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XC3SD3400A-4FGG676I

Xilinx

XC3SD3400A-4FGG676I by Xilinx

Xilinx XC3SD3400A-4FGG676I FPGA features 53712 logic cells, 5968 CLBs, and 3400000 gates. With a max clock frequency of 250 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems. The package style is grid array with a square shape and PLASTIC/EPOXY material.

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$162.510

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Overview

Unlock limitless possibilities with the Xilinx XC3SD3400A-4FGG676I FPGA, a cutting-edge solution for your programmable logic needs. Manufactured by industry leader Xilinx, this FPGA boasts unmatched quality and reliability. With a vast number of logic cells and inputs, it offers unparalleled flexibility for a wide range of applications. From aerospace to telecommunications, this FPGA delivers outstanding performance and efficiency. Experience the power of innovation with the XC3SD3400A-4FGG676I and take your projects to new heights. Elevate your designs with Xilinx today.

Feature Benefit Bullets

No. of Logic Cells: 53712

This FPGA has a high number of logic cells, allowing for complex designs and implementations.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage is within a safe range, ensuring the reliability of the FPGA.

Technology Used: CMOS

CMOS technology is known for its low power consumption and high noise immunity, making this FPGA efficient and reliable.

No. of Equivalent Gates: 3400000

With a high number of equivalent gates, this FPGA can handle large and intricate digital circuits effectively.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature allows this FPGA to function in a variety of environments without overheating.

Maximum Clock Frequency: 250 MHz

The high maximum clock frequency enables fast processing and real-time operation of the FPGA.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this FPGA can withstand moderate exposure to moisture during handling and assembly.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC3SD3400A-4FGG676I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

53712

No. of Inputs:

469

No. of Outputs:

409

No. of CLBs:

5968

No. of Equivalent Gates:

3400000

Maximum Clock Frequency:

250 MHz

CLB Maximum Delay:

0.71 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

5968 CLBS, 3400000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.6 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC3SD3400A-4FGG676I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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