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XIO2213AZAY

Texas Instruments

XIO2213AZAY by Texas Instruments

XIO2213AZAY by Texas Instruments is a bus controller with 167 terminals, operating at 0-70°C. It supports data transfer rates up to 122.88 MBps and clock frequencies up to 98.304 MHz. Ideal for PCI applications requiring IEEE 1394/1394A drive interfaces in commercial-grade environments.

Median Price

$21.738

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,479 parts In-Stock

1+ parts

-

100+ parts

$17.390

1k+ parts

$15.560

10k+ parts

$14.640

6,479

-

$17.390

$15.560

$14.640

DigiKey

USA . 6,479 parts In-Stock

1+ parts

-

100+ parts

$22.880

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-

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6,479

-

$22.880

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Verical

USA . 4,605 parts In-Stock

1+ parts

-

100+ parts

$21.738

1k+ parts

$19.450

10k+ parts

$18.300

4,605

-

$21.738

$19.450

$18.300

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,255 parts In-Stock

1+ parts

$15.960

100+ parts

-

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1,255

$15.960

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DigiKey Marketplace

USA . 6,799 parts In-Stock

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6,799

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Vyrian

USA . 4,951 parts In-Stock

1+ parts

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4,951

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LIBRA Elektronik GmbH

Germany . 190 parts In-Stock

1+ parts

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190

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Connector Distribution Corp

USA . 100 parts In-Stock

1+ parts

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100

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Right Parts Inc.

USA . 100 parts In-Stock

1+ parts

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100

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Flip Electronics

USA . 22 parts In-Stock

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22

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,302 parts In-Stock

1+ parts

$15.120

100+ parts

-

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2,302

$15.120

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Corohmni

South Africa . 51 parts In-Stock

1+ parts

$39.233

100+ parts

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51

$39.233

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Microchip USA

USA . 1,163 parts In-Stock

1+ parts

$48.920

100+ parts

$48.220

1k+ parts

$47.870

10k+ parts

$47.520

1,163

$48.920

$48.220

$47.870

$47.520

Parana Technologies

USA . 344 parts In-Stock

1+ parts

$58.007

100+ parts

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344

$58.007

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DigiPath Technology Company

USA . 244 parts In-Stock

1+ parts

$63.872

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244

$63.872

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ChromeModa Solutions

Germany . 1,398 parts In-Stock

1+ parts

$65.176

100+ parts

$53.444

1k+ parts

-

10k+ parts

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1,398

$65.176

$53.444

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IDEA Electronic Components Group

UK . 842 parts In-Stock

1+ parts

$65.176

100+ parts

$61.917

1k+ parts

$58.658

10k+ parts

-

842

$65.176

$61.917

$58.658

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A-Z Elektronik GmbH

Germany . 1,587 parts In-Stock

1+ parts

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1,587

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Kepictronics

USA . 267 parts In-Stock

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267

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Overview

Enhance your system's performance with the XIO2213AZAY by Texas Instruments, a top-of-the-line bus controller designed to optimize data transfer rates and streamline connectivity. Crafted with precision and expertise by Texas Instruments, this innovative product offers unparalleled reliability and efficiency. Ideal for applications requiring high-speed data transfer, the XIO2213AZAY provides seamless integration and exceptional value for customers seeking cutting-edge technology. Upgrade your system today and experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications without adding excessive weight.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 1.65 V

Operating within a low maximum supply voltage helps in minimizing power consumption and heat generation.

Package Shape: SQUARE

Square package shape aids in uniform distribution of components on a circuit board, optimizing space utilization.

Power Supplies (V): 1.5,3.3

Support for multiple power supply voltages allows flexibility in system design and compatibility with different devices.

No. of Terminals: 167

Having a high number of terminals enables connectivity with various other components and peripherals, enhancing versatility.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This package style offers a compact design, making it suitable for space-constrained applications and facilitating high-density mounting.

Minimum Supply Voltage: 1.35 V

Operating at a low minimum supply voltage ensures efficient power usage and extends the product's battery life.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand demanding environmental conditions, ensuring reliability in various applications.

Maximum Data Transfer Rate: 122.88 MBps

High data transfer rate facilitates swift communication between devices, improving overall system performance.

Minimum Operating Temperature: 0 °C

Operating at a low minimum temperature allows the product to function effectively even in cold environments, enhancing its versatility.

Terminal Finish: TIN SILVER COPPER

The use of these materials for terminal finish ensures good conductivity, corrosion resistance, and durability for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies the installation process and helps in achieving a more compact overall design.

Maximum Seated Height: 1.19 mm

Low seated height provides a slim profile, ideal for applications where space is limited and height constraints must be met.

Width: 12 mm

A moderate width allows for easy integration into various system configurations while maintaining a balanced form factor.

External Data Bus Width: 8

An external data bus width of 8 bits enables efficient data transmission and compatibility with a wide range of devices and protocols.

Maximum Clock Frequency: 98.304 MHz

High clock frequency supports fast data processing and communication, improving overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

Optimal reflow temperature and time parameters ensure proper soldering during assembly, guaranteeing the product's reliability.

Peak Reflow Temperature °C: 260

Soldering at a high peak reflow temperature ensures secure and reliable connections, essential for the product's functionality.

Length: 12 mm

With a moderate length, the product can be easily accommodated in various system layouts while maintaining a compact footprint.

Temperature Grade: COMMERCIAL

Designed for commercial use, this product meets industry standards for reliability and performance in typical operating conditions.

Peripheral IC Type: BUS CONTROLLER, PCI

Being a bus controller with PCI interface, the product enables efficient data transfer and communication between different peripheral devices.

Technology: CMOS

Utilizing CMOS technology delivers low power consumption, high noise immunity, and fast operation, enhancing the product's efficiency.

Terminal Form: BALL

Ball terminals offer reliable connections and simplify the mounting process, ensuring secure integration into the system.

Nominal Supply Voltage: 1.5 V

Operating at a nominal supply voltage of 1.5 V ensures compatibility with standard power sources and optimized performance.

Terminal Pitch: 0.8 mm

With a fine terminal pitch, the product allows for dense packing of terminals, enabling high-density interconnection in a compact space.

Moisture Sensitivity Level (MSL): 3

Having a moderate MSL rating indicates the product's ability to withstand typical levels of moisture exposure during handling and storage.

Drive Interface Standard: IEEE 1394; IEEE 1394A

Support for IEEE 1394 drive interface standards ensures compatibility with various devices and protocols for seamless data transfer.

Technical Specifications

Bus Controllers XIO2213AZAY attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Additional Features:

IT ALSO NEED 3.3V I/O NOMINAL SUPPLY

Address Bus Width:

0

Maximum Clock Frequency:

98.304 MHz

Maximum Data Transfer Rate:

122.88 MBps

Drive Interface Standard:

IEEE 1394; IEEE 1394A

External Data Bus Width:

8

JESD-30 Code:

S-PBGA-B167

JESD-609 Code:

e1

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

167

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA167,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.19 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

XIO2213AZAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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