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VSP3100Y/2K

Texas Instruments

VSP3100Y/2K by Texas Instruments

VSP3100Y/2K by Texas Instruments is a 48-terminal consumer IC with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 4.7-5.3V. Ideal for applications requiring low profile, fine pitch flatpack package style in consumer circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,431 parts In-Stock

1+ parts

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4,431

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Digiode

USA . 1,848 parts In-Stock

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1,848

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 73 parts In-Stock

1+ parts

$0.129

100+ parts

-

1k+ parts

$1.478

10k+ parts

-

73

$0.129

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$1.478

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DigiPath Technology Company

USA . 1,126 parts In-Stock

1+ parts

$0.142

100+ parts

$0.131

1k+ parts

-

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1,126

$0.142

$0.131

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ChromeModa Solutions

Germany . 3,588 parts In-Stock

1+ parts

$0.145

100+ parts

$0.119

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3,588

$0.145

$0.119

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IDEA Electronic Components Group

UK . 1,811 parts In-Stock

1+ parts

$0.145

100+ parts

-

1k+ parts

$0.130

10k+ parts

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1,811

$0.145

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$0.130

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One Stop Electronics

USA . 1,726 parts In-Stock

1+ parts

$11.800

100+ parts

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1,726

$11.800

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AZTECH Wire

Italy . 523 parts In-Stock

1+ parts

$14.311

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523

$14.311

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Microchip USA

USA . 3,549 parts In-Stock

1+ parts

$28.541

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3,549

$28.541

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Component Stockers USA

USA . 517 parts In-Stock

1+ parts

$99.990

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517

$99.990

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Corphita

USA . 1,694 parts In-Stock

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1,694

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Overview

Discover the innovative VSP3100Y/2K by Texas Instruments, a cutting-edge consumer IC that sets a new standard for quality and reliability. With a sleek flatpack design and advanced CMOS technology, this versatile device offers endless applications in various industries. From enhancing audio systems to improving sensor performance, this product delivers unparalleled value and performance. Trust Texas Instruments for superior engineering and unlock limitless possibilities with the VSP3100Y/2K.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good protection for the IC, ensuring durability and reliability in various operating conditions.

Surface Mount: YES

Surface mount capability makes it easier to integrate the IC into electronic assemblies, saving space and simplifying manufacturing processes.

Package Shape: SQUARE

Square shape allows for efficient use of board space and easy placement in tight layout designs.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring compatibility and performance in a wide range of consumer electronic devices.

No. of Terminals: 48

Ample number of terminals provide flexibility in connecting to other components and peripherals, enabling versatile circuit designs.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch design enhances thermal performance, promotes efficient signal transmission, and facilitates high-density board layouts.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows the IC to operate reliably in challenging environments without overheating.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the IC can function effectively in wide temperature ranges, suitable for various application scenarios.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity, corrosion resistance, and solderability for long-term performance and reliability.

Terminal Position: QUAD

Quad terminal position facilitates efficient routing of signals and power, contributing to better signal integrity and reduced interference.

Maximum Seated Height: 1.6 mm

Low maximum seated height enables the IC to be used in slim and compact device designs, saving space and improving device aesthetics.

Width: 7 mm

Compact width allows for easier placement on circuit boards and efficient use of available space in electronic assemblies.

Minimum Supply Voltage (Vsup): 4.7 V

Low minimum supply voltage requirement ensures compatibility with a wide range of power sources, allowing for flexible integration in different systems.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature allows for proper soldering and assembly of the IC, ensuring secure connections and reliable operation.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance enables the IC to withstand robust manufacturing processes, ensuring quality solder joints and long-term reliability.

Length: 7 mm

Compact length allows for space-efficient placement on circuit boards and accommodates tight layout constraints in electronic assemblies.

No. of Channels: 3

Multiple channels provide versatility in signal processing and input/output functions, enhancing the IC's capability for various consumer applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with diverse electronic systems, making the IC energy-efficient and versatile.

Terminal Form: GULL WING

Gull wing terminal form simplifies the soldering process and enhances mechanical stability, ensuring secure connections and reliable performance.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting on circuit boards, promoting compact designs and efficient use of available space in electronic devices.

Maximum Supply Voltage (Vsup): 5.3 V

High maximum supply voltage tolerance ensures compatibility with various power sources and protects the IC from potential voltage fluctuations, enhancing reliability.

Technical Specifications

Other Function Consumer ICs VSP3100Y/2K attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

5.3 V

Minimum Supply Voltage (Vsup):

4.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

VSP3100Y/2K General Purpose ICs trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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