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XC3S2000-4FG456C

Xilinx

XC3S2000-4FG456C by Xilinx

The Xilinx XC3S2000-4FG456C is a FPGA with 46080 logic cells, 5120 CLBs, and 2000000 equivalent gates. It operates at a max frequency of 630 MHz and has 333 inputs/outputs. Ideal for applications requiring high-speed processing in fields like telecommunications and industrial automation.

Median Price

$86.305

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Avnet

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AZTECH Wire

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Overview

Unleash the power of cutting-edge technology with the XC3S2000-4FG456C by Xilinx, a leader in Field Programmable Gate Arrays (FPGA). With over 46080 logic cells and 5120 CLBs, this FPGA offers unparalleled performance and versatility for a wide range of applications. From telecommunications to aerospace, this innovative product delivers high-speed processing, low power consumption, and seamless integration. Elevate your projects to new heights with the XC3S2000-4FG456C and experience the quality, reliability, and value that only Xilinx can provide. Upgrade your designs today and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and cost-effective.

No. of Logic Cells: 46080

With a high number of logic cells, this FPGA offers a large amount of programmable logic for complex applications.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage ensures energy efficiency and reduces power consumption.

No. of CLBs: 5120

Having 5120 Configurable Logic Blocks (CLBs) provides flexibility in designing various logic functions.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the FPGA reliable and efficient.

No. of Inputs: 333

Having a high number of inputs allows for a wide range of external signals to be processed by the FPGA.

Package Shape: SQUARE

The square package shape is compact and allows for efficient use of space on a PCB.

Form Of Terminal: BALL

Ball terminals facilitate easy soldering and connection, enhancing the ease of installation and maintenance.

No. of Equivalent Gates: 2000000

With 2 million equivalent gates, this FPGA can accommodate complex digital circuits and algorithms.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2V ensures compatibility with standard voltage levels and power sources.

Power Supplies (V): 1.2,1.2/3.3,2.5

Support for multiple power supply voltages offers flexibility in designing and optimizing power consumption.

No. of Terminals: 456

The high number of terminals allows for versatile connections and interfaces with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a field-programmable device, this FPGA can be reconfigured and updated for different applications, increasing its versatility.

Package Style (Meter): GRID ARRAY

The grid array package style enables dense packing and efficient routing of signals, enhancing performance and reliability.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures stable operation even under low-power conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and performance in demanding environmental conditions.

Pitch Of Terminal: 1 mm

The small pitch of terminals allows for high-density mounting, saving space and enabling compact designs.

Maximum Combinatorial Delay of a CLB: 0.61 ns

The low combinatorial delay of a Configurable Logic Block (CLB) ensures fast processing and minimal signal propagation delay.

Organization: 5120 CLBS, 2000000 GATES

The organized structure of 5120 CLBs and 2 million gates allows for efficient design implementation and logical operations.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable operation even in cold environments.

Finishing Of Terminal Used: TIN LEAD

The use of tin-lead finish on terminals ensures good solderability and reliability of electrical connections.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom facilitates easy PCB layout and installation.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture, requiring standard handling and storage procedures.

Maximum Seated Height: 2.6 mm

The low maximum seated height allows for slim and compact device profiles, suitable for space-constrained applications.

Width: 23 mm

The moderate width of the device allows for efficient placement on PCBs and facilitates routing of signals.

Maximum Clock Frequency: 630 MHz

The high maximum clock frequency of 630 MHz enables fast processing speeds and real-time operation of digital circuits.

No. of Outputs: 333

With 333 outputs, the FPGA can drive multiple external components and interface with various devices simultaneously.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time allowed at peak reflow temperature of 225°C for 30 seconds ensures proper soldering and component integrity.

Peak Reflow Temperature °C: 225

The high peak reflow temperature of 225°C enables reliable soldering and robust mechanical connections.

Length: 23 mm

The moderate length of the device allows for efficient PCB layout and compact system integration.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC3S2000-4FG456C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

46080

No. of Inputs:

333

No. of Outputs:

333

No. of CLBs:

5120

No. of Equivalent Gates:

2000000

Maximum Clock Frequency:

630 MHz

CLB Maximum Delay:

0.61 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

5120 CLBS, 2000000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

225 °C (437 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.6 mm

Package Equivalence Code:

BGA456,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1 mm

No. of Terminals:

456

Standards

JESD-30 Code:

S-PBGA-B456

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

XC3S2000-4FG456C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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