Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
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Other Function uPs,uCs & Peripheral ICs XCVP1402-1LSIVSVA2785 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx
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XCVP1402-1LSIVSVA2785 Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
SMMBT3904LT1G
Onsemi
SMMBT3904LT1G by Onsemi is a NPN BJT with 3 terminals, 0.3W power dissipation, and 40V max collector-emitter voltage. Ideal for small outline applications requiring a transistor with hFE of at least 30, it operates up to 150°C and has a transition frequency of 300MHz.
2N7002
Supertex
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Maximum Feedback Capacitance (Crss): 5 pF;
BAV99
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Frontier Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
CRCW04020000Z0EDHP
Vishay Intertechnology
Vishay Intertechnology's CRCW04020000Z0EDHP is a 0402 SMT resistor with 0 ohm resistance, rated for temperatures from -55°C to 155°C. Ideal for jumper applications in automotive electronics due to AEC-Q200 compliance and compact size of 1mm x 0.5mm x 0.3mm.
Sprague Electric
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1.3 V; Maximum Output Current: .1 A; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 175 Cel;
LL4148
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: END; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
ABS25-32.768KHZ-T
Abracon
Abracon's ABS25-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 122% stability, and 50000 ohm series resistance. Ideal for applications requiring 0.032768 MHz nominal frequency, such as IoT devices and precision timing systems in industrial settings.
Itt Components
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .005 us; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Non Repetitive Peak Forward Current: 1 A;
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Transys Electronics
LM358N
Taejin Technology
OPERATIONAL AMPLIFIER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Inter F E T
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 7.5 ohm; Maximum Drain Current (Abs) (ID): .115 A;
BSS138
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: TIN LEAD; Package Body Material: PLASTIC/EPOXY;
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
M85049/85-08W02
Glenair
CONNECTOR ACCESSORY; MIL Conformity: YES; Material: ALUMINIUM ALLOY; Associated Backshell Military - Specifications: MIL-DTL-38999; Shell Sizes: 08; DIN Conformity: NO;
1N4148WS
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Bytesonic Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Position: DUAL; Minimum Operating Temperature: -55 Cel;
Sensitron Semiconductor
ST33HTPH2032AAF3
STMicroelectronics
ST33HTPH2032AAF3 by STMicroelectronics is a 32-terminal IC with CMOS technology, operating from -40 to 105°C. It's a cryptographic authenticator with 1.8V supply voltage, suitable for industrial applications requiring secure data processing in compact spaces.
AM4378BZDN100
Texas Instruments
AM4378BZDN100 by Texas Instruments is a System on Chip with 491 terminals in a low profile, fine pitch grid array package. It operates b/w 0-90°C with supply voltage range of 1.272-1.378V, making it ideal for embedded applications requiring high performance and compact design.
ATMXT224S-MAUR036
Microchip Technology
Microchip's ATMXT224S-MAUR036 is a 56-terminal IC with max supply voltage of 3.47V, ideal for capacitive touch screen control apps. Operating b/w -40 to 85°C, it features a square package style and quad terminal position, making it suitable for surface mount applications. With a nominal voltage of 3.3V and CMOS technology, this chip carrier is compact at 6x6mm in size.
NRF52811-QFAA-R7
Nordic Semiconductor Asa
NRF52811-QFAA-R7 by Nordic Semiconductor is a 48-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 85 °C and supports supply voltage range of 1.7V to 3.6V. Ideal for applications requiring low-profile, surface-mountable chips in various electronic devices.
XC7Z030-2FFG676I
Xilinx
Xilinx XC7Z030-2FFG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.
AM6232ATCGGAALW
AM6232ATCGGAALW by Texas Instruments is a SoC with 425 terminals in a grid array package. It operates b/w -40 to 105 °C with supply voltage range of 0.715V to 0.79V. Ideal for applications requiring high-speed processing and low power consumption.
XC7Z010-1CLG225C
The Xilinx XC7Z010-1CLG225C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Ideal for applications requiring low profile, fine pitch grid array packages in plastic/epoxy material.
XCZU4EV-L1SFVC784I
The Xilinx XCZU4EV-L1SFVC784I is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.698V to 0.742V. With 784 terminals in a GRID ARRAY package, it's ideal for industrial applications requiring high-performance processing capabilities.
