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XMS432P401RIRGCT

Texas Instruments

XMS432P401RIRGCT by Texas Instruments

XMS432P401RIRGCT by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 48 MHz, offering 14-Ch 14-Bit ADC channels and PWM channels for various industrial applications. With connectivity options like I2C, IRDA, SCI(6), SPI(2), UART, it provides versatile peripheral support.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,462 parts In-Stock

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7,462

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Digiode

USA . 786 parts In-Stock

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786

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Distributors (Availability)

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AZTECH Wire

Italy . 564 parts In-Stock

1+ parts

$5.954

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564

$5.954

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One Stop Electronics

USA . 1,100 parts In-Stock

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$16.000

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$16.000

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Parana Technologies

USA . 1,304 parts In-Stock

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$50.532

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$50.532

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ChromeModa Solutions

Germany . 2,066 parts In-Stock

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$56.778

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$46.558

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2,066

$56.778

$46.558

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IDEA Electronic Components Group

UK . 1,334 parts In-Stock

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$56.778

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$53.939

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$51.100

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1,334

$56.778

$53.939

$51.100

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DigiPath Technology Company

USA . 1,948 parts In-Stock

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$51.191

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Corphita

USA . 869 parts In-Stock

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869

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Microchip USA

USA . 403 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the XMS432P401RIRGCT by Texas Instruments! As a leader in microcontrollers, Texas Instruments delivers unparalleled quality and reliability. This versatile microcontroller boasts a wide range of applications, from industrial automation to consumer electronics. With advanced features like 14-bit ADC channels, PWM capability, and multiple connectivity options, this product offers exceptional value and performance. Upgrade your projects with the XMS432P401RIRGCT and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material makes the package durable and reliable, suitable for a variety of applications.

Maximum Supply Voltage: 3.7 V

Allows for flexibility in power supply options and compatibility with a wide range of voltage sources.

Bit Size: 32

32-bit architecture provides enhanced processing power and performance for complex tasks.

ADC Channels: YES

Ability to perform analog to digital conversion expands the range of sensors and devices that can be interfaced with the microcontroller.

Maximum Clock Frequency: 48 MHz

High clock frequency allows for fast execution of instructions, improving overall efficiency and responsiveness.

RAM Bytes: 65536

Large RAM capacity enables storage of extensive data for processing, making it suitable for memory-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller efficient and reliable.

Analog To Digital Convertors: 14-Ch 14-Bit

Multiple analog to digital converters with 14-bit resolution provide accurate and precise conversion of analog signals, essential for sensor interfacing.

Connectivity: I2C, IRDA, SCI(6), SPI(2), UART

Versatile connectivity options allow for easy integration with various communication protocols and devices, enhancing the microcontroller's usability.

ROM Programmability: FLASH

Flash programmable ROM enables easy and convenient reprogramming of the microcontroller, facilitating updates and modifications to the firmware.

Technical Specifications

Microcontrollers XMS432P401RIRGCT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

Length:

9 mm

No. of I/O Lines:

48

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.7 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, SCI(6), SPI(2), UART

Peripherals:

COMPARATOR(2), DMA(8), RTC, TIMER(6), WDT

Analog To Digital Convertors:

14-Ch 14-Bit

Trade Compliance

XMS432P401RIRGCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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