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UC27131DG4

Texas Instruments

UC27131DG4 by Texas Instruments

UC27131DG4 by Texas Instruments is a Peripheral Driver with 8 terminals, operating voltage range of 8-25V, and max output current of 0.25A. Ideal for industrial applications, it offers built-in transient and overcurrent protections in a compact rectangular package suitable for surface mount assembly.

Median Price

$11.090

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 97 parts In-Stock

1+ parts

$11.090

100+ parts

$7.090

1k+ parts

$6.180

10k+ parts

$5.440

97

$11.090

$7.090

$6.180

$5.440

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,614 parts In-Stock

1+ parts

$6.479

100+ parts

-

1k+ parts

-

10k+ parts

-

3,614

$6.479

-

-

-

Vyrian

USA . 7,447 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,447

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 895 parts In-Stock

1+ parts

$6.138

100+ parts

-

1k+ parts

-

10k+ parts

-

895

$6.138

-

-

-

Parana Technologies

USA . 1,811 parts In-Stock

1+ parts

$9.326

100+ parts

-

1k+ parts

$9.950

10k+ parts

-

1,811

$9.326

-

$9.950

-

ChromeModa Solutions

Germany . 3,691 parts In-Stock

1+ parts

$10.479

100+ parts

$8.593

1k+ parts

-

10k+ parts

-

3,691

$10.479

$8.593

-

-

IDEA Electronic Components Group

UK . 1,883 parts In-Stock

1+ parts

$10.479

100+ parts

$9.955

1k+ parts

$9.431

10k+ parts

-

1,883

$10.479

$9.955

$9.431

-

Microchip USA

USA . 4,738 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,738

-

-

-

-

DigiPath Technology Company

USA . 840 parts In-Stock

1+ parts

-

100+ parts

$9.448

1k+ parts

-

10k+ parts

-

840

-

$9.448

-

-

Overview

Enhance your electronic designs with the UC27131DG4 by Texas Instruments, a top-tier manufacturer known for innovative solutions. This peripheral driver offers robust built-in protections against transients and overcurrent, ensuring reliable performance in industrial applications. With a wide voltage range and open-emitter output characteristics, this small outline package delivers unmatched value and efficiency. Trust Texas Instruments to provide high-quality components that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Maximum Supply Voltage: 65 V

The high maximum supply voltage of 65V allows for versatile use in a wide range of applications without the risk of voltage overload.

Built-in Protections: TRANSIENT; OVER CURRENT

The built-in protections for transient and over current help protect the peripheral driver and connected devices from damage, ensuring reliable performance.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the peripheral driver can operate effectively in harsh environmental conditions, making it suitable for industrial applications.

Output Characteristics: OPEN-EMITTER

The open-emitter output characteristics allow for flexibility in circuit design and integration, offering customization options for the user.

Technical Specifications

Peripheral Drivers UC27131DG4 attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.89 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Output Current Flow Direction:

SINK

Maximum Output Current:

.25 A

Nominal Output Peak Current Limit:

.9 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

25

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Current:

4 mA

Maximum Supply Voltage:

65 V

Minimum Supply Voltage:

8 V

Nominal Supply Voltage:

25 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

6 us

Turn-on Time:

6 us

Width:

3.9 mm

Trade Compliance

UC27131DG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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