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UC37132J

Texas Instruments

UC37132J by Texas Instruments

UC37132J by Texas Instruments is a 14-terminal peripheral driver with built-in over current protection. It operates b/w 0-70°C, with supply voltage range of 8-65V. Widely used for buffering or inverting signals in various commercial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,544 parts In-Stock

1+ parts

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7,544

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Digiode

USA . 681 parts In-Stock

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681

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,147 parts In-Stock

1+ parts

$3.087

100+ parts

-

1k+ parts

$3.604

10k+ parts

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2,147

$3.087

-

$3.604

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DigiPath Technology Company

USA . 2,200 parts In-Stock

1+ parts

$3.399

100+ parts

$3.127

1k+ parts

-

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2,200

$3.399

$3.127

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ChromeModa Solutions

Germany . 5,674 parts In-Stock

1+ parts

$3.468

100+ parts

$2.844

1k+ parts

-

10k+ parts

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5,674

$3.468

$2.844

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IDEA Electronic Components Group

UK . 2,239 parts In-Stock

1+ parts

$3.468

100+ parts

-

1k+ parts

$3.121

10k+ parts

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2,239

$3.468

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$3.121

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AZTECH Wire

Italy . 890 parts In-Stock

1+ parts

$17.771

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890

$17.771

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One Stop Electronics

USA . 876 parts In-Stock

1+ parts

$40.500

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876

$40.500

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Corphita

USA . 827 parts In-Stock

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827

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Overview

Enhance your electronic designs with the UC37132J from Texas Instruments, a top-quality peripheral driver that offers unmatched reliability and performance. With built-in protections against overcurrent, this versatile device is ideal for a wide range of applications, providing seamless integration and superior functionality. Trust in Texas Instruments' reputation for excellence and choose the UC37132J for your next project to experience the value, benefits, and advantages it brings to your designs. Elevate your creations today with the UC37132J!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed body material provides excellent protection and durability, making this peripheral driver suitable for various environments and conditions.

Maximum Supply Voltage: 65 V

With a high maximum supply voltage of 65V, this peripheral driver can handle a wide range of power inputs, making it versatile and compatible with different systems.

Built-in Protections: OVER CURRENT

The built-in over current protection ensures the safety and reliability of the connected devices by preventing damage from excessive current flow, increasing system longevity.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures that this peripheral driver can operate efficiently within standard temperature ranges commonly found in commercial applications, ensuring stable performance.

Nominal Output Peak Current Limit: 0.7 A

With a nominal output peak current limit of 0.7A, this peripheral driver can effectively drive connected components and devices without risking overload or overheating, ensuring smooth operation.

Technical Specifications

Peripheral Drivers UC37132J attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

OVER CURRENT

JESD-30 Code:

R-GDIP-T14

Length:

19.56 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Nominal Output Peak Current Limit:

.7 A

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage:

65 V

Minimum Supply Voltage:

8 V

Nominal Supply Voltage:

25 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

UC37132J Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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