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XC5VLX30T-1FF323C

Xilinx

XC5VLX30T-1FF323C by Xilinx

Xilinx XC5VLX30T-1FF323C FPGA features 30720 logic cells, 2400 CLBs, and 172 inputs/outputs. Ideal for applications requiring high-speed processing and low power consumption in a compact form factor. Operating temperature range of 0-85°C makes it suitable for various industrial and commercial projects.

Median Price

$523.850

Lifecycle Status

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Nova Conductors

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AZTECH Wire

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One Stop Electronics

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Overview

Elevate your projects to the next level with the XC5VLX30T-1FF323C by Xilinx, a leading manufacturer in the field of Field Programmable Gate Arrays (FPGAs). Boasting 30720 logic cells and 2400 CLBs, this FPGA offers unmatched flexibility and performance for a wide range of applications. With a maximum supply voltage of 1.05V and a compact square package design, the XC5VLX30T-1FF323C delivers exceptional value and efficiency to customers looking to optimize their designs. Don't settle for mediocre performance - choose Xilinx for quality you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of strength and heat resistance, making the product durable and reliable.

No. of Logic Cells: 30720

High number of logic cells allow for complex logic operations to be implemented efficiently.

Surface Mount: YES

Surface mount technology makes it easier to integrate the FPGA onto circuit boards, saving space and improving manufacturability.

Maximum Supply Voltage: 1.05 V

Low maximum supply voltage helps in reducing power consumption and heat generation.

No. of CLBs: 2400

Having a high number of Configurable Logic Blocks (CLBs) provides flexibility in defining logic functions.

No. of Inputs: 172

Having a large number of inputs allows for complex input configurations and designs.

Package Shape: SQUARE

Square shape is ideal for efficient use of space on circuit boards.

Power Supplies (V): 1,2.5

Having multiple supply voltages allows for compatibility with different components in the system.

No. of Terminals: 323

Sufficient number of terminals for connecting the FPGA to external components and power sources.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being FPGA, it allows for reconfiguration of logic functions, providing flexibility and versatility.

Package Style (Meter): GRID ARRAY

Grid array package style provides good thermal and electrical properties for reliable performance.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage ensures compatibility with low power systems.

Maximum Operating Temperature: 85 °C

High operating temperature range allows for use in a variety of environments and applications.

Pitch Of Terminal: 1 mm

Standard pitch size makes it easy to integrate the FPGA into existing designs and circuit boards.

Maximum Combinatorial Delay of a CLB: 0.9 ns

Low combinatorial delay ensures fast processing of logic functions, improving overall performance.

Organization: 2400 CLBS

Efficient organization of CLBs allows for easy implementation of complex logic functions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures reliable performance even in cold environments.

Finishing Of Terminal Used: TIN LEAD

Tin lead finishing provides good solderability and connectivity for reliable connections.

Position Of Terminal: BOTTOM

Bottom terminal position makes it easier to mount and connect the FPGA on circuit boards.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates that the product has a low sensitivity to moisture, ensuring long-term reliability.

Maximum Seated Height: 2.85 mm

Low seated height allows for compact and slim designs in electronic systems.

Width: 19 mm

Compact width size allows for efficient use of space on circuit boards.

No. of Outputs: 172

Having a high number of outputs enables the FPGA to drive multiple components and perform complex functions.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time at peak temperature ensures that the FPGA is not subjected to excessive heat stress during assembly.

Peak Reflow Temperature °C: 225

High peak reflow temperature indicates good thermal durability and soldering capability of the FPGA.

Length: 19 mm

Compact length size allows for efficient integration of the FPGA into electronic systems.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC5VLX30T-1FF323C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

30720

No. of Inputs:

172

No. of Outputs:

172

No. of CLBs:

2400

CLB Maximum Delay:

0.9 ns

Sub-Category:

Field Programmable Gate Arrays

Organization:

2400 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

225 °C (437 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

19 mm

Width:

19 mm

Maximum Seated Height:

2.85 mm

Package Equivalence Code:

BGA323,18X18,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1 mm

No. of Terminals:

323

Standards

JESD-30 Code:

S-PBGA-B323

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

XC5VLX30T-1FF323C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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