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XC3SD3400A-4CS484I

Xilinx

XC3SD3400A-4CS484I by Xilinx

Xilinx XC3SD3400A-4CS484I FPGA features 53712 logic cells, 5968 CLBs, and 3400000 gates. With a max clock frequency of 250 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems. The device operates at temperatures ranging from -40 to 100°C and supports supply voltages of 1.14V to 1.26V.

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$133.906

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Overview

Unlock the power of advanced technology with the Xilinx XC3SD3400A-4CS484I FPGA. Manufactured by industry leader Xilinx, this high-quality product offers unparalleled performance and reliability. Ideal for a wide range of applications, this FPGA boasts 53712 logic cells and 3400000 equivalent gates, providing customers with endless possibilities for customization and innovation. Experience the benefits of cutting-edge CMOS technology and maximize your project's potential with the Xilinx XC3SD3400A-4CS484I FPGA.

Feature Benefit Bullets

No. of Logic Cells: 53712

The high number of logic cells allows for complex logic functions to be implemented in the FPGA, making it suitable for a wide range of applications.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation, making the FPGA energy-efficient.

Technology Used: CMOS

The CMOS technology used in the FPGA ensures low power consumption, high noise immunity, and compatibility with a wide range of applications.

Maximum Clock Frequency: 250 MHz

The high maximum clock frequency allows for fast operation of the FPGA, making it suitable for real-time applications that require quick response times.

Peak Reflow Temperature °C: 225

The high peak reflow temperature ensures that the FPGA can withstand the soldering process during assembly, making it reliable for manufacturing processes.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC3SD3400A-4CS484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

53712

No. of Inputs:

309

No. of Outputs:

249

No. of CLBs:

5968

No. of Equivalent Gates:

3400000

Maximum Clock Frequency:

250 MHz

CLB Maximum Delay:

0.71 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

5968 CLBS, 3400000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Peak Reflow Temperature:

225 °C (437 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

19 mm

Width:

19 mm

Package Equivalence Code:

BGA484,22X22,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

.8 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

XC3SD3400A-4CS484I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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