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XC3S1400AN-4FGG484C

Xilinx

XC3S1400AN-4FGG484C by Xilinx

Xilinx XC3S1400AN-4FGG484C FPGA features 25344 logic cells, 2816 CLBs, and 1400000 gates. It operates at a max frequency of 667 MHz and is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

Median Price

$72.140

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Rochester

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Overview

Unlock limitless possibilities with the Xilinx XC3S1400AN-4FGG484C FPGA. Crafted by industry leader Xilinx, this Field Programmable Gate Array boasts 25344 logic cells and 1400000 equivalent gates, delivering unparalleled performance and versatility. Whether you're designing cutting-edge electronics, optimizing signal processing, or enhancing communication systems, this FPGA is the key to unlocking your project's full potential. Experience seamless integration, unmatched reliability, and superior efficiency with the XC3S1400AN-4FGG484C from Xilinx. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components for its durability and reliability, making the FPGA resistant to environmental factors.

No. of Logic Cells: 25344

With a large number of logic cells, this FPGA can handle complex computations and tasks efficiently.

Surface Mount: YES

Surface mount technology makes the FPGA easy to solder onto circuit boards, saving time and effort in the assembly process.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making the FPGA more energy-efficient.

No. of CLBs: 2816

Having a high number of configurable logic blocks allows for flexible implementation of custom logic functions in the FPGA.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the FPGA suitable for a wide range of applications.

No. of Inputs: 375

Having a large number of inputs enables the FPGA to process multiple signals simultaneously, improving overall performance.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a circuit board, making it ideal for compact designs.

Form Of Terminal: BALL

Ball terminals provide a reliable connection between the FPGA and the circuit board, ensuring stable signal transmission.

No. of Equivalent Gates: 1400000

The high number of equivalent gates indicates the FPGA's capability to perform complex logical operations, making it suitable for advanced applications.

Nominal Supply Voltage (V): 1.2

The standard nominal supply voltage ensures compatibility with common power sources, simplifying the integration of the FPGA into various systems.

Power Supplies (V): 1.2,1.2/3.3,3.3

Support for multiple power supply voltages allows for versatile use of the FPGA in different environments and applications.

No. of Terminals: 484

Having a high number of terminals provides more connectivity options, enabling the FPGA to interface with a wide range of external devices.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device, this FPGA offers flexibility in design and prototyping, making it suitable for development and testing purposes.

Package Style (Meter): GRID ARRAY

The grid array package style facilitates easy installation and maintenance of the FPGA on a circuit board, enhancing the overall reliability of the system.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage allows the FPGA to operate efficiently even in low-power scenarios, expanding its range of applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the FPGA can withstand demanding environmental conditions, ensuring reliable performance in harsh environments.

Pitch Of Terminal: 1 mm

The small pitch of terminals simplifies the layout and routing of connections on a circuit board, enabling a more compact and efficient design.

Maximum Combinatorial Delay of a CLB: 0.71 ns

The low combinatorial delay of the configurable logic blocks enhances the FPGA's speed and responsiveness in processing logic functions.

Organization: 2816 CLBS, 1400000 GATES

The organized structure of CLBs and gates ensures systematic implementation of logic functions, optimizing the performance and usability of the FPGA.

Minimum Operating Temperature: 0 °C

The wide temperature range from 0°C ensures the FPGA can operate efficiently in a variety of environments, from industrial to consumer electronics applications.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom simplifies the installation and soldering process, making it easier to integrate the FPGA into a circuit board.

Maximum Seated Height: 2.6 mm

The low seated height of the FPGA enables the device to be used in slim and compact designs, enhancing the versatility and flexibility of the product.

Width: 23 mm

The compact width of the FPGA allows for space-efficient integration into various electronic systems, making it suitable for applications with size constraints.

Maximum Clock Frequency: 667 MHz

With a high maximum clock frequency, the FPGA can process data at a rapid pace, enabling real-time computation and high-speed applications.

No. of Outputs: 288

Having a high number of outputs allows the FPGA to drive multiple external devices simultaneously, expanding its capabilities for controlling complex systems.

Length: 23 mm

The compact length of the FPGA contributes to a small overall footprint on a circuit board, making it ideal for space-constrained applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC3S1400AN-4FGG484C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

25344

No. of Inputs:

375

No. of Outputs:

288

No. of CLBs:

2816

No. of Equivalent Gates:

1400000

Maximum Clock Frequency:

667 MHz

CLB Maximum Delay:

0.71 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

2816 CLBS, 1400000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.6 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Qualified:

No

Trade Compliance

XC3S1400AN-4FGG484C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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