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UC3702DTR

Texas Instruments

UC3702DTR by Texas Instruments

UC3702DTR by Texas Instruments is a PWM-based peripheral driver with 4 functions. It operates b/w 4.5-8V, protecting against overcurrent and undervoltage. Ideal for applications requiring sink output current flow direction and fast turn-on/off times of 0.25 us.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,778 parts In-Stock

1+ parts

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6,778

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Digiode

USA . 1,833 parts In-Stock

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1,833

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 237 parts In-Stock

1+ parts

$8.262

100+ parts

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237

$8.262

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Parana Technologies

USA . 651 parts In-Stock

1+ parts

$10.344

100+ parts

-

1k+ parts

$10.863

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651

$10.344

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$10.863

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DigiPath Technology Company

USA . 1,005 parts In-Stock

1+ parts

$11.391

100+ parts

$10.479

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-

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1,005

$11.391

$10.479

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ChromeModa Solutions

Germany . 2,839 parts In-Stock

1+ parts

$11.623

100+ parts

$9.531

1k+ parts

-

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2,839

$11.623

$9.531

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IDEA Electronic Components Group

UK . 400 parts In-Stock

1+ parts

$11.623

100+ parts

$11.042

1k+ parts

$10.461

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400

$11.623

$11.042

$10.461

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One Stop Electronics

USA . 1,192 parts In-Stock

1+ parts

$37.500

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1,192

$37.500

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Corphita

USA . 4,643 parts In-Stock

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4,643

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Overview

Enhance your electronic projects with the UC3702DTR by Texas Instruments, a top-quality peripheral driver designed to deliver superior performance and reliability. Manufactured by a trusted industry leader, this innovative device offers built-in protections against over current and under voltage, ensuring seamless operation and peace of mind. Ideal for a wide range of applications, this compact and versatile solution provides unmatched value and benefits to customers looking to streamline their designs and achieve optimal results. Trust in Texas Instruments to bring your projects to the next level with the UC3702DTR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring a longer lifespan.

Surface Mount: YES

The surface mount capability allows for easy installation on circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 8 V

The maximum supply voltage of 8V provides a wide range of compatibility with different power sources.

No. of Functions: 4

Having 4 functions in one device increases efficiency and reduces the need for multiple separate components.

Built-in Protections: OVER CURRENT; UNDER VOLTAGE

The built-in protections for over current and under voltage enhance the safety and reliability of the product.

Temperature Grade: COMMERCIAL

The commercial grade temperature range of 0-70°C ensures reliable operation in typical indoor environments.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is commonly used in electronic devices, making this product compatible with a wide range of applications.

Interface IC Type: PWM BASED PERIPHERAL DRIVER

The use of PWM-based interface IC technology allows for precise control and efficient power management in peripheral devices.

Technical Specifications

Peripheral Drivers UC3702DTR attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

OVER CURRENT; UNDER VOLTAGE

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

.175 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

8 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

42.5 V

Nominal Supply Voltage-1:

34 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

.25 us

Turn-on Time:

.25 us

Width:

3.9 mm

Trade Compliance

UC3702DTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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