Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Other Function uPs,uCs & Peripheral ICs XCVP1802-1HSELSVC4072 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx
Peripheral IC Type:
XCVP1802-1HSELSVC4072 Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
SS14
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MBRS340T3G
Onsemi
MBRS340T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 4A. It operates b/w -65°C to 150°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package. The diode's matte tin terminal finish and dual position make it ideal for surface mount PCB designs.
DS18B20Z
Maxim Integrated
DS18B20Z by Maxim Integrated is a 12-bit digital temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Suitable for applications requiring precise temperature monitoring in compact spaces.
RC0402JR-070RL
Yageo
Yageo's RC0402JR-070RL is a SMT fixed resistor with 0 ohm resistance, rated for temperatures from -55 to 155 °C. It features METAL GLAZE/THICK FILM tech, WRAPAROUND terminals, and 0.0625 W power dissipation. Ideal for jumper applications in electronics requiring compact surface mount components.
BAV99LT1G
BAV99LT1G by Onsemi is a series connected diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.006 us and can handle up to 100V repetitive peak reverse voltage. Ideal for rectification applications, this diode operates b/w -65°C to 150°C temperature range.
1N4148
Taiwan Semiconductor
RECTIFIER DIODE; Surface Mount: NO; Peak Reflow Temperature (C): 260; Maximum Operating Temperature: 175 Cel; JESD-609 Code: e3; No. of Elements: 1;
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Non Repetitive Peak Forward Current: 40 A; Technology: SCHOTTKY; No. of Elements: 1;
LL4148
Promax-johnton
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N2222A
Crystalonics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Shanghai Lunsure Electronic Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
AT90CAN128-16AUR
Microchip Technology
AT90CAN128-16AUR by Microchip: 16 MHz clock, 8-bit data RAM, and 131072 ROM words. Ideal for industrial applications with CAN, SPI, TWI connectivity and low power mode. Contains 4 timers, 8 ADC channels, and supports up to 10-bit analog to digital conversion.
BAV99-7-F
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Vishay Intertechnology
Vishay Intertechnology's SS14 is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 1A. Operating at up to 125°C, it has a repetitive peak reverse voltage of 40V. Ideal for surface mount applications, it suits various electronic circuits requiring efficient rectification and low forward voltage drop.
BAV99
Rectron
SMBJ18CA
KYOCERA AVX
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Bytesonic Electronics
Motorola
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Maximum Reverse Recovery Time: .006 us; Maximum Repetitive Peak Reverse Voltage: 70 V; JESD-609 Code: e0;
Surge Components
2N7002
Nte Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .115 A; No. of Terminals: 3;
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
MCIMX6G1CVM05AB
NXP Semiconductors
MCIMX6G1CVM05AB by NXP Semiconductors is a System on Chip with 289 terminals, operating at -40 to 105°C. It features a low profile grid array package style, 0.8mm terminal pitch, and industrial temperature grade. Ideal for applications requiring high performance in compact designs.
LTC4263IDE#PBF
Linear Technology
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 14; Package Code: HVSON; Package Shape: RECTANGULAR;
MIMX8MN6DVTJZAA
The NXP Semiconductors MIMX8MN6DVTJZAA is a low-profile, fine-pitch grid array SoC with 486 terminals. Operating b/w 0-95°C, it has a supply voltage range of 0.95-1.05V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance computing in compact spaces.
EFR32BG22C112F352GM32-C
Silicon Labs
SoC; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: MATTE TIN; Moisture Sensitivity Level (MSL): 2;
ATMXT224S-MAUR
Microchip Technology's ATMXT224S-MAUR is a 56-terminal, CMOS technology capacitive touch screen controller with a supply voltage range of 1.71V to 3.47V. Operating b/w -40°C to 85°C, it is ideal for applications requiring precise touch input control in compact spaces due to its square shape and low seated height of 0.6mm.
CC1312R1F3RGZT
Texas Instruments
The Texas Instruments CC1312R1F3RGZT is a MICROPROCESSOR CIRCUIT with 81920 RAM Bytes. It operates b/w -40 to 85 °C and has a supply voltage range of 1.8V to 3.8V, making it ideal for industrial applications requiring low power consumption and high processing capabilities. The package style is CHIP CARRIER with 48 terminals in a SQUARE shape, suitable for surface mount assembly in compact electronic devices.
