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XCKU5P-2FFVA676E

Xilinx

XCKU5P-2FFVA676E by Xilinx

Xilinx XCKU5P-2FFVA676E is a FPGA with 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. It operates b/w -40 to 100°C and has a supply voltage range of 0.825V to 0.876V. Ideal for applications requiring high-speed processing and programmable ICs in compact designs.

Median Price

$2,778.250

Lifecycle Status

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5

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1k+

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Digiode

USA . 412 parts In-Stock

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VNN

France . 125 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Vyrian

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AZTECH Wire

Italy . 195 parts In-Stock

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Modulus Dynamics

Lithuania . 344 parts In-Stock

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MARBEL Systems

Belgium . 5,727 parts In-Stock

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$46.702

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$44.834

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Texas Native Microelectronics

USA . 50 parts In-Stock

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Kenton Components

USA . 2,058 parts In-Stock

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Corohmni

South Africa . 146 parts In-Stock

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Aztec Data Supply Inc.

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One Stop Electronics

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Ampacity Inc.

Singapore . 1 parts In-Stock

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Semicontronic

India . 1 parts In-Stock

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$2,302.472

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$2,290.665

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Corphita

USA . 387 parts In-Stock

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Continental Prestige Electronics

USA . 1,850 parts In-Stock

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$2,722.695

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Argo Parts USA

USA . 544 parts In-Stock

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$2,778.260

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$2,750.477

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$2,722.695

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$2,694.912

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Netroflash

USA . 100 parts In-Stock

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$2,639.347

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$2,583.782

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Microchip USA

USA . 1,424 parts In-Stock

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Qasali Group International

UK . 1,000 parts In-Stock

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Supply Digital

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Vigor

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Overview

Unleash the power of Xilinx's XCKU5P-2FFVA676E Field Programmable Gate Array (FPGA) and experience unparalleled performance and versatility. This cutting-edge FPGA boasts 474,600 logic cells and 27,120 CLBs, making it ideal for a wide range of applications. With a package shape of SQUARE and a form of terminal of BALL, this FPGA offers seamless integration and reliability. Trust in Xilinx's reputation for quality and innovation as you explore the endless possibilities with the XCKU5P-2FFVA676E FPGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides a cost-effective and lightweight packaging solution for the FPGA, making it ideal for portable or weight-sensitive applications.

No. of Logic Cells: 474600

The high number of logic cells allows for complex programmable logic designs to be implemented efficiently and accurately.

Surface Mount: YES

Being surface mountable enables easy and secure attachment of the FPGA to circuit boards, simplifying the assembly process.

Maximum Supply Voltage: 0.876 V

The low maximum supply voltage requirements make the FPGA energy efficient and suitable for applications where power consumption is a concern.

No. of CLBs: 27120

The large number of configurable logic blocks allows for versatile and customizable logic functions to be implemented in the FPGA.

No. of Inputs: 304

With a high number of inputs, the FPGA can handle a large amount of input data and signals, making it suitable for data-intensive applications.

Form Of Terminal: BALL

The ball terminals provide reliable electrical connections and enable easy integration of the FPGA into the overall system.

Nominal Supply Voltage (V): 0.85

The nominal supply voltage stability ensures consistent and reliable performance of the FPGA over its operational range.

No. of Terminals: 676

The high number of terminals allows for versatile connectivity options and interface possibilities with other components in the system.

Minimum Supply Voltage: 0.825 V

The low minimum supply voltage requirement contributes to the energy efficiency and power-saving capabilities of the FPGA.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature tolerance ensures reliable performance in harsh or demanding environmental conditions.

Pitch Of Terminal: 1 mm

The terminal pitch provides a suitable spacing for connections and ensures ease of soldering during the assembly process.

Organization: 27120 CLBS

The well-organized layout of configurable logic blocks enables efficient implementation of complex logic functions and designs.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature tolerance ensures the FPGA can function reliably in a wide range of temperature environments.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of multiple metals for terminal finishing enhances the conductivity, durability, and corrosion resistance of the connections.

Position Of Terminal: BOTTOM

The bottom-mounted terminals facilitate secure and stable integration of the FPGA onto the circuit board, enhancing overall mechanical robustness.

Moisture Sensitivity Level (MSL): 4

The MSL 4 rating indicates the FPGA's moderate sensitivity to moisture, which is suitable for standard handling and storage conditions.

Maximum Seated Height: 3.52 mm

The low maximum seated height enables a compact and slim profile for the FPGA, making it suitable for space-constrained applications.

Width: 27 mm

The moderate width allows for easy integration of the FPGA into various system designs while providing sufficient space for connections.

No. of Outputs: 304

The high number of outputs allows for multiple output signals to be generated simultaneously, enhancing the FPGA's processing capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures the FPGA can withstand temperature variations during the assembly process without compromising functionality.

Peak Reflow Temperature °C: 250

The high peak reflow temperature tolerance ensures the FPGA's reliability and integrity during the soldering process.

Length: 27 mm

The moderate length provides a good balance between compactness and connectivity options for the FPGA, enabling versatile system integration.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU5P-2FFVA676E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

474600

No. of Inputs:

304

No. of Outputs:

304

No. of CLBs:

27120

Organization:

27120 CLBS

Power Characteristics

Nominal Supply Voltage:

0.85

Minimum Supply Voltage:

.825 V

Maximum Supply Voltage:

.876 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

3.52 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Trade Compliance

XCKU5P-2FFVA676E Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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