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VSP3010YG4

Texas Instruments

VSP3010YG4 by Texas Instruments

VSP3010YG4 by Texas Instruments is a consumer IC with 48 terminals in a square flatpack package. It operates b/w 0-85°C, with supply voltage ranging from 4.7-5.3V. Ideal for various consumer circuit applications due to its CMOS technology and compact dimensions of 7x7mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,150

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-

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Digiode

USA . 671 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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671

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,176 parts In-Stock

1+ parts

$2.146

100+ parts

$199.269

1k+ parts

$1.931

10k+ parts

-

1,176

$2.146

$199.269

$1.931

-

DigiPath Technology Company

USA . 1,778 parts In-Stock

1+ parts

$2.363

100+ parts

-

1k+ parts

-

10k+ parts

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1,778

$2.363

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ChromeModa Solutions

Germany . 2,389 parts In-Stock

1+ parts

$2.411

100+ parts

$1.977

1k+ parts

-

10k+ parts

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2,389

$2.411

$1.977

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IDEA Electronic Components Group

UK . 2,081 parts In-Stock

1+ parts

$2.411

100+ parts

-

1k+ parts

$2.170

10k+ parts

-

2,081

$2.411

-

$2.170

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One Stop Electronics

USA . 1,309 parts In-Stock

1+ parts

$4.800

100+ parts

-

1k+ parts

-

10k+ parts

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1,309

$4.800

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-

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AZTECH Wire

Italy . 222 parts In-Stock

1+ parts

$5.988

100+ parts

-

1k+ parts

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10k+ parts

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222

$5.988

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Corphita

USA . 3,996 parts In-Stock

1+ parts

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100+ parts

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3,996

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Microchip USA

USA . 471 parts In-Stock

1+ parts

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471

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Overview

Discover the VSP3010YG4 by Texas Instruments, a top-notch consumer circuit designed to elevate your electronic projects to new heights. With Texas Instruments' renowned reputation for quality and innovation, this IC is sure to exceed your expectations. From smart home devices to automotive applications, the possibilities are endless. Experience the value of seamless integration, reliability, and performance that only Texas Instruments can deliver. Elevate your designs with the VSP3010YG4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good electrical insulation and protection for the IC, ensuring reliable performance.

Surface Mount: YES

Facilitates easy and efficient assembly onto circuit boards, saving time and effort during production.

Package Shape: SQUARE

Square shape allows for efficient use of space on the circuit board, optimizing component layout.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring compatibility and functionality in various consumer electronic devices.

No. of Terminals: 48

Provides flexibility and connectivity options for interfacing with other components or devices.

Package Style (Meter): FLATPACK

Flatpack design offers a low profile and compact form factor, ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures without performance degradation, suitable for demanding environments.

Minimum Operating Temperature: 0 °C

Capable of functioning in low-temperature conditions, increasing the range of possible applications for the product.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

Terminal Position: QUAD

Quad terminals offer enhanced stability and connectivity, reducing the risk of signal interference or loss.

Width: 7 mm

Compact width allows for efficient use of PCB real estate, enabling dense and space-saving circuit designs.

Minimum Supply Voltage (Vsup): 4.7 V

Supports low supply voltage operation, conserving power and enhancing energy efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, ideal for consumer electronic applications.

Terminal Form: GULL WING

Gull wing terminals provide mechanical strength and ease of soldering during assembly, ensuring robust connections.

Terminal Pitch: 0.5 mm

Fine pitch terminals allow for high density mounting, enabling compact PCB layouts and miniaturization of devices.

Maximum Supply Voltage (Vsup): 5.3 V

Supports a higher supply voltage range, offering flexibility and compatibility with various power sources.

Technical Specifications

Other Function Consumer ICs VSP3010YG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

5.3 V

Minimum Supply Voltage (Vsup):

4.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

VSP3010YG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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