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UC27132L

Texas Instruments

UC27132L by Texas Instruments

UC27132L by Texas Instruments is a 20-terminal peripheral driver with a max supply voltage of 65V. It offers overcurrent protection, operates b/w -40 to 85°C, and has a nominal output peak current limit of 0.7A. Ideal for industrial applications requiring buffer or inverter-based interface ICs in a compact chip carrier package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,578 parts In-Stock

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4,578

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Digiode

USA . 387 parts In-Stock

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387

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,587 parts In-Stock

1+ parts

$9.339

100+ parts

-

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$9.961

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1,587

$9.339

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$9.961

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DigiPath Technology Company

USA . 799 parts In-Stock

1+ parts

$10.283

100+ parts

$9.460

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799

$10.283

$9.460

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ChromeModa Solutions

Germany . 4,494 parts In-Stock

1+ parts

$10.493

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$8.604

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4,494

$10.493

$8.604

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IDEA Electronic Components Group

UK . 984 parts In-Stock

1+ parts

$10.493

100+ parts

$9.968

1k+ parts

$9.444

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984

$10.493

$9.968

$9.444

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AZTECH Wire

Italy . 349 parts In-Stock

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$16.633

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349

$16.633

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One Stop Electronics

USA . 950 parts In-Stock

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$28.500

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950

$28.500

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Corphita

USA . 3,124 parts In-Stock

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Overview

Elevate your electronic projects with the Texas Instruments UC27132L, a top-tier peripheral driver designed to deliver exceptional performance and reliability. Crafted with precision using high-quality ceramic and metal-sealed cofired materials, this chip carrier boasts built-in protections against overcurrent, ensuring peace of mind for users. With a wide operating temperature range and a maximum supply voltage of 65V, this industrial-grade peripheral driver is versatile and durable, making it ideal for a variety of applications. Experience enhanced functionality and efficiency with the UC27132L, where quality meets value for unparalleled results.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed co-fired package body material ensures durability and reliability for long-term use.

Surface Mount: YES

The ability to be surface mounted makes installation convenient and saves space in electronic assemblies.

Maximum Supply Voltage: 65 V

With a high maximum supply voltage, this peripheral driver can handle a wide range of input voltages.

Built-in Protections: OVER CURRENT

The built-in over current protection ensures the device is safeguarded against potential damage from excessive current flow.

No. of Terminals: 20

Having 20 terminals provides versatility in connectivity options and allows for interfacing with multiple components.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this peripheral driver suitable for industrial environments with potentially high temperatures.

Nominal Output Peak Current Limit: 0.7 A

The nominal output peak current limit of 0.7 A ensures stable and controlled output current for connected peripherals.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter-based interface IC type enhances signal integrity and ensures smooth communication between the driver and connected peripherals.

Technical Specifications

Peripheral Drivers UC27132L attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

OVER CURRENT

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Peak Current Limit:

.7 A

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

2.54 mm

Maximum Supply Voltage:

65 V

Minimum Supply Voltage:

8 V

Nominal Supply Voltage:

25 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

UC27132L Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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