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VSP2272M/2K

Texas Instruments

VSP2272M/2K by Texas Instruments

VSP2272M/2K by Texas Instruments is a consumer IC with 48 terminals in a square chip carrier package. It operates b/w -25°C to 85°C, with supply voltage ranging from 3V to 3.6V. This CMOS technology IC is surface mountable and suitable for various consumer circuit applications.

Median Price

$26.134

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,890 parts In-Stock

1+ parts

-

100+ parts

$23.230

1k+ parts

$20.780

10k+ parts

$19.560

1,890

-

$23.230

$20.780

$19.560

Verical

USA . 1,890 parts In-Stock

1+ parts

-

100+ parts

$29.038

1k+ parts

$25.975

10k+ parts

$24.450

1,890

-

$29.038

$25.975

$24.450

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,971 parts In-Stock

1+ parts

$21.318

100+ parts

-

1k+ parts

-

10k+ parts

-

1,971

$21.318

-

-

-

Vyrian

USA . 2,187 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,187

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 283 parts In-Stock

1+ parts

$1.249

100+ parts

$115.958

1k+ parts

$1.124

10k+ parts

-

283

$1.249

$115.958

$1.124

-

DigiPath Technology Company

USA . 1,117 parts In-Stock

1+ parts

$1.375

100+ parts

$1.265

1k+ parts

-

10k+ parts

-

1,117

$1.375

$1.265

-

-

IDEA Electronic Components Group

UK . 946 parts In-Stock

1+ parts

$1.403

100+ parts

-

1k+ parts

$1.263

10k+ parts

-

946

$1.403

-

$1.263

-

ChromeModa Solutions

Germany . 787 parts In-Stock

1+ parts

$1.403

100+ parts

$1.150

1k+ parts

-

10k+ parts

-

787

$1.403

$1.150

-

-

Corphita

USA . 3,153 parts In-Stock

1+ parts

$20.196

100+ parts

-

1k+ parts

-

10k+ parts

-

3,153

$20.196

-

-

-

Microchip USA

USA . 2,463 parts In-Stock

1+ parts

$25.840

100+ parts

$25.470

1k+ parts

$25.290

10k+ parts

$25.110

2,463

$25.840

$25.470

$25.290

$25.110

Overview

Unlock a world of endless possibilities with the VSP2272M/2K by Texas Instruments. This high-quality consumer IC offers unmatched reliability and performance, thanks to its innovative design and cutting-edge technology. Perfect for a wide range of applications, this chip carrier package is ideal for consumer circuits that require precise and efficient operation. Trust Texas Instruments to deliver excellence in every detail, providing you with the value, benefits, and advantages you need to stay ahead in today's competitive market. Elevate your projects with the VSP2272M/2K and experience the difference of top-tier quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for consumer electronics applications.

Surface Mount: YES

Surface mount feature allows for easy and efficient PCB assembly, saving time and cost during manufacturing.

Package Shape: SQUARE

Square package shape provides efficient use of PCB space and allows for easy integration into compact electronic devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand high temperature environments, ensuring reliable performance.

Minimum Operating Temperature: -25 °C

The product can operate at low temperatures down to -25°C, making it suitable for use in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage of 3V ensures compatibility with a wide range of power sources, enhancing the versatility of the product.

Technical Specifications

Other Function Consumer ICs VSP2272M/2K attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.2 mm

Trade Compliance

VSP2272M/2K General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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