MCIMX6L8DVN10AB
Freescale Semiconductor
SoC; Terminal Form: BALL; No. of Terminals: 432; Package Code: TFBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
PGA460TPWQ1
PGA460TPWQ1 by Texas Instruments is a CMOS microprocessor circuit with 16 terminals and SPI, UART, USART bus compatibility. Operating temperature ranges from -40 to 125 °C, suitable for automotive applications. It has a supply voltage range of 6-28 V and AEC-Q100 screening level.
MIMXRT1064DVL6BR
NXP Semiconductors
The NXP MIMXRT1064DVL6BR is a low-profile, fine-pitch SoC with 196 terminals. It operates b/w 0-95°C, with supply voltage ranging from 1.15-1.26V. Ideal for applications requiring high-performance uPs and uCs in a compact form factor.
XCZU7EV-2FFVC1156I
The Xilinx XCZU7EV-2FFVC1156I is a CMOS microprocessor circuit with 1156 terminals in a grid array package. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. Ideal for industrial applications requiring high-performance processing capabilities.
EFR32BG24B220F1024IM48-B
Silicon Labs
EFR32BG24B220F1024IM48-B by Silicon Labs is a 48-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C and supports supply voltages from 1.71V to 3.8V. Ideal for applications requiring low-profile, surface-mount chips in various electronic devices.
PN7150B0HN/C11006E
PN7150B0HN/C11006E by NXP Semiconductors is a NFC controller with a supply voltage range of 1.65V to 1.95V and operating temperature range of -30°C to 85°C. It comes in a square package with 40 terminals and is suitable for applications requiring contactless communication.
MPFS250T-1FCVG484E
The Microchip Technology MPFS250T-1FCVG484E is a SoC peripheral IC with CMOS technology. It operates b/w 0°C to 100°C, with a supply voltage range of 0.97V to 1.03V. This grid array IC, measuring 19mm x 19mm, is ideal for applications requiring fine pitch and surface mount capabilities.
MCIMX6Q6AVT10AD
SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;
AX-SFUS-1-01-TB05
AX-SFUS-1-01-TB05 by Onsemi is a CMOS MICROPROCESSOR CIRCUIT with 40 terminals in a RECTANGULAR CHIP CARRIER package. It operates b/w -40 to 85 °C, with supply voltage range of 1.8V to 3.6V, making it ideal for industrial applications requiring high performance and reliability.
SLB9665XT20FW563XUMA2
Infineon Technologies
SLB9665XT20FW563XUMA2 by Infineon: 3.6V max supply, -40 to 85°C temp range, cryptographic authenticator for secure applications. Small outline package with 28 terminals, CMOS technology, suitable for surface mount designs.
AM5716AABCXEQ1
AM5716AABCXEQ1 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, suitable for AUTOMOTIVE applications. With 760 terminals in a GRID ARRAY package style, it has a supply voltage range of 1.11V to 1.2V for versatile usage.
XC7Z030-L2FFG676I
XC7Z030-L2FFG676I by Xilinx is a 676-terminal System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. Ideal for applications requiring high-performance computing in compact spaces.
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XCVP1702-3DSEVSVA3340
MICROPROCESSOR CIRCUIT;
XCVP1802-1HSELSVC4072
XCVP1202-2MSEVSVA2785
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Package Equivalence Code: BGA2785,53X53,36;
XCVP1502-1GSIVSVA2785
XCVP1502-3HSEVSVA2785
XCVP1202-1MSEVSVA2785
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Width: 50 mm;
XCVP1202-2MLEVSVA2785
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Minimum Supply Voltage: .775 V;
XCVP1402-1MSEVSVA2785
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Terminal Pitch: .92 mm;
XCVP1402-2DSEVSVA2785
XCVP1502-2MSEVSVA2785
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;
XCVP1702-1MSIVSVA3340
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 3340; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XCVP1802-2MLEVSVA5601
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 5601; Package Code: HBGA; Package Shape: SQUARE; Nominal Supply Voltage: .8 V;
XCVP1802-3DLILSVC4072
XCVP1002-1MSINFVI1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: BGA; Package Shape: RECTANGULAR; Nominal Supply Voltage: .8 V;
XCVP1002-1LSIVFVF1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Technology: CMOS;
XCVP1002-1MSIVFVF1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XCVP1002-1MSIVSVC2021
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2021; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: .8 V;
XCVP1002-1LSENFVI1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 100 Cel;
XCVP1002-1LSIVSVC2021
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2021; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: .724 V;
XCVP1002-2HSINFVI1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Supply Voltage: .906 V;
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