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XAM62A34ASMHIAMB

Texas Instruments

XAM62A34ASMHIAMB by Texas Instruments

XAM62A34ASMHIAMB by Texas Instruments is a 484-terminal SoC with CMOS technology. It operates b/w -40°C to 125°C, with supply voltage ranging from 0.715V to 0.79V. This fine-pitch grid array IC is suitable for applications requiring high-performance processing in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,977 parts In-Stock

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Digiode

USA . 1,824 parts In-Stock

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Ampacity Inc.

Singapore . 453 parts In-Stock

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$16.000

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453

$16.000

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AZTECH Wire

Italy . 554 parts In-Stock

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$17.772

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Semicontronic

India . 675 parts In-Stock

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$20.000

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$19.500

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$19.400

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675

$20.000

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One Stop Electronics

USA . 1,377 parts In-Stock

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$29.000

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Corphita

USA . 1,654 parts In-Stock

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Corohmni

South Africa . 294 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the XAM62A34ASMHIAMB by Texas Instruments, a cutting-edge peripheral IC that sets the standard in quality and innovation. Manufactured by industry leader Texas Instruments, this product boasts a wide range of applications in various industries. With its advanced technology and high-quality materials, the XAM62A34ASMHIAMB delivers exceptional value and unmatched benefits to customers. Trust Texas Instruments for all your IC needs and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made of plastic/epoxy, this product is lightweight and durable, making it suitable for various applications.

Surface Mount: YES

With surface mount capability, this product is easy to install and saves space on the PCB.

Maximum Supply Voltage: 0.79 V

The high maximum supply voltage of 0.79 V allows for flexibility in power supply options for the product.

Package Shape: SQUARE

The square package shape helps in efficient placement and routing of the product on the PCB.

No. of Terminals: 484

Having a high number of terminals (484) allows for a wide range of connectivity options and functionalities.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style offers high density mounting capabilities and increased signal routing efficiency.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can withstand extreme temperature conditions.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can operate reliably in high temperature environments.

Width: 18 mm

The compact width of 18 mm helps in saving space and allows for efficient PCB design.

Peripheral IC Type: SoC

Being a System-on-Chip (SoC) peripheral IC type, this product integrates multiple functions onto a single chip, offering cost-effective and space-saving solutions.

Technology: CMOS

Using CMOS technology ensures low power consumption and high noise immunity for reliable performance.

Nominal Supply Voltage: 0.75 V

The nominal supply voltage of 0.75 V provides stable power supply for the product.

Terminal Pitch: 0.8 mm

With a small terminal pitch of 0.8 mm, this product allows for high density mounting and increased functionality in a compact form factor.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XAM62A34ASMHIAMB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B484

Length:

18 mm

No. of Terminals:

484

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA484,22X22,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Maximum Seated Height:

2.556 mm

Maximum Supply Voltage:

.79 V

Minimum Supply Voltage:

.715 V

Nominal Supply Voltage:

.75 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

18 mm

Peripheral IC Type:

SoC

Trade Compliance

XAM62A34ASMHIAMB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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