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XC7A75T-1FTG256C

Xilinx

XC7A75T-1FTG256C by Xilinx

Xilinx XC7A75T-1FTG256C is a FPGA with 75520 logic cells, 5900 CLBs, and max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing like telecommunications, networking, and industrial automation due to its low profile grid array package style.

Median Price

$128.650

Lifecycle Status

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Mouser Electronics

USA . 3 parts In-Stock

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Nova Conductors

Japan . 750 parts In-Stock

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$111.260

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Digiode

USA . 103 parts In-Stock

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VNN

France . 113 parts In-Stock

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$120.040

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Vyrian

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Chip Stock

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LIBRA Elektronik GmbH

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AZTECH Wire

Italy . 633 parts In-Stock

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$17.784

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Aztec Data Supply Inc.

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Corohmni

South Africa . 361 parts In-Stock

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Modulus Dynamics

Lithuania . 803 parts In-Stock

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Vigor

Singapore . 728 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

Singapore . 3 parts In-Stock

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Semicontronic

India . 3 parts In-Stock

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$99.479

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$98.969

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Corphita

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$108.036

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Texas Native Microelectronics

USA . 300 parts In-Stock

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$111.038

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$106.596

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$103.265

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$97.713

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Netroflash

USA . 2,000 parts In-Stock

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$111.260

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$105.697

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$103.472

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Continental Prestige Electronics

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Microchip USA

USA . 1,175 parts In-Stock

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Argo Parts USA

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Kenton Components

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Supply Digital

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MARBEL Systems

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Qasali Group International

UK . 22 parts In-Stock

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Overview

Unlock a world of endless possibilities with the XC7A75T-1FTG256C by Xilinx. As a leader in the field programmable gate array (FPGA) industry, Xilinx delivers top-quality products that cater to a wide range of applications. With 75520 logic cells and 5900 CLBs, this FPGA offers unparalleled flexibility and performance. Whether you're looking to accelerate your data processing, enhance your AI algorithms, or streamline your networking solutions, the XC7A75T-1FTG256C provides the power and versatility you need. Trust Xilinx for cutting-edge technology that brings value and innovation to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this FPGA lightweight and durable.

No. of Logic Cells: 75520

With a large number of logic cells, this FPGA can handle complex designs and calculations efficiently.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation in various electronic devices.

Maximum Supply Voltage: 1.05 V

The lower maximum supply voltage helps in reducing power consumption and heat generation.

No. of CLBs: 5900

The high number of Configurable Logic Blocks provides flexibility and versatility in programming.

No. of Inputs: 300

Having a large number of inputs allows for a wide range of data to be processed simultaneously.

Package Shape: SQUARE

The square shape of the package makes it easier to integrate into electronic circuits and layouts.

Form Of Terminal: BALL

The use of ball terminals simplifies the connection process and ensures a secure fit.

No. of Terminals: 256

Sufficient terminals for connectivity options without overwhelming the user with excessive connections.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array, this product offers flexibility and reconfigurability for various applications.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array style with low profile and fine pitch design allows for high-density mounting and space-saving.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage helps in reducing power consumption and extending battery life.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this FPGA is suitable for demanding environments.

Pitch Of Terminal: 1 mm

The 1mm pitch of terminals ensures compatibility with standard connectors and sockets.

Maximum Combinatorial Delay of a CLB: 1.27 ns

The low delay ensures fast processing speed and efficient operation.

Organization: 5900 CLBS

The organized structure of 5900 CLBs facilitates neat and systematic design implementation.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on terminals enhances conductivity and durability.

Position Of Terminal: BOTTOM

Having terminals at the bottom simplifies PCB layout and routing for efficient circuit design.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, this FPGA can withstand moderate exposure to moisture during handling and storage.

Maximum Seated Height: 1.55 mm

The low seated height makes this FPGA suitable for compact and slim electronic devices.

Width: 17 mm

The compact width allows for space-efficient placement on PCBs and electronic assemblies.

Maximum Clock Frequency: 1098 MHz

With a high maximum clock frequency, this FPGA can handle real-time processing and high-speed applications.

No. of Outputs: 300

Having a large number of outputs enables the FPGA to interface with multiple devices and components.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures proper soldering and reliability during manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the integrity and durability of solder joints during assembly.

Length: 17 mm

The compact length of this FPGA makes it suitable for space-constrained electronic designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A75T-1FTG256C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

75520

No. of Inputs:

300

No. of Outputs:

300

No. of CLBs:

5900

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

1.27 ns

Sub-Category:

Field Programmable Gate Arrays

Organization:

5900 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7A75T-1FTG256C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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