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UC2702N

Texas Instruments

UC2702N by Texas Instruments

UC2702N by Texas Instruments is a PWM-based peripheral driver with 4 functions. It operates at 5V, with built-in protections for over current and under voltage. Ideal for applications requiring sink output current flow direction and a turn-on time of 0.25 us.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,664 parts In-Stock

1+ parts

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7,664

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Digiode

USA . 2,085 parts In-Stock

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2,085

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,285 parts In-Stock

1+ parts

$9.786

100+ parts

-

1k+ parts

$10.359

10k+ parts

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2,285

$9.786

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$10.359

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DigiPath Technology Company

USA . 1,588 parts In-Stock

1+ parts

$10.776

100+ parts

-

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10k+ parts

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1,588

$10.776

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ChromeModa Solutions

Germany . 6,042 parts In-Stock

1+ parts

$10.996

100+ parts

$9.017

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-

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6,042

$10.996

$9.017

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IDEA Electronic Components Group

UK . 1,767 parts In-Stock

1+ parts

$10.996

100+ parts

$10.446

1k+ parts

$9.896

10k+ parts

-

1,767

$10.996

$10.446

$9.896

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AZTECH Wire

Italy . 326 parts In-Stock

1+ parts

$14.776

100+ parts

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326

$14.776

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One Stop Electronics

USA . 1,169 parts In-Stock

1+ parts

$29.500

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1,169

$29.500

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Corphita

USA . 1,133 parts In-Stock

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1,133

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Overview

Enhance your electronic projects with the UC2702N by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers exceptional quality and reliability. The UC2702N is a versatile peripheral driver offering built-in protections against over current and under voltage, making it perfect for a wide range of applications. With its compact design and efficient performance, this product provides exceptional value and benefits to customers looking for a reliable solution for their electronic needs. Elevate your projects with the UC2702N today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes the driver lightweight and durable, ensuring long-lasting performance.

Built-in Protections: OVER CURRENT; UNDER VOLTAGE

The built-in protections for over current and under voltage help protect connected peripherals from potential damage, enhancing the safety and reliability of the system.

Maximum Output Current: 0.05 A

With a maximum output current of 0.05 A, this driver is able to provide sufficient power to peripherals without overloading them.

Technology: BIPOLAR

The bipolar technology used in this peripheral driver ensures stable and efficient operation, making it a reliable choice for driving peripherals.

Interface IC Type: PWM BASED PERIPHERAL DRIVER

Being a PWM-based peripheral driver, this product offers precise control over the connected peripherals, allowing for customized and optimized performance.

Technical Specifications

Peripheral Drivers UC2702N attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

OVER CURRENT; UNDER VOLTAGE

Driver No. of Bits:

4

Interface IC Type:

JESD-30 Code:

R-PDIP-T16

Length:

19.3 mm

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Output Current Flow Direction:

SINK

Maximum Output Current:

.05 A

Nominal Output Peak Current Limit:

.175 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

8 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

42.5 V

Nominal Supply Voltage-1:

34 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Turn-off Time:

.25 us

Turn-on Time:

.25 us

Width:

7.62 mm

Trade Compliance

UC2702N Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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