Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Other Function uPs,uCs & Peripheral ICs XCVP1802-3DLILSVC4072 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx
Peripheral IC Type:
XCVP1802-3DLILSVC4072 Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
BAV99
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
SMMBT2222ALT1G
Onsemi
SMMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, 0.6A IC, and 40V VCE. It has a hFE of 75, fT of 300MHz, and operates up to 150°C. Ideal for small signal applications in automotive electronics due to AEC-Q101 compliance.
NE555DR
Texas Instruments
NE555DR by Texas Instruments is an Analog Waveform Generation IC with 8 terminals, operating voltage of 5V, and power supplies ranging from 5-15V. It is a versatile component for pulse generation applications due to its small outline package and commercial temperature grade suitability.
RN41N-I/RM
Microchip Technology
Microchip Technology's RN41N-I/RM is a telecom IC with 35 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in industrial applications. The package style is rectangular, measuring 13.2mm x 20.1mm with a seated height of 2.2mm, suitable for telecom interface functions.
CRCW04020000Z0ED
Vishay Intertechnology
Vishay Intertechnology's CRCW04020000Z0ED is a 0 ohm jumper resistor with METAL GLAZE/THICK FILM tech. Operating b/w -55 to 155 °C, it suits SMT applications in automotive electronics due to AEC-Q200 compliance and 0.063 W power dissipation.
DS18B20Z+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Body Width: 3.9 inch; Maximum Supply Voltage: 5.5 V;
Weitronic Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/56351
Souriau
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Insertion Tools: M81969/14-10; Tool Settings: M22520/2-10; DIN Conformity: NO;
M24308/2-1F
TE Connectivity
TE Connectivity's M24308/2-1F D-Sub Connector features 9 contacts, 2 rows, and a shell size of 1/E. With a rated current of 7.5A, it operates b/w -55°C to 125°C. Ideal for cable mounting applications, this connector has a steel shell with cadmium finish and uses crimp termination for female contact pins.
SS14
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
OPA2277UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LM358DR2G
LM358DR2G by Onsemi is a dual operational amplifier with 7000uV max input offset voltage and 70dB nominal CMRR. Ideal for applications requiring low bias current such as sensor interfaces, signal conditioning circuits, and audio amplifiers. Package style: Small Outline, Technology: Bipolar, Unity Gain Bandwidth: 1000 kHz.
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): .715 V; Maximum Operating Temperature: 150 Cel; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .2 A;
BSS123,215
NXP Semiconductors
NXP Semiconductors' BSS123,215 is a N-CHANNEL FET for SWITCHING applications. Features include 100V DS Breakdown Voltage, 0.17A Drain Current, and 6 ohm On Resistance. With GULL WING terminals and ENHANCEMENT MODE operation, it's ideal for small outline packages in various electronic devices.
Formosa Microsemi
IRLML6402TRPBF
Infineon Technologies
IRLML6402TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 20V DS Breakdown Voltage, 22A IDM, and 0.065 ohm RDS(on). With a small outline package and matte tin finish, it operates in temperatures from -55 to 150 °C.
M39029/58-360
Defense Logistics Agency
CONNECTOR ACCESSORY; Contact Type: CRIMP REAR RELEASE; Mating Contacts: M39029/56-348, M39029/57-354; Insertion Tool Sources: MILITARY; Contact Gender: MALE; Alternate Contact Sources: MILITARY;
1N4148
Shenzhen Yixinsemi Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148WT
1N4148WT by Onsemi is a single rectifier diode with a max output current of 0.3A and forward voltage of 0.72V. It has a small outline package style, matte tin terminal finish, and operates at temperatures up to 150°C. Ideal for applications requiring fast reverse recovery time such as power supplies and signal demodulation circuits.
BSS138
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Feedback Capacitance (Crss): 10 pF; JEDEC-95 Code: TO-236AB;
XCZU3EG-1SBVA484E
Xilinx
The Xilinx XCZU3EG-1SBVA484E is a programmable SoC with CMOS technology. It operates b/w 0 to 100°C, with supply voltage ranging from 0.825V to 0.876V. With 484 terminals in a grid array package, it's ideal for various applications requiring high-performance microprocessors and peripheral ICs.
SCANSTA112VS
The Texas Instruments SCANSTA112VS is a 100-terminal microprocessor circuit IC with a supply voltage range of 3-3.6V, operating temperature from -40 to 85°C, and terminal pitch of 0.5mm. It is used in industrial applications requiring thin profile, fine pitch packages for surface mount assembly.
MCIMX7D2DVM12SD
MCIMX7D2DVM12SD by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-85 °C, with supply voltage range of 1.2-1.25 V. Ideal for applications requiring low profile and fine pitch package style in a grid array format.
FT800Q-R
FTDI
FTDI's FT800Q-R is a 48-terminal chip carrier IC with CMOS technology. It operates b/w -40 to 85 °C, suitable for industrial applications. With a supply voltage range of 2.97-3.63 V, it is ideal for microprocessor circuits requiring a compact form factor and low power consumption.
XC7Z015-1CL485I
The Xilinx XC7Z015-1CL485I is a programmable system on chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 485 terminals in a square grid array package, it's ideal for various applications requiring low profile and fine pitch components.
AM6231ASGGGAALW
AM6231ASGGGAALW by Texas Instruments is a 425-terminal SoC IC with CMOS technology. It operates b/w -40 to 105°C, with supply voltage ranging from 0.715V to 0.79V. This very thin profile, fine pitch grid array package is ideal for applications requiring high-speed processing in compact spaces.
