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UC27131DTRG4

Texas Instruments

UC27131DTRG4 by Texas Instruments

UC27131DTRG4 by Texas Instruments is a Peripheral Driver with 8 terminals, operating at -40 to 85°C. It has a max output current of 0.25A and supports a supply voltage of 25V. Ideal for industrial applications requiring bipolar technology in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,508 parts In-Stock

1+ parts

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100+ parts

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8,508

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Digiode

USA . 3,347 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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3,347

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,425 parts In-Stock

1+ parts

$1.500

100+ parts

-

1k+ parts

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1,425

$1.500

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AZTECH Wire

Italy . 619 parts In-Stock

1+ parts

$5.768

100+ parts

-

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619

$5.768

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Parana Technologies

USA . 383 parts In-Stock

1+ parts

$9.693

100+ parts

$900.141

1k+ parts

$8.724

10k+ parts

-

383

$9.693

$900.141

$8.724

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DigiPath Technology Company

USA . 1,189 parts In-Stock

1+ parts

$10.673

100+ parts

$9.819

1k+ parts

-

10k+ parts

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1,189

$10.673

$9.819

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ChromeModa Solutions

Germany . 5,213 parts In-Stock

1+ parts

$10.891

100+ parts

$8.931

1k+ parts

-

10k+ parts

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5,213

$10.891

$8.931

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IDEA Electronic Components Group

UK . 1,371 parts In-Stock

1+ parts

$10.891

100+ parts

$10.346

1k+ parts

$9.802

10k+ parts

-

1,371

$10.891

$10.346

$9.802

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Corphita

USA . 2,681 parts In-Stock

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2,681

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Overview

Enhance your electronic designs with the UC27131DTRG4 by Texas Instruments, a top-quality peripheral driver that offers unmatched reliability and performance. Manufactured by industry giant Texas Instruments, this product is perfect for a wide range of applications in various industries. With its advanced technology and durable construction, the UC27131DTRG4 provides customers with exceptional value, efficiency, and peace of mind. Upgrade your projects today with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Power Supplies (V): 25

The high power supply voltage of 25V allows for reliable and consistent performance.

No. of Terminals: 8

Offers a sufficient number of terminals for connecting to other components, increasing the versatility of the product.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications where heat resistance is crucial.

Technology: BIPOLAR

Uses bipolar technology for stable and efficient operation, ensuring optimal performance.

Nominal Supply Voltage: 25 V

Matches the power supply voltage, ensuring compatibility with other components in the system.

Technical Specifications

Peripheral Drivers UC27131DTRG4 attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G8

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.25 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

25

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Nominal Supply Voltage:

25 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

UC27131DTRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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