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XCVP1702-1MSIVSVA3340

Xilinx

XCVP1702-1MSIVSVA3340 by Xilinx

XCVP1702-1MSIVSVA3340 by Xilinx is a MICROPROCESSOR CIRCUIT with 3340 terminals, CMOS technology, and 0.8V nominal voltage. It operates b/w -40 to 110 °C and has a package style of GRID ARRAY. Ideal for applications requiring high-performance microprocessor circuits in compact spaces.

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Overview

Elevate your electronic designs with the XCVP1702-1MSIVSVA3340 by Xilinx, a cutting-edge microprocessor circuit that pushes the boundaries of innovation. Crafted from high-quality materials and utilizing advanced CMOS technology, this peripheral IC offers unparalleled performance and reliability. Whether you're working on IoT devices, robotics, or industrial automation, the XCVP1702-1MSIVSVA3340 is the perfect solution to elevate your projects to the next level. Experience the benefits of seamless integration, enhanced efficiency, and unmatched precision with this exceptional product from Xilinx. Unlock new possibilities and achieve your goals with the XCVP1702-1MSIVSVA3340.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials offer good durability and thermal resistance, making the product suitable for various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing overall production costs.

Maximum Supply Voltage: 0.825 V

The maximum supply voltage of 0.825 V ensures safe operation and prevents damage to the components in the product.

Package Shape: SQUARE

Square packages are easy to handle and integrate into electronic designs, allowing for efficient placement on the PCB.

No. of Terminals: 3340

The high number of terminals allows for a greater number of connections and functionalities within the product.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

The grid array package style with a heat sink/slug design provides effective heat dissipation, improving the overall performance and reliability of the product.

Minimum Supply Voltage: 0.775 V

The minimum supply voltage of 0.775 V ensures stable operation even under low voltage conditions, enhancing the product's reliability.

Maximum Operating Temperature: 110 °C

With a maximum operating temperature of 110°C, the product can withstand higher temperature environments without compromising performance.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures the product can function in extreme cold conditions, broadening its range of applications.

Terminal Position: BOTTOM

Bottom terminal positioning provides ease of connectivity and allows for efficient PCB layout and design.

Maximum Seated Height: 4.48 mm

The maximum seated height of 4.48 mm ensures the product can fit into compact spaces and facilitate dense PCB designs.

Width: 55 mm

The 55 mm width offers a compact form factor, making the product suitable for applications where space is limited.

Length: 55 mm

The 55 mm length provides a balanced aspect ratio, allowing for easy integration into various electronic products and devices.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporating a microprocessor circuit as the peripheral IC type enhances the product's processing capabilities, enabling advanced functionalities and performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form provides reliable connections and easy soldering, ensuring robust electrical connections within the product.

Nominal Supply Voltage: 0.8 V

The nominal supply voltage of 0.8 V offers a balanced operating range, optimizing the product's performance and efficiency.

Terminal Pitch: 0.92 mm

The terminal pitch of 0.92 mm allows for high-density packaging and efficient use of PCB real estate, increasing the product's functionality.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCVP1702-1MSIVSVA3340 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B3340

Length:

55 mm

No. of Terminals:

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA3340,58X58,36

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Maximum Seated Height:

4.48 mm

Maximum Supply Voltage:

.825 V

Minimum Supply Voltage:

.775 V

Nominal Supply Voltage:

.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.92 mm

Terminal Position:

BOTTOM

Width:

55 mm

Peripheral IC Type:

Trade Compliance

XCVP1702-1MSIVSVA3340 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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