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VSP3100YG4

Texas Instruments

VSP3100YG4 by Texas Instruments

VSP3100YG4 by Texas Instruments is a consumer IC with 48 terminals in a square package. It operates b/w 0-85°C, with supply voltage range of 4.7-5.3V. Ideal for applications requiring low profile, fine pitch ICs like consumer circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,477 parts In-Stock

1+ parts

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6,477

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Digiode

USA . 2,353 parts In-Stock

1+ parts

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2,353

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 921 parts In-Stock

1+ parts

$0.194

100+ parts

-

1k+ parts

$1.517

10k+ parts

-

921

$0.194

-

$1.517

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ChromeModa Solutions

Germany . 1,678 parts In-Stock

1+ parts

$0.218

100+ parts

$0.179

1k+ parts

-

10k+ parts

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1,678

$0.218

$0.179

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IDEA Electronic Components Group

UK . 877 parts In-Stock

1+ parts

$0.218

100+ parts

-

1k+ parts

$0.196

10k+ parts

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877

$0.218

-

$0.196

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One Stop Electronics

USA . 1,605 parts In-Stock

1+ parts

$15.800

100+ parts

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1k+ parts

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10k+ parts

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1,605

$15.800

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AZTECH Wire

Italy . 272 parts In-Stock

1+ parts

$18.254

100+ parts

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272

$18.254

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Corphita

USA . 4,385 parts In-Stock

1+ parts

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4,385

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Microchip USA

USA . 1,308 parts In-Stock

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1,308

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DigiPath Technology Company

USA . 1,093 parts In-Stock

1+ parts

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100+ parts

$0.197

1k+ parts

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1,093

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$0.197

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Overview

Discover the innovative VSP3100YG4 by Texas Instruments, a high-quality consumer IC that offers exceptional value and benefits. With Texas Instruments' renowned reputation for reliability and performance, this product is sure to exceed your expectations. Ideal for a wide range of applications, this IC provides seamless integration and precise functionality. Experience the advantages of advanced technology with the VSP3100YG4, where quality meets affordability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and insulation, making the product suitable for a wide range of operating environments.

Surface Mount: YES

Surface mount capability simplifies PCB assembly processes and reduces overall product size and weight.

Package Shape: SQUARE

Square packages are easy to handle and provide efficient use of PCB space.

General IC Type: CONSUMER CIRCUIT

Designed for consumer applications, ensuring reliability and compatibility with various consumer electronics.

No. of Terminals: 48

The high number of terminals allow for complex circuit connections and functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact design with fine pitch terminals, facilitating high-density PCB layouts.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can function effectively in demanding operational conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures operational reliability in various environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish enhances conductivity and provides excellent corrosion resistance for long-term reliability.

Terminal Position: QUAD

Quad terminal position allows for efficient routing of signals within the device, optimizing performance.

Maximum Seated Height: 1.6 mm

Low profile design with maximum seated height of 1.6mm enables compact and slim product designs.

Width: 7 mm

Narrow width of the product saves space on the PCB and allows for more components to be integrated.

Minimum Supply Voltage (Vsup): 4.7 V

Low minimum supply voltage requirement ensures compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature allows for proper soldering and ensures component reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures proper solder joint formation for robust assembly.

Length: 7 mm

Compact length of the product enables space-efficient PCB designs.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and inspection during assembly processes.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density interconnections within the device, optimizing performance and functionality.

Maximum Supply Voltage (Vsup): 5.3 V

High maximum supply voltage tolerance ensures robust performance and protection against voltage fluctuations.

Technical Specifications

Other Function Consumer ICs VSP3100YG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

5.3 V

Minimum Supply Voltage (Vsup):

4.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

VSP3100YG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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