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VSP3000Y/2K

Texas Instruments

VSP3000Y/2K by Texas Instruments

VSP3000Y/2K by Texas Instruments is a consumer IC with 48 terminals in a square package. It operates b/w 0-85°C, with supply voltage range of 4.7-5.3V. Ideal for applications requiring low profile, fine pitch ICs in plastic/epoxy material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,289 parts In-Stock

1+ parts

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7,289

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Digiode

USA . 2,534 parts In-Stock

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2,534

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 748 parts In-Stock

1+ parts

$3.335

100+ parts

-

1k+ parts

$3.858

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748

$3.335

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$3.858

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DigiPath Technology Company

USA . 1,244 parts In-Stock

1+ parts

$3.672

100+ parts

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1,244

$3.672

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IDEA Electronic Components Group

UK . 2,141 parts In-Stock

1+ parts

$3.747

100+ parts

-

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$3.372

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2,141

$3.747

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$3.372

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ChromeModa Solutions

Germany . 772 parts In-Stock

1+ parts

$3.747

100+ parts

$3.073

1k+ parts

-

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772

$3.747

$3.073

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One Stop Electronics

USA . 2,490 parts In-Stock

1+ parts

$12.800

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2,490

$12.800

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AZTECH Wire

Italy . 308 parts In-Stock

1+ parts

$17.670

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308

$17.670

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Corphita

USA . 1,787 parts In-Stock

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1,787

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Perfect Parts

USA . 941 parts In-Stock

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941

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Overview

Elevate your consumer electronics with the VSP3000Y/2K by Texas Instruments. Crafted with precision and expertise, this consumer circuit IC boasts a sleek flatpack design and cutting-edge CMOS technology. With its wide operating temperature range and low profile package, this versatile component is ideal for a variety of applications. Say goodbye to subpar performance and hello to enhanced functionality and reliability. Trust in Texas Instruments to deliver quality and innovation that exceeds expectations. Upgrade your devices today with the VSP3000Y/2K and experience a new level of excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability, making the product suitable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation onto circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

Square package shape provides a compact design that saves space and allows for efficient use of PCB real estate.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer electronics applications, offering features and functionalities tailored to meet consumer demands.

No. of Terminals: 48

Having 48 terminals allows for increased connectivity options, supporting a wide range of functions and connections within a circuit.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand demanding environmental conditions without compromising performance.

Minimum Operating Temperature: 0 °C

Capable of operating at low temperatures, ensuring reliability and functionality in various temperature environments.

Width: 7 mm

Compact width allows for space-saving installation, making the product suitable for designs with limited space constraints.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the energy efficiency and reliability of the product.

Maximum Supply Voltage (Vsup): 5.3 V

Supports a high maximum supply voltage, providing flexibility and compatibility with a wide range of power sources.

Technical Specifications

Other Function Consumer ICs VSP3000Y/2K attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Current:

102 mA

Maximum Supply Voltage (Vsup):

5.3 V

Minimum Supply Voltage (Vsup):

4.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

VSP3000Y/2K General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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