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UC3702D

Texas Instruments

UC3702D by Texas Instruments

UC3702D by Texas Instruments is a PWM-based peripheral driver with 4 functions. It operates at 5V, handles up to 42.5V, and has built-in protections for overcurrent and undervoltage. Ideal for applications requiring sink output current flow direction in commercial temperature grades.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,223 parts In-Stock

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7,223

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Digiode

USA . 1,463 parts In-Stock

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1,463

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,493 parts In-Stock

1+ parts

$5.433

100+ parts

-

1k+ parts

$6.140

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1,493

$5.433

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$6.140

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DigiPath Technology Company

USA . 725 parts In-Stock

1+ parts

$5.982

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725

$5.982

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ChromeModa Solutions

Germany . 6,518 parts In-Stock

1+ parts

$6.104

100+ parts

$5.005

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6,518

$6.104

$5.005

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IDEA Electronic Components Group

UK . 1,739 parts In-Stock

1+ parts

$6.104

100+ parts

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$5.494

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1,739

$6.104

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$5.494

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AZTECH Wire

Italy . 357 parts In-Stock

1+ parts

$16.870

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357

$16.870

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One Stop Electronics

USA . 1,188 parts In-Stock

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$24.500

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1,188

$24.500

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Corphita

USA . 593 parts In-Stock

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593

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Overview

Upgrade your electronics with the UC3702D from Texas Instruments, a top-quality PWM-based peripheral driver designed to enhance performance and reliability. With built-in protections against overcurrent and undervoltage, this versatile device offers peace of mind for your projects. Whether you're working on automotive applications or industrial automation, the UC3702D delivers superior functionality and efficiency. Trust Texas Instruments for cutting-edge technology that meets your needs. Experience the value and benefits of this compact, high-performance solution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the peripheral driver.

Maximum Supply Voltage: 8 V

Allows the peripheral driver to operate efficiently within a safe voltage range, reducing the risk of damage or malfunctions.

Built-in Protections: OVER CURRENT; UNDER VOLTAGE

Enhanced safety features protect both the peripheral driver and connected devices from potential damage due to electrical faults.

Maximum Output Current: 0.05 A

Provides sufficient power for driving peripheral devices while maintaining a stable and consistent output current.

Interface IC Type: PWM BASED PERIPHERAL DRIVER

Utilizes Pulse Width Modulation technology for precise control and modulation of the output signal, making it suitable for various applications.

Technical Specifications

Peripheral Drivers UC3702D attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

OVER CURRENT; UNDER VOLTAGE

Driver No. of Bits:

4

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Current Flow Direction:

SINK

Maximum Output Current:

.05 A

Nominal Output Peak Current Limit:

.175 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

8 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

42.5 V

Nominal Supply Voltage-1:

34 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

.25 us

Turn-on Time:

.25 us

Width:

3.9 mm

Trade Compliance

UC3702D Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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