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CY7C65213A-32LTXI

Infineon Technologies

CY7C65213A-32LTXI by Infineon Technologies

CY7C65213A-32LTXI by Infineon: 5.25V max supply, 1.5 MBps data rate, -40 to 85°C temp range. Ideal for industrial applications requiring UART, RS232/422/485 interfaces and USB bus compatibility.

Median Price

$3.005

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 4,883 parts In-Stock

1+ parts

$2.830

100+ parts

$1.760

1k+ parts

$1.590

10k+ parts

-

4,883

$2.830

$1.760

$1.590

-

Mouser Electronics

USA . 2,897 parts In-Stock

1+ parts

$3.180

100+ parts

$1.960

1k+ parts

$1.730

10k+ parts

-

2,897

$3.180

$1.960

$1.730

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Farnell

UK . 100 parts In-Stock

1+ parts

$3.704

100+ parts

$2.301

1k+ parts

$1.770

10k+ parts

-

100

$3.704

$2.301

$1.770

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DigiKey

USA . 2,909 parts In-Stock

1+ parts

$4.010

100+ parts

$2.483

1k+ parts

$2.210

10k+ parts

$2.129

2,909

$4.010

$2.483

$2.210

$2.129

Element14

Singapore . 77 parts In-Stock

1+ parts

$4.280

100+ parts

$2.520

1k+ parts

$2.400

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-

77

$4.280

$2.520

$2.400

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Rochester

USA . 3,188 parts In-Stock

1+ parts

-

100+ parts

$1.520

1k+ parts

$1.360

10k+ parts

$1.280

3,188

-

$1.520

$1.360

$1.280

Verical

USA . 1,653 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.700

10k+ parts

$1.600

1,653

-

-

$1.700

$1.600

RS (Exports)

UK . 490 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.073

10k+ parts

-

490

-

-

$2.073

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 551 parts In-Stock

1+ parts

$1.606

100+ parts

-

1k+ parts

-

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551

$1.606

-

-

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$2.330

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-

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50

$2.330

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Vyrian

USA . 1,283 parts In-Stock

1+ parts

-

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1,283

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Flip Electronics

USA . 821 parts In-Stock

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821

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 796 parts In-Stock

1+ parts

$0.820

100+ parts

$0.787

1k+ parts

$0.754

10k+ parts

-

796

$0.820

$0.787

$0.754

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Corohmni

South Africa . 470 parts In-Stock

1+ parts

$0.820

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470

$0.820

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Semicontronic

India . 1,431 parts In-Stock

1+ parts

$1.440

100+ parts

$1.404

1k+ parts

$1.397

10k+ parts

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1,431

$1.440

$1.404

$1.397

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Ampacity Inc.

Singapore . 1,241 parts In-Stock

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$1.440

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$1.440

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Corphita

USA . 934 parts In-Stock

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$1.521

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934

$1.521

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Continental Prestige Electronics

USA . 4,966 parts In-Stock

1+ parts

$2.330

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$2.283

4,966

$2.330

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-

$2.283

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$2.330

100+ parts

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1k+ parts

$2.213

10k+ parts

$2.167

1,000

$2.330

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$2.213

$2.167

Argo Parts USA

USA . 738 parts In-Stock

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$2.330

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$2.330

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Aztec Data Supply Inc.

USA . 19,370 parts In-Stock

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$14.800

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19,370

$14.800

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Overview

Upgrade your bus controller game with the cutting-edge CY7C65213A-32LTXI by Infineon Technologies. Trusted for its top-notch quality, this chip carrier boasts a very thin profile and a nickel palladium gold terminal finish. With a maximum data transfer rate of 1.5 MBps and compatibility with UART and VBUS, this industrial-grade device offers seamless integration for RS232, RS422, and RS485 drive interfaces. Elevate your applications with enhanced performance, reliability, and efficiency - all at an unbeatable value that only Infineon Technologies can provide.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and convenient installation onto PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 5.25 V

Can handle high supply voltages, providing flexibility and compatibility with various systems.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and easier placement in designs.

No. of Terminals: 32

Sufficient number of terminals for connectivity and communication within a system.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design ensures effective heat dissipation and space-saving capabilities.

Minimum Supply Voltage: 4.35 V

Wide range of supply voltage tolerance allows for operation in different voltage environments.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in harsh industrial conditions.

Maximum Data Transfer Rate: 1.5 MBps

High data transfer rate enables fast and efficient communication between connected devices.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish offers excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

Quad terminal position provides stability and secure connection within the system.

Maximum Seated Height: 1 mm

Low seated height allows for compact and slim design solutions.

Width: 5 mm

Compact width dimension enables easy integration into various system layouts.

Length: 5 mm

Optimal length dimension for space-saving and efficient board placement.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability and performance in rugged industrial environments.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Supports bus controller and universal serial bus peripherals for versatile connectivity options.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: NO LEAD

No lead terminal form for environmentally friendly and RoHS-compliant design.

Maximum Supply Current: 18 mA

Low supply current requirement for energy-efficient operation.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage for consistent and reliable performance.

Bus Compatibility: UART; VBUS

Compatible with UART and VBUS bus systems for seamless integration.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact design and high-density PCB layouts.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, suitable for standard solder reflow processes.

Drive Interface Standard: RS232; RS422; RS485

Supports multiple drive interface standards for versatile connectivity options.

Technical Specifications

Bus Controllers CY7C65213A-32LTXI attributes and parameters. Explore more Bus Controllers devices from Infineon Technologies

Specs

Additional Features:

ALSO OPERATES AT 3.3 V TYP

Bus Compatibility:

UART; VBUS

Maximum Data Transfer Rate:

1.5 MBps

Drive Interface Standard:

RS232; RS422; RS485

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.35 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

CY7C65213A-32LTXI Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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