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UC2702J

Texas Instruments

UC2702J by Texas Instruments

UC2702J by Texas Instruments is a PWM-based peripheral driver with 4 functions. It operates at 5V, with built-in protections for over current and under voltage. Suitable for applications requiring sink output current flow direction and a turn-on time of 0.25 us.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,209 parts In-Stock

1+ parts

-

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7,209

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Digiode

USA . 4,588 parts In-Stock

1+ parts

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4,588

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 256 parts In-Stock

1+ parts

$5.683

100+ parts

-

1k+ parts

$6.476

10k+ parts

-

256

$5.683

-

$6.476

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DigiPath Technology Company

USA . 850 parts In-Stock

1+ parts

$6.257

100+ parts

$5.757

1k+ parts

-

10k+ parts

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850

$6.257

$5.757

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ChromeModa Solutions

Germany . 4,329 parts In-Stock

1+ parts

$6.385

100+ parts

$5.236

1k+ parts

-

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4,329

$6.385

$5.236

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IDEA Electronic Components Group

UK . 1,704 parts In-Stock

1+ parts

$6.385

100+ parts

-

1k+ parts

$5.746

10k+ parts

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1,704

$6.385

-

$5.746

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AZTECH Wire

Italy . 693 parts In-Stock

1+ parts

$12.956

100+ parts

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693

$12.956

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One Stop Electronics

USA . 1,525 parts In-Stock

1+ parts

$28.500

100+ parts

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1,525

$28.500

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Corphita

USA . 4,800 parts In-Stock

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4,800

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Overview

Upgrade your electronics with the UC2702J by Texas Instruments, a top-notch peripheral driver designed to deliver high-quality performance and reliability. With built-in protections against over current and under voltage, this driver offers peace of mind while ensuring efficient operation. Perfect for a wide range of applications, this product boasts a durable ceramic, glass-sealed package body material and a compact rectangular shape for easy integration. Trust in Texas Instruments' expertise and elevate your projects with the UC2702J's precision and versatility.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed body material provides durability and resistance to environmental factors, ensuring a long-lasting performance.

Maximum Supply Voltage: 8 V

The maximum supply voltage of 8V allows for compatibility with a wide range of systems and applications.

No. of Functions: 4

Having 4 functions in one driver enhances the versatility and flexibility of the product, making it suitable for various tasks.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration and placement within different equipment or systems.

Built-in Protections: OVER CURRENT; UNDER VOLTAGE

The built-in protections against over current and under voltage help safeguard the connected components, ensuring reliable operation and preventing damage.

Power Supplies (V): 5

The 5V power supply ensures compatibility with standard voltage requirements, making it easy to integrate into existing systems.

Maximum Seated Height: 5.08 mm

The low seated height of 5.08mm allows for compact and space-efficient installation in constrained environments.

Interface IC Type: PWM BASED PERIPHERAL DRIVER

The PWM based interface IC type enables precise control and modulation of the driver, making it ideal for applications requiring adjustable performance.

Technical Specifications

Peripheral Drivers UC2702J attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

OVER CURRENT; UNDER VOLTAGE

Driver No. of Bits:

4

Interface IC Type:

JESD-30 Code:

R-GDIP-T16

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Output Current Flow Direction:

SINK

Maximum Output Current:

.05 A

Nominal Output Peak Current Limit:

.175 A

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

8 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

42.5 V

Nominal Supply Voltage-1:

34 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Turn-off Time:

.25 us

Turn-on Time:

.25 us

Width:

7.62 mm

Trade Compliance

UC2702J Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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