Style (Meter): GRID ARRAY

The grid array package style offers improved thermal dissipation and mechanical stability, enhancing overall performance and reliability.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range ensures reliable operation in harsh environmental conditions, making the product suitable for industrial applications.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature tolerance allows for operation in elevated temperature environments without sacrificing performance or reliability.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

The terminal finish of tin, silver, and copper provides excellent conductivity, corrosion resistance, and solderability, ensuring long-term reliability and performance.

Technology: CMOS

The CMOS technology offers low power consumption, high speed, and noise immunity, making the product energy-efficient and suitable for digital applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU7EV-2FBVB900I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU7EV-2FBVB900I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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