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XIO2200AZHH

Texas Instruments

XIO2200AZHH by Texas Instruments

XIO2200AZHH by Texas Instruments is a bus controller IC with 176 terminals, operating at 100 MHz clock frequency. It supports PCI bus compatibility and IEEE1394 drive interface standard. This low-profile, fine-pitch package is ideal for commercial applications requiring a max supply voltage of 1.65 V and operating temperature range of 0-70°C.

Median Price

$12.700

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 21 parts In-Stock

1+ parts

$12.700

100+ parts

$11.940

1k+ parts

$10.800

10k+ parts

-

21

$12.700

$11.940

$10.800

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 352 parts In-Stock

1+ parts

$12.065

100+ parts

-

1k+ parts

-

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352

$12.065

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Vyrian

USA . 3,536 parts In-Stock

1+ parts

-

100+ parts

-

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3,536

-

-

-

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 17 parts In-Stock

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-

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17

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,191 parts In-Stock

1+ parts

$11.430

100+ parts

-

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2,191

$11.430

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Parana Technologies

USA . 1,836 parts In-Stock

1+ parts

$14.276

100+ parts

-

1k+ parts

$14.729

10k+ parts

-

1,836

$14.276

-

$14.729

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Corohmni

South Africa . 1,957 parts In-Stock

1+ parts

$14.930

100+ parts

-

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10k+ parts

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1,957

$14.930

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DigiPath Technology Company

USA . 1,662 parts In-Stock

1+ parts

$15.719

100+ parts

$14.462

1k+ parts

-

10k+ parts

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1,662

$15.719

$14.462

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ChromeModa Solutions

Germany . 3,048 parts In-Stock

1+ parts

$16.040

100+ parts

$13.153

1k+ parts

-

10k+ parts

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3,048

$16.040

$13.153

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IDEA Electronic Components Group

UK . 1,208 parts In-Stock

1+ parts

$16.040

100+ parts

$15.238

1k+ parts

$14.436

10k+ parts

-

1,208

$16.040

$15.238

$14.436

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AZTECH Wire

Italy . 755 parts In-Stock

1+ parts

$19.390

100+ parts

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755

$19.390

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Microchip USA

USA . 462 parts In-Stock

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462

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Kepictronics

USA . 70 parts In-Stock

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70

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Perfect Parts

USA . 44 parts In-Stock

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44

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Overview

Unlock seamless bus control with the XIO2200AZHH by Texas Instruments. Crafted with precision and quality, this PCI bus controller is designed to elevate your system's performance. From its low-profile package shape to its advanced technology, this component delivers reliability and efficiency like no other. Whether you're looking to enhance networking capabilities or streamline data transfers, the XIO2200AZHH offers unmatched value and benefits for your applications. Upgrade your setup today and experience the Texas Instruments advantage firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are lightweight and durable, making the product robust and easy to handle.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on PCBs.

Maximum Supply Voltage: 1.65 V

Operating within a low voltage range helps in reducing power consumption and increasing efficiency.

Package Shape: SQUARE

Square shape provides uniformity in mounting and design layout.

Power Supplies (V): 1.5,3.3

Support for multiple power supply voltages ensures compatibility with various systems and applications.

No. of Terminals: 176

Having a high number of terminals allows for multiple connection options and improved functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array and low profile design with fine pitch make the product suitable for compact and high-density applications.

Minimum Supply Voltage: 1.35 V

Operating at a low minimum supply voltage contributes to energy efficiency and reliability.

Maximum Operating Temperature: 70 °C

With a high operating temperature range, the product can withstand thermal stress and operate efficiently in various environments.

Minimum Operating Temperature: 0 °C

Being able to operate at low temperatures ensures the product's functionality in extreme or cold conditions.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finish enhances conductivity, corrosion resistance, and solderability.

Terminal Position: BOTTOM

Bottom terminal position enables easy accessibility and efficient heat dissipation.

Maximum Seated Height: 1.4 mm

Low seated height makes the product suitable for slim and compact designs.

Width: 15 mm

Standard width allows for easy integration into various system configurations.

Maximum Clock Frequency: 100 MHz

High clock frequency supports fast data processing and communication within the system.

Maximum Time At Peak Reflow Temperature (s): 30

Optimal time at peak reflow temperature ensures proper soldering and reliability during the manufacturing process.

Peak Reflow Temperature °C: 260

High peak reflow temperature enables secure and consistent solder joints during assembly.

Length: 15 mm

Compact length helps in saving space and accommodating the product in limited areas.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures stable operation in standard temperature conditions.

Peripheral IC Type: BUS CONTROLLER, PCI

Being a bus controller for PCI systems makes the product essential for managing data flow efficiently in computer systems.

Technology: CMOS

CMOS technology offers low power consumption, high-speed operations, and integration capabilities.

Terminal Form: BALL

Ball terminal form provides better electrical performance and mechanical strength during operation.

Nominal Supply Voltage: 1.5 V

Stable nominal supply voltage ensures consistent performance and reliability.

Bus Compatibility: PCI

PCI bus compatibility ensures seamless integration with standard computer systems and peripherals.

Terminal Pitch: 0.8 mm

Compact terminal pitch allows for high-density mounting and connectivity options.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, requiring standard handling and storage procedures.

Drive Interface Standard: IEEE1394; IEEE1394A

Support for IEEE1394 drive interfaces enables high-speed data transfer and connectivity with compatible devices.

Technical Specifications

Bus Controllers XIO2200AZHH attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Bus Compatibility:

PCI

Maximum Clock Frequency:

100 MHz

Drive Interface Standard:

IEEE1394; IEEE1394A

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B175

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

176

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA175,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

XIO2200AZHH Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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