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VSP3210YG4

Texas Instruments

VSP3210YG4 by Texas Instruments

VSP3210YG4 by Texas Instruments is a 48-terminal consumer IC with 5V power supply, operating b/w 0-85°C. It features CMOS technology, GULL WING terminals, and a low-profile flatpack package shape. Ideal for various consumer circuit applications requiring precise temperature control and compact design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,961 parts In-Stock

1+ parts

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8,961

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Digiode

USA . 2,532 parts In-Stock

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2,532

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 981 parts In-Stock

1+ parts

$1.571

100+ parts

-

1k+ parts

$2.211

10k+ parts

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981

$1.571

-

$2.211

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DigiPath Technology Company

USA . 1,539 parts In-Stock

1+ parts

$1.730

100+ parts

-

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1,539

$1.730

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ChromeModa Solutions

Germany . 4,161 parts In-Stock

1+ parts

$1.765

100+ parts

$1.447

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10k+ parts

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4,161

$1.765

$1.447

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IDEA Electronic Components Group

UK . 133 parts In-Stock

1+ parts

$1.765

100+ parts

-

1k+ parts

$1.588

10k+ parts

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133

$1.765

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$1.588

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One Stop Electronics

USA . 772 parts In-Stock

1+ parts

$5.800

100+ parts

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772

$5.800

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AZTECH Wire

Italy . 554 parts In-Stock

1+ parts

$13.432

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554

$13.432

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Microchip USA

USA . 4,676 parts In-Stock

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4,676

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QUARKTWIN TECHNOLOGY LTD

USA . 3,355 parts In-Stock

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3,355

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Corphita

USA . 140 parts In-Stock

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140

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Overview

Elevate your consumer electronics with the high-quality VSP3210YG4 by Texas Instruments. Manufactured with precision and expertise, this versatile IC offers a wide range of applications in the consumer circuit category. With a durable plastic/epoxy package, surface mount capability, and a low profile design, this product delivers exceptional value and performance. Trust Texas Instruments to provide reliable solutions for your electronic needs, making every project a success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good electrical insulation and protection for the internal components, making the product durable and reliable.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto circuit boards, saving space and enabling automated manufacturing processes.

Power Supplies (V): 5

Operating at 5 volts provides a standard power supply level, ensuring compatibility with common electronic systems and simplifying design considerations.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the product to withstand demanding environmental conditions, ensuring reliable performance in various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

Other Function Consumer ICs VSP3210YG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

5.3 V

Minimum Supply Voltage (Vsup):

4.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

VSP3210YG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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