Loading...

XCVM1302-2MLINSVF1369

Xilinx

XCVM1302-2MLINSVF1369 by Xilinx

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: HBGA; Package Shape: SQUARE; Width: 35 mm;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 394 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

394

-

-

-

-

VNN

France . 356 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

356

-

-

-

-

Vyrian

USA . 235 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

235

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 840 parts In-Stock

1+ parts

$2.000

100+ parts

-

1k+ parts

-

10k+ parts

-

840

$2.000

-

-

-

AZTECH Wire

Italy . 531 parts In-Stock

1+ parts

$5.014

100+ parts

-

1k+ parts

-

10k+ parts

-

531

$5.014

-

-

-

One Stop Electronics

USA . 324 parts In-Stock

1+ parts

$17.000

100+ parts

-

1k+ parts

-

10k+ parts

-

324

$17.000

-

-

-

Semicontronic

India . 1,553 parts In-Stock

1+ parts

$20.000

100+ parts

$19.500

1k+ parts

$19.400

10k+ parts

-

1,553

$20.000

$19.500

$19.400

-

MARBEL Systems

Belgium . 2,712 parts In-Stock

1+ parts

$24.223

100+ parts

-

1k+ parts

-

10k+ parts

-

2,712

$24.223

-

-

-

Texas Native Microelectronics

USA . 895 parts In-Stock

1+ parts

$27.843

100+ parts

-

1k+ parts

-

10k+ parts

$24.502

895

$27.843

-

-

$24.502

Kenton Components

USA . 28,327 parts In-Stock

1+ parts

$33.412

100+ parts

-

1k+ parts

-

10k+ parts

$29.402

28,327

$33.412

-

-

$29.402

Qasali Group International

UK . 2,364 parts In-Stock

1+ parts

$75.176

100+ parts

-

1k+ parts

-

10k+ parts

$66.155

2,364

$75.176

-

-

$66.155

Microchip USA

USA . 1,346 parts In-Stock

1+ parts

$3,214.925

100+ parts

-

1k+ parts

-

10k+ parts

-

1,346

$3,214.925

-

-

-

Supply Digital

USA . 1,447 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,447

-

-

-

-

Corohmni

South Africa . 391 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

391

-

-

-

-

Corphita

USA . 155 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

155

-

-

-

-

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCVM1302-2MLINSVF1369 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B1369

Length:

35 mm

No. of Terminals:

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA1369,37X37,36

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Maximum Seated Height:

4 mm

Maximum Supply Voltage:

.825 V

Minimum Supply Voltage:

.775 V

Nominal Supply Voltage:

.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.92 mm

Terminal Position:

BOTTOM

Width:

35 mm

Peripheral IC Type:

Trade Compliance

XCVM1302-2MLINSVF1369 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20