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XAM62A74AUMHAAMB

Texas Instruments

XAM62A74AUMHAAMB by Texas Instruments

XAM62A74AUMHAAMB by Texas Instruments is a 484-terminal SoC IC with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage ranging from 0.715V to 0.79V. This square-shaped IC in grid array package is ideal for applications requiring fine pitch and surface mount compatibility.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,337 parts In-Stock

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Vyrian

USA . 1,907 parts In-Stock

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1,907

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Distributors (Availability)

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AZTECH Wire

Italy . 553 parts In-Stock

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$14.090

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553

$14.090

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Ampacity Inc.

Singapore . 1,347 parts In-Stock

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$24.000

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One Stop Electronics

USA . 881 parts In-Stock

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$31.000

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881

$31.000

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Semicontronic

India . 630 parts In-Stock

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$32.000

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$31.200

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$31.040

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630

$32.000

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$31.040

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Corphita

USA . 4,587 parts In-Stock

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Corohmni

South Africa . 246 parts In-Stock

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Overview

Discover the cutting-edge XAM62A74AUMHAAMB by Texas Instruments, a high-quality SoC peripheral IC designed for a wide range of applications. With Texas Instruments' reputation for excellence in manufacturing, this product offers unparalleled value and benefits to customers. From its durable plastic/epoxy package body material to its advanced CMOS technology, this IC delivers reliable performance in extreme temperatures. Whether you're looking to enhance your uP or uC functions, the XAM62A74AUMHAAMB is the perfect solution for your needs. Experience the advantages of Texas Instruments' innovation with this versatile and efficient product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to external factors, making the product reliable in various environments.

Surface Mount: YES

Surface mount technology allows for easy installation and soldering onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 0.79 V

The maximum supply voltage of 0.79 V ensures that the product operates within safe voltage limits, preventing damage to the components.

Package Shape: SQUARE

Square package shape facilitates efficient use of space on a circuit board, optimizing layout and design.

No. of Terminals: 484

High number of terminals allow for connectivity to multiple external components, enhancing the functionality and versatility of the product.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch design enables high-density integration of components, leading to compact and space-saving product.

Minimum Supply Voltage: 0.715 V

Having a low minimum supply voltage of 0.715 V ensures reliable operation even in low power conditions, making it energy efficient.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, the product can withstand elevated temperatures and harsh operating conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in extreme cold environments.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and connection, making installation and maintenance easier for users.

Maximum Seated Height: 2.556 mm

Low maximum seated height of 2.556 mm allows for slim and compact product designs, ideal for space-constrained applications.

Width: 18 mm

Compact width of 18 mm ensures the product can fit into tight spaces without compromising on performance.

Length: 18 mm

Square shape and small length of 18 mm provide flexibility in placement and integration within electronic systems.

Peripheral IC Type: SoC

System-on-Chip (SoC) integration enhances functionality and reduces the need for external components, simplifying the design and improving efficiency.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, ensuring efficient and reliable performance.

Terminal Form: BALL

Ball terminal form simplifies soldering and connection processes, providing secure and stable electrical connections.

Nominal Supply Voltage: 0.75 V

Stable nominal supply voltage of 0.75 V ensures consistent and reliable operation of the product under normal operating conditions.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8 mm allows for high-density packaging, enabling compact and efficient electronic designs with optimal performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XAM62A74AUMHAAMB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B484

Length:

18 mm

No. of Terminals:

484

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA484,22X22,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Maximum Seated Height:

2.556 mm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

18 mm

Peripheral IC Type:

SoC

Trade Compliance

XAM62A74AUMHAAMB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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