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UC37131DG4

Texas Instruments

UC37131DG4 by Texas Instruments

UC37131DG4 by Texas Instruments is a peripheral driver with a max supply voltage of 65V and built-in protections for transient and over current. It operates b/w temperatures of 0 to 70°C, with a nominal voltage of 25V. This IC type is ideal for applications requiring buffer or inverter based peripheral drivers.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,688 parts In-Stock

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3,688

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Digiode

USA . 322 parts In-Stock

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322

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Parana Technologies

USA . 2,182 parts In-Stock

1+ parts

$2.473

100+ parts

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$2.966

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2,182

$2.473

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$2.966

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ChromeModa Solutions

Germany . 4,577 parts In-Stock

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$2.779

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$2.279

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$2.779

$2.279

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IDEA Electronic Components Group

UK . 590 parts In-Stock

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$2.779

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$2.501

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590

$2.779

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$2.501

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AZTECH Wire

Italy . 489 parts In-Stock

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$19.369

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489

$19.369

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One Stop Electronics

USA . 173 parts In-Stock

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$45.500

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$45.500

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Component Stockers USA

USA . 524 parts In-Stock

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$99.990

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524

$99.990

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Corphita

USA . 3,102 parts In-Stock

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DigiPath Technology Company

USA . 1,131 parts In-Stock

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$2.506

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Perfect Parts

USA . 896 parts In-Stock

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Microchip USA

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Overview

Discover the cutting-edge UC37131DG4 by Texas Instruments, a top-tier manufacturer known for high-quality peripheral drivers. Designed with built-in protections against transients and overcurrents, this versatile device offers unparalleled reliability and performance. Ideal for a variety of applications, this product delivers maximum output current of 0.25 A and a nominal supply voltage of 25 V. With a compact design and advanced technology, the UC37131DG4 is the perfect solution for all your driving needs. Elevate your projects with this innovative peripheral driver and experience the difference in quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the peripheral driver, ensuring a longer lifespan and reliable performance.

Surface Mount: YES

Surface mount capability makes installation easy and allows for compact design, ideal for space-constrained applications.

Maximum Supply Voltage: 65 V

With a high maximum supply voltage, this peripheral driver can handle a wide range of power inputs, making it versatile for various setups.

Built-in Protections: TRANSIENT; OVER CURRENT

The built-in transient and overcurrent protection ensures the safety of connected devices and the peripheral driver itself, reducing the risk of damage.

Power Supplies (V): 25

The specified power supply voltage of 25V makes this peripheral driver suitable for applications requiring this specific power input.

No. of Terminals: 8

Having 8 terminals allows for versatile connectivity options and compatibility with different types of devices and systems.

Maximum Output Current: 0.25 A

The maximum output current of 0.25A enables the peripheral driver to power devices with higher current requirements, enhancing its capability.

Turn-on Time: 6 us

The quick turn-on time of 6 microseconds ensures fast response and efficient operation of the peripheral driver in time-sensitive applications.

Technical Specifications

Peripheral Drivers UC37131DG4 attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G8

Length:

4.89 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Current Flow Direction:

SINK

Maximum Output Current:

.25 A

Nominal Output Peak Current Limit:

.9 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

25

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

65 V

Minimum Supply Voltage:

8 V

Nominal Supply Voltage:

25 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Turn-off Time:

6 us

Turn-on Time:

6 us

Width:

3.9 mm

Trade Compliance

UC37131DG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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