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VSP3200YG4

Texas Instruments

VSP3200YG4 by Texas Instruments

VSP3200YG4 by Texas Instruments is a 48-terminal consumer IC with 5V power supply, operating b/w 0-85°C. It features CMOS technology, GULL WING terminals, and PLASTIC/EPOXY package suitable for various consumer circuit applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,369 parts In-Stock

1+ parts

-

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6,369

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Digiode

USA . 3,585 parts In-Stock

1+ parts

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3,585

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ACDS - Activité Composants Distribution Service

France . 60 parts In-Stock

1+ parts

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60

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Holdelec - ElecDif-Pro

France . 60 parts In-Stock

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60

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 345 parts In-Stock

1+ parts

$0.182

100+ parts

-

1k+ parts

$1.515

10k+ parts

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345

$0.182

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$1.515

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DigiPath Technology Company

USA . 2,282 parts In-Stock

1+ parts

$0.201

100+ parts

$0.185

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2,282

$0.201

$0.185

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ChromeModa Solutions

Germany . 6,663 parts In-Stock

1+ parts

$0.205

100+ parts

$0.168

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6,663

$0.205

$0.168

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IDEA Electronic Components Group

UK . 1,189 parts In-Stock

1+ parts

$0.205

100+ parts

-

1k+ parts

$0.184

10k+ parts

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1,189

$0.205

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$0.184

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AZTECH Wire

Italy . 468 parts In-Stock

1+ parts

$13.643

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468

$13.643

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One Stop Electronics

USA . 494 parts In-Stock

1+ parts

$17.800

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494

$17.800

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QUARKTWIN TECHNOLOGY LTD

USA . 14,104 parts In-Stock

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14,104

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Microchip USA

USA . 4,524 parts In-Stock

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4,524

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Corphita

USA . 3,987 parts In-Stock

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3,987

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Overview

Elevate your consumer electronics with the VSP3200YG4 by Texas Instruments. Crafted with precision and quality, this device is designed to deliver unparalleled performance and reliability. From smart home devices to portable electronics, this versatile IC is tailored to meet a wide range of applications. With a focus on innovation and cutting-edge technology, Texas Instruments ensures that every product exceeds industry standards. Experience the value and benefits of the VSP3200YG4 today and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal circuitry, making the product long-lasting and reliable.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort during the assembly process.

Package Shape: SQUARE

Provides a compact form factor, saving space on the PCB and making it ideal for applications with limited space.

Power Supplies (V): 5

Provides a standard power supply voltage, ensuring compatibility with a wide range of systems and applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Other Function Consumer ICs VSP3200YG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

5 V

Minimum Supply Voltage (Vsup):

4.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

VSP3200YG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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