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XAM62A34ASMHAAMB

Texas Instruments

XAM62A34ASMHAAMB by Texas Instruments

XAM62A34ASMHAAMB by Texas Instruments is a SoC peripheral IC with CMOS technology. It features 484 terminals in a grid array, fine pitch package style. Operating b/w -40 to 105 °C, it has a supply voltage range of 0.715V to 0.79V. Ideal for applications requiring high-density integration and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,728 parts In-Stock

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Digiode

USA . 2,517 parts In-Stock

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One Stop Electronics

USA . 723 parts In-Stock

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$2.000

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723

$2.000

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AZTECH Wire

Italy . 349 parts In-Stock

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$17.627

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Ampacity Inc.

Singapore . 1,464 parts In-Stock

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$35.000

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$35.000

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Semicontronic

India . 1,254 parts In-Stock

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$35.000

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$34.125

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$33.950

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$33.950

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Corphita

USA . 2,086 parts In-Stock

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Corohmni

South Africa . 171 parts In-Stock

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Overview

Experience unparalleled quality and innovation with the XAM62A34ASMHAAMB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge solutions for a wide range of applications. This product, belonging to the Other Function uPs,uCs & Peripheral ICs category, offers unmatched value and performance. With a package style of GRID ARRAY, FINE PITCH and advanced CMOS technology, this SoC peripheral IC is designed to exceed expectations. Trust Texas Instruments to provide top-of-the-line products that meet your needs and elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, ensuring the longevity of the product.

Surface Mount: YES

Facilitates easy and efficient installation on PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 0.79 V

Allows for safe operation within specified voltage limits, reducing risk of damage to the product.

Package Shape: SQUARE

Optimizes space utilization on PCBs, making it suitable for compact electronic devices.

No. of Terminals: 484

Provides a high level of connectivity options, enabling versatile functionality in various applications.

Package Style (Meter): GRID ARRAY, FINE PITCH

Enhances electrical performance and reliability by reducing signal interference and crosstalk.

Minimum Supply Voltage: 0.715 V

Ensures stable operation even at lower voltage levels, increasing compatibility with different power sources.

Maximum Operating Temperature: 105 °C

Allows the product to withstand high temperatures, making it suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

Ensures reliable performance in extreme cold environments, enhancing overall product durability.

Terminal Position: BOTTOM

Facilitates easy connections and soldering during assembly, improving overall product reliability.

Maximum Seated Height: 2.556 mm

Enables a low-profile design, essential for space-constrained applications and compact electronic devices.

Width: 18 mm

Provides a compact form factor, suitable for applications where space is a constraint.

Length: 18 mm

Optimizes space utilization on PCBs, making it suitable for small electronic devices and compact designs.

Peripheral IC Type: SoC

Integration of various functions onto a single chip improves performance, reduces power consumption, and simplifies design complexity.

Technology: CMOS

Employs low power consumption and high noise immunity, increasing energy efficiency and overall product reliability.

Terminal Form: BALL

Facilitates reliable connections and soldering during assembly, ensuring robust electrical connections.

Nominal Supply Voltage: 0.75 V

Specifies the standard operating voltage, ensuring compatibility with typical power sources and reducing the risk of overvoltage.

Terminal Pitch: 0.8 mm

Provides sufficient spacing between terminals for easy soldering and connections, reducing the risk of short circuits.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XAM62A34ASMHAAMB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B484

Length:

18 mm

No. of Terminals:

484

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA484,22X22,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Maximum Seated Height:

2.556 mm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

18 mm

Peripheral IC Type:

SoC

Trade Compliance

XAM62A34ASMHAAMB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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