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XC3S100E-4VQG100C

Xilinx

XC3S100E-4VQG100C by Xilinx

XC3S100E-4VQG100C by Xilinx is a Field Programmable Gate Array (FPGA) with 2160 logic cells, 240 CLBs, and a max clock frequency of 572 MHz. It is used for applications requiring high-speed data processing and programmable logic capabilities.

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$38.950

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Advanced Electronics

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Texas Native Microelectronics

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Overview

Experience the power of the XC3S100E-4VQG100C by Xilinx, a leader in Field Programmable Gate Arrays (FPGAs). With its advanced CMOS technology and 2160 logic cells, this FPGA offers unmatched performance for a wide range of applications. Whether you're designing complex circuits or implementing sophisticated algorithms, this product delivers outstanding results. Its compact square package and gull wing terminals make it easy to integrate into any project. Plus, with a maximum clock frequency of 572 MHz and 100000 equivalent gates, you can be confident in the speed and scalability of your designs. Unlock endless possibilities with the XC3S100E-4VQG100C from Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this FPGA product lightweight and durable, ideal for portable and rugged applications.

No. of Logic Cells: 2160

With a high number of logic cells, this FPGA can handle complex digital designs and applications efficiently, providing ample resources for implementing advanced functionalities.

Surface Mount: YES

The surface mount feature enables easier and more convenient integration of the FPGA onto PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.26 V

The ability to operate at a higher supply voltage of 1.26 V allows the FPGA to handle power-hungry applications while maintaining stability and performance.

No. of CLBs: 240

The FPGA's 240 Configurable Logic Blocks (CLBs) offer flexibility in designing custom logic circuits, making it suitable for a wide range of applications that require reconfigurability.

Technology Used: CMOS

Utilizing Complementary Metal-Oxide-Semiconductor (CMOS) technology, this FPGA ensures low power consumption, high-speed operation, and excellent noise immunity, making it an efficient choice for power-sensitive applications.

No. of Inputs: 66

With a generous number of inputs, this FPGA can interface with multiple peripheral devices and sensors, enabling versatile connectivity options for various system requirements.

Package Shape: SQUARE

The square package shape facilitates easier PCB layout and routing, optimizing space utilization and allowing for more efficient system design.

Form Of Terminal: GULL WING

The gull wing form of terminals simplifies the soldering process during assembly, ensuring secure connections and reliable electrical performance.

No. of Equivalent Gates: 100000

Providing an impressive number of equivalent gates, this FPGA offers extensive gate-level functionality, enabling the implementation of complex digital designs in a single device.

Nominal Supply Voltage (V): 1.2

Operating at a nominal supply voltage of 1.2 V, this FPGA achieves a balance between power consumption and performance, making it suitable for a wide range of applications.

Power Supplies (V): 1.2, 1.2/3.3, 2.5

Supporting multiple power supply options, including 1.2 V, 1.2/3.3 V, and 2.5 V, this FPGA provides compatibility with various system-level voltage requirements.

No. of Terminals: 100

With 100 terminals, this FPGA offers sufficient connectivity for interfacing with external components and integrating into larger system architectures.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable gate array, this IC offers the advantage of reconfigurability, allowing users to modify its functionality even after manufacturing, making it adaptable to evolving project needs.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

Featuring a flatpack, thin profile, and fine pitch package style, this FPGA facilitates high-density integration, making it suitable for miniaturized electronic devices and space-constrained applications.

Minimum Supply Voltage: 1.14 V

Capable of operating at a minimum supply voltage of 1.14 V, this FPGA ensures compatibility with low-power systems while maintaining reliable performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this FPGA can withstand higher environmental temperatures, making it reliable for operation in harsh conditions.

Pitch Of Terminal: 0.5 mm

The 0.5 mm terminal pitch enables tight spacing between terminals, allowing for more compact PCB designs and greater integration efficiency.

Maximum Combinatorial Delay of a CLB: 0.76 ns

With a maximum combinatorial delay of only 0.76 ns, this FPGA offers fast and efficient logic processing, ensuring quick response times in critical applications.

Organization: 240 CLBS, 100000 GATES

Built with an organization of 240 Configurable Logic Blocks (CLBs) and 100,000 gates, this FPGA provides an ideal balance of configurability and gate-level complexity, making it suitable for various digital design requirements.

Minimum Operating Temperature: 0 °C

Operating reliably even at a minimum temperature of 0°C, this FPGA is suitable for a wide range of environmental conditions, ensuring versatility and robustness.

Finishing Of Terminal Used: MATTE TIN

The use of a matte tin finish on the terminals ensures good solderability, preventing issues such as solder bridging or poor electrical contacts during assembly.

Position Of Terminal: QUAD

With terminals positioned in a quad arrangement, this FPGA allows for efficient routing and soldering, simplifying the PCB layout process.

Moisture Sensitivity Level (MSL): 3

Having an MSL of 3 indicates that this FPGA can withstand moderately humid environments during storage and assembly, ensuring proper functionality.

Maximum Seated Height: 1.2 mm

With a maximum seated height of 1.2 mm, this FPGA remains low-profile, contributing to space-efficient designs in applications where height restrictions exist.

Width: 14 mm

The 14 mm width of this FPGA makes it physically compact, enabling it to fit into tight spaces and enhancing flexibility during system integration.

Maximum Clock Frequency: 572 MHz

Capable of achieving a maximum clock frequency of 572 MHz, this FPGA offers high-speed operation, ensuring efficient processing in applications with stringent timing requirements.

No. of Outputs: 59

Featuring 59 outputs, this FPGA enables connection to multiple devices or subsystems, facilitating versatile system integration and data distribution.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand a peak reflow temperature for up to 30 seconds ensures the FPGA's reliability during the soldering process, reducing the risk of damage or performance degradation.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this FPGA can withstand the extreme temperatures involved in the soldering process, assuring proper assembly and robustness.

Length: 14 mm

The 14 mm length of this FPGA contributes to its compact footprint, allowing for efficient utilization of board space in space-constrained applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC3S100E-4VQG100C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

2160

No. of Inputs:

66

No. of Outputs:

59

No. of CLBs:

240

No. of Equivalent Gates:

100000

Maximum Clock Frequency:

572 MHz

CLB Maximum Delay:

0.76 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

240 CLBS, 100000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Flatpack, Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

14 mm

Width:

14 mm

Maximum Seated Height:

1.2 mm

Package Equivalence Code:

TQFP100,.63SQ

Terminal Characteristcs

Terminal Position:

Quad

Terminal Style:

Terminal Finish:

Matte Tin

Terminal Pitch:

.5 mm

No. of Terminals:

100

Standards

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Qualified:

No

Trade Compliance

XC3S100E-4VQG100C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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