MIMXRT1173CVM8A
NXP Semiconductors' MIMXRT1173CVM8A is a low-profile, fine-pitch SoC with 289 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 1.1V to 1.15V. Ideal for applications requiring high-performance uPs and uCs in compact designs.
XCZU4EV-2SFVC784I
Xilinx
XCZU4EV-2SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package with 784 terminals is ideal for industrial applications requiring high performance uPs/uCs.
MCIMX283CVM4BR2
MCIMX283CVM4BR2 by NXP Semiconductors is a System on Chip with 289 terminals, operating at -40 to 85°C. It has a supply voltage range of 1.35-1.8V and peak reflow temperature of 260°C. Ideal for industrial applications requiring low profile, fine pitch packages in a grid array style.
WBZ451PE-I
SoC;
TMS320DM6446AZWTA
TMS320DM6446AZWTA by Texas Instruments is a 32-bit microprocessor with 1.2-3.3V power supplies, 16mm width, and 48-bit external data bus width. Ideal for industrial applications, it features I2C, SPI, UART, USB compatibility and operates in temperatures ranging from -40 to 105°C.
MCIMX6U5DVM10ACR
MCIMX6U5DVM10ACR by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage range of 1.35-1.5 V. Ideal for applications requiring low profile and fine pitch package style in a square shape with 624 terminals.
CY8C6247BZI-D54
Infineon Technologies
CY8C6247BZI-D54 by Infineon Technologies is a 124-terminal, programmable SoC with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.7V to 3.6V, making it suitable for various applications requiring a compact GRID ARRAY package style.
MCIMX6L8DVN10AA
Freescale Semiconductor
SoC; Terminal Form: BALL; No. of Terminals: 432; Package Code: TFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B432;
BGM220PC22WGA2
XCZU7EG-2FFVF1517E
The Xilinx XCZU7EG-2FFVF1517E is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1517 terminals in a GRID ARRAY package style, with a rectangular shape and PLASTIC/EPOXY body material. Operating b/w 0 to 100 °C, it's ideal for applications requiring high performance and low power consumption.
MIMXRT1021CAG4B
SoC; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
XC7Z020-1CLG484I
XC7Z020-1CLG484I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.05V. This low profile chip in grid array package is ideal for various applications requiring high performance and compact design.
XC7Z012S-2CLG485I
XC7Z012S-2CLG485I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 485 terminals in a low profile grid array package, it's ideal for various embedded applications.
MIMX8MM6DVTLZAA
MIMX8MM6DVTLZAA by NXP Semiconductors is a low-profile, fine-pitch SoC with 486 terminals. It operates at a voltage range of 0.95V to 1.05V and can withstand temperatures up to 95°C. This versatile chip is commonly used in various applications requiring high-performance microcontrollers and peripheral ICs.
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XCVP1702-3DSEVSVA3340
XCVP1202-2MSEVSVA2785
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Package Equivalence Code: BGA2785,53X53,36;
XCVP1502-1GSIVSVA2785
XCVP1502-3HSEVSVA2785
XCVP1202-1MSEVSVA2785
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Width: 50 mm;
XCVP1202-2MLEVSVA2785
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Minimum Supply Voltage: .775 V;
XCVP1402-1MSEVSVA2785
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Terminal Pitch: .92 mm;
XCVP1402-2DSEVSVA2785
XCVP1502-2MSEVSVA2785
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;
XCVP1702-1MSIVSVA3340
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 3340; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XCVP1802-2MLEVSVA5601
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 5601; Package Code: HBGA; Package Shape: SQUARE; Nominal Supply Voltage: .8 V;
XCVP1802-3DLILSVC4072
XCVP1002-1MSINFVI1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: BGA; Package Shape: RECTANGULAR; Nominal Supply Voltage: .8 V;
XCVP1002-1LSIVFVF1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Technology: CMOS;
XCVP1002-1MSIVFVF1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XCVP1002-1MSIVSVC2021
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2021; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: .8 V;
XCVP1002-1LSENFVI1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 100 Cel;
XCVP1002-1LSIVSVC2021
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2021; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: .724 V;
XCVP1002-2HSINFVI1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Supply Voltage: .906 V;
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