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VSP3100Y

Texas Instruments

VSP3100Y by Texas Instruments

VSP3100Y by Texas Instruments is a consumer IC with 48 terminals in a square package. It operates b/w 0-85°C, with supply voltage range of 4.7-5.3V. This CMOS technology chip is ideal for various consumer circuit applications due to its low profile and fine pitch design.

Median Price

$10.660

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 60 parts In-Stock

1+ parts

$5.374

100+ parts

$5.324

1k+ parts

-

10k+ parts

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60

$5.374

$5.324

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Verical

USA . 60 parts In-Stock

1+ parts

$5.374

100+ parts

$5.324

1k+ parts

-

10k+ parts

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60

$5.374

$5.324

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-

Rochester

USA . 56 parts In-Stock

1+ parts

$10.660

100+ parts

$10.450

1k+ parts

$10.230

10k+ parts

-

56

$10.660

$10.450

$10.230

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DigiKey

USA . 185 parts In-Stock

1+ parts

$18.270

100+ parts

-

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$12.618

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185

$18.270

-

$12.618

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Avnet

USA . 120 parts In-Stock

1+ parts

-

100+ parts

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$13.618

10k+ parts

$13.046

120

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-

$13.618

$13.046

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,353 parts In-Stock

1+ parts

$5.105

100+ parts

-

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4,353

$5.105

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Vyrian

USA . 6,726 parts In-Stock

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6,726

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Chip Stock

USA . 2,895 parts In-Stock

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2,895

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Semi Source

USA . 290 parts In-Stock

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290

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Sternenhof Electronics

Switzerland . 108 parts In-Stock

1+ parts

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108

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Cyclops Electronics Ltd

UK . 35 parts In-Stock

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35

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Prism Electronics

USA . 6 parts In-Stock

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 326 parts In-Stock

1+ parts

$2.659

100+ parts

-

1k+ parts

$3.147

10k+ parts

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326

$2.659

-

$3.147

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DigiPath Technology Company

USA . 570 parts In-Stock

1+ parts

$2.928

100+ parts

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570

$2.928

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ChromeModa Solutions

Germany . 6,391 parts In-Stock

1+ parts

$2.988

100+ parts

$2.450

1k+ parts

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6,391

$2.988

$2.450

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IDEA Electronic Components Group

UK . 1,937 parts In-Stock

1+ parts

$2.988

100+ parts

-

1k+ parts

$2.689

10k+ parts

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1,937

$2.988

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$2.689

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One Stop Electronics

USA . 46 parts In-Stock

1+ parts

$4.570

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46

$4.570

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Corphita

USA . 879 parts In-Stock

1+ parts

$4.837

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879

$4.837

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Assy Fe

Spain . 1,007 parts In-Stock

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1,007

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Perfect Parts

USA . 395 parts In-Stock

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395

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Overview

Experience the superior quality and reliability of the Texas Instruments VSP3100Y, a cutting-edge consumer IC that offers exceptional performance in a variety of applications. With a package style that is both sleek and durable, this versatile chip provides customers with the perfect solution for their electronic needs. Whether you're looking to enhance your audio equipment or streamline your home automation system, the VSP3100Y delivers unmatched value and efficiency. Trust in Texas Instruments to deliver the best in consumer circuit technology and revolutionize the way you experience electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability and heat resistance, making the product suitable for various operating conditions.

Surface Mount: YES

Surface mount design allows for easier and more efficient PCB assembly, saving time and reducing manufacturing costs.

Package Shape: SQUARE

Square package shape helps in efficient space utilization on the PCB, optimizing the overall design layout.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring compatibility and performance in everyday devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand demanding environmental conditions without performance degradation.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the product can function effectively in a wide range of environments, including colder settings.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections.

No. of Channels: 3

Having 3 channels allows for multi-functionality and versatility in the product's usage, catering to a wider range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Maximum Supply Voltage (Vsup): 5.3 V

Higher maximum supply voltage allows for greater flexibility in power input options, accommodating various voltage requirements of different systems.

Technical Specifications

Other Function Consumer ICs VSP3100Y attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

5.3 V

Minimum Supply Voltage (Vsup):

4.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

VSP3100Y General Purpose ICs trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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