XCZU25DR-2FFVE1156I
XCZU25DR-2FFVE1156I by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This IC has 1156 terminals in a GRID ARRAY package, suitable for industrial applications requiring high performance and reliability.
AM6254ATCGGAALW
AM6254ATCGGAALW by Texas Instruments is a SoC peripheral IC with 425 terminals in a grid array package. It operates b/w -40 to 105 °C with supply voltage range of 0.715V to 0.79V. Ideal for applications requiring high-speed processing and low power consumption.
NRF52811-QFAA-R
Nordic Semiconductor Asa
NRF52811-QFAA-R by Nordic Semiconductor Asa is a MICROPROCESSOR CIRCUIT with 48 terminals, operating from -40 to 85 °C. It has a supply voltage range of 1.7V to 3.6V and comes in a SQUARE package style suitable for various applications requiring low power consumption and compact design.
XC7Z030-1FBG676I
The Xilinx XC7Z030-1FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance computing and peripheral integration.
EFR32MG21A020F512IM32-B
Silicon Labs
EFR32MG21A020F512IM32-B by Silicon Labs is a 32-terminal, square-shaped chip carrier with a supply voltage range of 1.71V to 3.8V. Operating b/w -40°C to 125°C, it's an automotive-grade System on Chip (SoC) suitable for various IoT applications due to its CMOS technology and compact dimensions of 4mm x 4mm.
MCIMX283CVM4BR2
MCIMX283CVM4BR2 by NXP Semiconductors is a System on Chip with 289 terminals, operating at -40 to 85°C. It has a supply voltage range of 1.35-1.8V and peak reflow temperature of 260°C. Ideal for industrial applications requiring low profile, fine pitch packages in a grid array style.
AM5716AABCXQ1
AM5716AABCXQ1 by Texas Instruments is a 760-terminal SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, suitable for automotive applications. With a supply voltage range of 1.11V to 1.2V, it features a fine pitch grid array package style for surface mount assembly.
CSR8675C-IBBH-R
Qualcomm
Qualcomm's CSR8675C-IBBH-R is a CMOS microprocessor circuit in a plastic grid array package. It features surface mount capability with bottom terminal position for easy integration. Ideal for applications requiring high-performance processing in compact form factors.
CY8C21434-24LKXIT
Cypress Semiconductor
CY8C21434-24LKXIT by Cypress is a 32-terminal, CMOS technology Programmable SoC with 5V nominal voltage. It operates b/w -40 to 85 °C and has a max seated height of 0.6mm. Ideal for industrial applications requiring low power consumption and high performance in a compact square package style.
NRF52810-QCAA-R7
NRF52810-QCAA-R7 by Nordic Semiconductor Asa is a 32-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.7V to 3.6V, making it ideal for industrial applications requiring low power consumption and compact design.
NRF52805-CAAA-R
NRF52805-CAAA-R by Nordic Semiconductor Asa is a 28-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.7V to 3.6V. Ideal for applications requiring a compact GRID ARRAY package with very thin profile and fine pitch terminals.
TDA8029HL/C207,151
TDA8029HL/C207,151 by NXP Semiconductors is a MICROPROCESSOR CIRCUIT with 32 terminals in a SQUARE package. It operates b/w -40 to 90 °C and supports power supplies of 1.8/5,3/5 V. Ideal for industrial applications requiring high temperature tolerance and surface mount compatibility.
MIMX8MM1CVTKZAA
The NXP Semiconductors MIMX8MM1CVTKZAA is a low-profile, fine-pitch SoC with 486 terminals. Operating b/w -40 to 105°C, it has a supply voltage range of 0.9-1V and uses CMOS technology. Ideal for applications requiring high performance in compact spaces.
SLB9670XQ20FW740XUMA2
SLB9670XQ20FW740XUMA2 by Infineon Technologies is a cryptographic authenticator IC with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.65V to 1.95V, making it suitable for industrial applications requiring secure authentication processes. This chip carrier package with very thin profile and bottom terminal position is surface mountable, featuring 32 terminals in a square shape measuring 5mm x 5mm.
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XCVP1702-3DSEVSVA3340
XCVP1802-1HSELSVC4072
XCVP1202-2MSEVSVA2785
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Package Equivalence Code: BGA2785,53X53,36;
XCVP1502-1GSIVSVA2785
XCVP1502-3HSEVSVA2785
XCVP1202-1MSEVSVA2785
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Width: 50 mm;
XCVP1202-2MLEVSVA2785
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Minimum Supply Voltage: .775 V;
XCVP1402-1MSEVSVA2785
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Terminal Pitch: .92 mm;
XCVP1402-2DSEVSVA2785
XCVP1502-2MSEVSVA2785
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;
XCVP1702-1MSIVSVA3340
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 3340; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XCVP1802-2MLEVSVA5601
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 5601; Package Code: HBGA; Package Shape: SQUARE; Nominal Supply Voltage: .8 V;
XCVP1002-1MSINFVI1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: BGA; Package Shape: RECTANGULAR; Nominal Supply Voltage: .8 V;
XCVP1002-1LSIVFVF1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Technology: CMOS;
XCVP1002-1MSIVFVF1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XCVP1002-1MSIVSVC2021
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2021; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: .8 V;
XCVP1002-1LSENFVI1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 100 Cel;
XCVP1002-1LSIVSVC2021
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2021; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: .724 V;
XCVP1002-2HSINFVI1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Supply Voltage: .906 V;
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