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XC3SD3400A-5CSG484C

Xilinx

XC3SD3400A-5CSG484C by Xilinx

XC3SD3400A-5CSG484C by Xilinx is a Field Programmable Gate Array (FPGA) with 53,712 logic cells and 3,400,000 equivalent gates. It operates at a max clock frequency of 280 MHz and is commonly used in applications requiring high-speed data processing and programmable logic control.

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$136.071

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Overview

Experience unrivaled performance and versatility with the XC3SD3400A-5CSG484C FPGA by Xilinx. As a leader in the industry, Xilinx delivers cutting-edge solutions that push boundaries and revolutionize technology. With its 53712 logic cells and 5968 CLBs, this FPGA empowers you to tackle complex projects with ease. Whether you're developing advanced communications systems or implementing sophisticated algorithms, this FPGA's 3400000 equivalent gates and maximum clock frequency of 280 MHz ensure seamless operation. Its compact size and surface-mount design make it ideal for space-constrained applications. Trust Xilinx to provide exceptional quality and innovation, and unlock limitless possibilities with the XC3SD3400A-5CSG484C FPGA.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides a lightweight yet durable package for the FPGA, making it suitable for various applications without compromising its structural integrity.

No. of Logic Cells:

53,712 - The high number of logic cells allows for complex digital circuit design and implementation, making the FPGA capable of handling intricate tasks and computations effectively.

Surface Mount:

YES - The surface mount feature allows for easy PCB assembly and integration, making it convenient for manufacturers to incorporate the FPGA into their products.

Maximum Supply Voltage:

1.26 V - With a relatively low maximum supply voltage, the FPGA consumes less power, ensuring energy efficiency and reducing the risk of damage due to excessive voltage.

No. of CLBs:

5,968 - The significant number of configurable logic blocks (CLBs) provides ample resources for designing flexible and scalable digital circuits, enhancing the versatility of the FPGA.

Technology Used:

CMOS - The use of CMOS technology offers low power consumption, high noise immunity, and excellent performance characteristics, making the FPGA suitable for a wide range of applications.

No. of Inputs:

309 - The abundance of input pins allows for the connection and processing of various external signals, increasing the FPGA's capability to handle complex inputs and data streams.

Package Shape:

SQUARE - The square shape of the package simplifies PCB layout and allows for efficient use of space, enabling compact designs and optimizing the overall system size.

Form Of Terminal:

BALL - The ball-shaped terminals provide reliable electrical connections and facilitate easy installation and maintenance, ensuring robust and stable performance of the FPGA.

No. of Equivalent Gates:

3,400,000 - The high number of equivalent gates signifies the FPGA's ability to accommodate large-scale digital designs, allowing for the implementation of complex algorithms and functionalities.

Nominal Supply Voltage (V):

1.2 - The specified nominal supply voltage ensures consistent and stable operation of the FPGA, providing a reliable and predictable performance in various operating conditions.

Power Supplies (V):

1.2, 2.5/3.3 - The multiple power supply options offer flexibility in system design and compatibility with different voltage levels, allowing seamless integration with other components and peripherals.

No. of Terminals:

484 - The numerous terminals provide sufficient input/output options, enabling versatile connectivity and facilitating communication with other devices, enhancing the FPGA's overall functionality.

Programmable IC Type:

FIELD PROGRAMMABLE GATE ARRAY - As a field programmable device, the FPGA allows for customization and flexible functionality, making it suitable for prototyping, testing, and specialized applications.

Package Style (Meter):

GRID ARRAY - The grid array package style ensures secure and robust connections between the FPGA and the PCB, reducing the risk of loose connections and improving reliability.

Minimum Supply Voltage:

1.14 V - The specified minimum supply voltage ensures the FPGA's reliable operation even under low voltage conditions, enhancing its suitability for power-constrained environments.

Maximum Operating Temperature:

85 °C - The FPGA's ability to operate at high temperatures enables its use in demanding environments, ensuring its reliability and performance under challenging conditions.

Pitch Of Terminal:

0.8 mm - The small terminal pitch allows for high-density mounting on PCBs, enabling the creation of compact and space-efficient designs that conserve valuable board space.

Maximum Combinatorial Delay of a CLB:

0.62 ns - The low maximum combinatorial delay of a configurable logic block ensures rapid processing and response times, enhancing the FPGA's overall performance and efficiency.

Organization:

5,968 CLBs, 3,400,000 GATES - The FPGA's organization in terms of CLBs and gates highlights its capacity for complex digital designs and large-scale implementations, making it suitable for advanced applications.

Minimum Operating Temperature:

0 °C - The FPGA's ability to operate at low temperatures allows for reliable performance in cold environments, expanding its suitability for a wide range of applications.

Finishing Of Terminal Used:

TIN SILVER COPPER - The use of tin, silver, and copper finishing on the terminals enhances their conductivity, provides durability, and ensures excellent signal integrity for reliable performance.

Position Of Terminal:

BOTTOM - The positioning of the terminals at the bottom of the FPGA simplifies board layout and routing and optimizes space utilization, facilitating efficient PCB designs.

Moisture Sensitivity Level (MSL):

3 - The moisture sensitivity level indicates the FPGA's tolerance to moisture during storage and assembly, ensuring its reliability and preventing potential damage.

Width:

19 mm - The specified width allows for compact integration of the FPGA into various system designs, providing flexibility in space-constrained applications.

Maximum Clock Frequency:

280 MHz - The high maximum clock frequency capability enables the FPGA to handle fast signal processing and synchronous operations, making it suitable for real-time applications.

No. of Outputs:

249 - The abundance of output pins allows for the generation and transmission of multiple signals simultaneously, enhancing the FPGA's capability to control and interface with various devices.

Maximum Time At Peak Reflow Temperature (s):

30 - The specified maximum time at peak reflow temperature ensures proper solder joint formation during manufacturing, guaranteeing the reliability and durability of the FPGA.

Peak Reflow Temperature °C:

260 - The peak reflow temperature indicates the FPGA's ability to withstand high-temperature soldering processes, ensuring its robustness and longevity.

Length:

19 mm - The specified length allows for compact integration of the FPGA into various system designs, providing flexibility in space-constrained applications.

Grading Of Temperature:

COMMERCIAL EXTENDED - The commercial extended temperature grading ensures the FPGA's reliable operation and performance across a wide temperature range, making it suitable for diverse environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC3SD3400A-5CSG484C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

53712

No. of Inputs:

309

No. of Outputs:

249

No. of CLBs:

5968

No. of Equivalent Gates:

3400000

Maximum Clock Frequency:

280 MHz

CLB Maximum Delay:

0.62 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

5968 CLBS, 3400000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

19 mm

Width:

19 mm

Package Equivalence Code:

BGA484,22X22,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC3SD3400A-5CSG484C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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