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UC27132NG4

Texas Instruments

UC27132NG4 by Texas Instruments

UC27132NG4 by Texas Instruments is a 14-terminal peripheral driver with max output current of 0.25A and nominal voltage of 25V. It operates in industrial temperature range (-40 to 85°C) and is ideal for various applications requiring precise power supplies in an IN-LINE package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,554 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,554

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-

-

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Digiode

USA . 2,403 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,403

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,049 parts In-Stock

1+ parts

$3.713

100+ parts

-

1k+ parts

$4.215

10k+ parts

-

1,049

$3.713

-

$4.215

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DigiPath Technology Company

USA . 1,009 parts In-Stock

1+ parts

$4.089

100+ parts

-

1k+ parts

-

10k+ parts

-

1,009

$4.089

-

-

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ChromeModa Solutions

Germany . 4,550 parts In-Stock

1+ parts

$4.172

100+ parts

$3.421

1k+ parts

-

10k+ parts

-

4,550

$4.172

$3.421

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IDEA Electronic Components Group

UK . 291 parts In-Stock

1+ parts

$4.172

100+ parts

-

1k+ parts

$3.755

10k+ parts

-

291

$4.172

-

$3.755

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AZTECH Wire

Italy . 559 parts In-Stock

1+ parts

$12.494

100+ parts

-

1k+ parts

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10k+ parts

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559

$12.494

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One Stop Electronics

USA . 425 parts In-Stock

1+ parts

$41.500

100+ parts

-

1k+ parts

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10k+ parts

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425

$41.500

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Corphita

USA . 4,376 parts In-Stock

1+ parts

-

100+ parts

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4,376

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Overview

Enhance the efficiency of your electronic devices with the UC27132NG4 by Texas Instruments, a top-tier manufacturer renowned for producing high-quality peripheral drivers. Perfect for a wide range of applications, this product offers unparalleled reliability and performance. With a sleek rectangular package body made of durable plastic/epoxy material, this driver boasts a maximum output current of 0.25A and a nominal supply voltage of 25V. Experience the benefits of seamless integration and optimal functionality with the UC27132NG4, providing exceptional value and advantages to customers seeking top-notch electronic components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable, ideal for use in various applications.

Power Supplies (V): 25

Operating at a power supply of 25V ensures compatibility with a wide range of systems and equipment.

No. of Terminals: 14

With 14 terminals, this product offers versatility and flexibility in connection options for different setups.

Maximum Output Current: 0.25 A

Capable of delivering a maximum output current of 0.25A, this product is efficient in driving peripherals without overloading.

Technology: BIPOLAR

Utilizing bipolar technology ensures reliable and stable performance in driving peripherals, making it a dependable choice for use.

Technical Specifications

Peripheral Drivers UC27132NG4 attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Driver No. of Bits:

1

JESD-30 Code:

R-PDIP-T14

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.25 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

25

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Nominal Supply Voltage:

25 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

UC27132NG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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