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UC37131NG4

Texas Instruments

UC37131NG4 by Texas Instruments

UC37131NG4 by Texas Instruments is a Peripheral Driver with 8 terminals, operating at -40 to 85°C. It has a max output current of 0.25A and nominal voltage of 25V, suitable for commercial applications requiring bipolar technology in an in-line package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,229 parts In-Stock

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8,229

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Digiode

USA . 4,417 parts In-Stock

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4,417

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Distributors (Availability)

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One Stop Electronics

USA . 1,544 parts In-Stock

1+ parts

$1.500

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1,544

$1.500

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Parana Technologies

USA . 627 parts In-Stock

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$2.124

100+ parts

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$2.638

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627

$2.124

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$2.638

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ChromeModa Solutions

Germany . 6,537 parts In-Stock

1+ parts

$2.387

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$1.957

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6,537

$2.387

$1.957

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IDEA Electronic Components Group

UK . 1,963 parts In-Stock

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$2.387

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$2.148

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1,963

$2.387

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$2.148

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AZTECH Wire

Italy . 472 parts In-Stock

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$17.071

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472

$17.071

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Corphita

USA . 1,298 parts In-Stock

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1,298

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DigiPath Technology Company

USA . 778 parts In-Stock

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$2.152

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$2.152

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Overview

Upgrade your electronic designs with the UC37131NG4 from Texas Instruments, a leading manufacturer known for its high-quality components. As a versatile peripheral driver, this product is ideal for a wide range of applications, providing reliable power supplies and efficient performance. With a maximum output current of 0.25 A and a nominal supply voltage of 25 V, this innovative technology offers customers the value, benefits, and advantages they need to create cutting-edge electronics. Trust Texas Instruments to deliver superior products that meet your design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Package Shape: RECTANGULAR

Allows for easy integration and installation into various systems or devices.

Power Supplies (V): 25

Can handle high power supplies, making it suitable for a wide range of applications.

No. of Terminals: 8

Offers multiple connection points, enabling flexibility in wiring configurations.

Package Style (Meter): IN-LINE

Saves space and provides a neat and organized appearance in the setup.

Maximum Operating Temperature: 70 °C

Can operate under high temperatures, ensuring reliability in various environmental conditions.

Minimum Operating Temperature: 0 °C

Can operate in cold temperatures, making it versatile for different climates.

Terminal Position: DUAL

Provides redundancy and allows for multiple connections for added reliability.

Temperature Grade: COMMERCIAL

Designed for commercial use, meeting industry standards and regulations.

Maximum Output Current: 0.25 A

Capable of delivering a high output current, suitable for driving peripheral devices efficiently.

Technology: BIPOLAR

Utilizes bipolar technology for precise control and accuracy in driving peripherals.

Terminal Form: THROUGH-HOLE

Allows for easy and secure connection to a PCB, ensuring stable operation.

Nominal Supply Voltage: 25 V

Matches the power supply voltage, preventing any voltage mismatches and potential damage.

Terminal Pitch: 2.54 mm

Offers standard terminal spacing, compatible with commonly used connectors and wiring.

Technical Specifications

Peripheral Drivers UC37131NG4 attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Driver No. of Bits:

1

JESD-30 Code:

R-PDIP-T8

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

.25 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

25

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Nominal Supply Voltage:

25 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

UC37131NG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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