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VSP3200Y/2K

Texas Instruments

VSP3200Y/2K by Texas Instruments

VSP3200Y/2K by Texas Instruments is a 48-terminal IC with 5V power supply, operating b/w 0-85°C. It features CMOS technology, GULL WING terminals, and a square package shape suitable for consumer circuit applications. The flatpack design with low profile and fine pitch makes it ideal for surface mount assembly in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,562 parts In-Stock

1+ parts

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5,562

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Digiode

USA . 1,143 parts In-Stock

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1,143

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Freelance Electronics

USA . 16 parts In-Stock

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16

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,961 parts In-Stock

1+ parts

$1.145

100+ parts

-

1k+ parts

$1.961

10k+ parts

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1,961

$1.145

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$1.961

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DigiPath Technology Company

USA . 1,299 parts In-Stock

1+ parts

$1.260

100+ parts

$1.159

1k+ parts

-

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1,299

$1.260

$1.159

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ChromeModa Solutions

Germany . 2,122 parts In-Stock

1+ parts

$1.286

100+ parts

$1.055

1k+ parts

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2,122

$1.286

$1.055

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IDEA Electronic Components Group

UK . 18 parts In-Stock

1+ parts

$1.286

100+ parts

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1k+ parts

$1.157

10k+ parts

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18

$1.286

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$1.157

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AZTECH Wire

Italy . 652 parts In-Stock

1+ parts

$5.788

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652

$5.788

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One Stop Electronics

USA . 1,544 parts In-Stock

1+ parts

$12.800

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1,544

$12.800

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Corphita

USA . 1,548 parts In-Stock

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1,548

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Microchip USA

USA . 475 parts In-Stock

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475

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Overview

Unleash the power of cutting-edge technology with the VSP3200Y/2K by Texas Instruments. This high-quality consumer IC offers unmatched performance and reliability, making it a top choice for a wide range of applications. With its sleek design and advanced features, this product delivers exceptional value and benefits to customers looking for superior electronic components. Whether you're a tech enthusiast or a professional in need of reliable circuitry, the VSP3200Y/2K is sure to exceed your expectations. Experience the difference with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and heat resistance, making the product suitable for long-term use in various conditions.

Surface Mount: YES

Surface mount technology allows for compact design and easier assembly, saving space and reducing production costs.

Package Shape: SQUARE

Square shape enables efficient use of PCB space and simplifies placement and routing of components, enhancing overall design flexibility.

Power Supplies (V): 5

5V power supply ensures compatibility with standard voltage levels commonly used in consumer electronics, making integration easier.

No. of Terminals: 48

With a higher number of terminals, the IC can support more functions and connectivity options, providing versatility in design and functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack and low profile design with fine pitch terminals allow for denser packing of components, improving overall board density and performance.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and performance under varying environmental conditions, making it suitable for different applications.

Minimum Operating Temperature: 0 °C

Wide temperature range from 0 to 85°C enables the product to operate effectively in both extreme cold and hot environments.

Terminal Position: QUAD

Quad terminal position provides secure connectivity and ease of soldering, ensuring robust connections and reliable operation.

Maximum Seated Height: 1.6 mm

Low profile design with a maximum seated height of 1.6 mm helps in slim and compact product designs, saving space and reducing overall height.

Width: 7 mm

Compact width of 7 mm facilitates efficient board layout and integration into space-constrained applications, enhancing overall design flexibility.

Minimum Supply Voltage (Vsup): 4.7 V

Low minimum supply voltage of 4.7V ensures compatibility with a wide range of power sources, allowing for flexible integration in various systems.

Length: 7 mm

With a length of 7 mm, the product offers a compact form factor suitable for small-scale applications, enabling space-efficient designs.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing energy efficiency and performance of the IC.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and robust connections, improving overall reliability and durability of the product.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm allows for high-density mounting on the PCB, enabling a compact and efficient design layout.

Maximum Supply Voltage (Vsup): 5.3 V

High maximum supply voltage of 5.3V ensures safe operation and protection against voltage spikes, enhancing the reliability of the product.

Technical Specifications

Other Function Consumer ICs VSP3200Y/2K attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

5.3 V

Minimum Supply Voltage (Vsup):

4.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

VSP3200Y/2K General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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