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UC2702DTR

Texas Instruments

UC2702DTR by Texas Instruments

UC2702DTR by Texas Instruments is a PWM-based peripheral driver with 4 functions, operating at -40 to 85 °C. It has built-in protections for over current and under voltage, with a max supply voltage of 42.5 V. Ideal for applications requiring sink output current flow direction in industrial temperature grades.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,594 parts In-Stock

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6,594

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Digiode

USA . 2,252 parts In-Stock

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2,252

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,079 parts In-Stock

1+ parts

$5.098

100+ parts

-

1k+ parts

$5.680

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2,079

$5.098

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$5.680

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DigiPath Technology Company

USA . 2,156 parts In-Stock

1+ parts

$5.613

100+ parts

$5.164

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2,156

$5.613

$5.164

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IDEA Electronic Components Group

UK . 2,187 parts In-Stock

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$5.728

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$5.155

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2,187

$5.728

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$5.155

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ChromeModa Solutions

Germany . 885 parts In-Stock

1+ parts

$5.728

100+ parts

$4.697

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885

$5.728

$4.697

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One Stop Electronics

USA . 739 parts In-Stock

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$7.500

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739

$7.500

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AZTECH Wire

Italy . 764 parts In-Stock

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$17.748

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764

$17.748

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Corphita

USA . 4,455 parts In-Stock

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Overview

Discover the power of Texas Instruments with the UC2702DTR peripheral driver. Designed for efficiency and reliability, this versatile component offers overcurrent and undervoltage protections to ensure seamless operation in industrial settings. With a compact design and high-quality materials, this PWM-based driver is perfect for a wide range of applications. Trust in Texas Instruments to deliver cutting-edge solutions that provide value, benefits, and unmatched performance to customers seeking top-of-the-line components for their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the peripheral driver, making it suitable for various environments.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into electronic circuits.

Maximum Supply Voltage: 8 V

This high maximum supply voltage ensures compatibility with a wide range of power sources.

No. of Functions: 4

Having multiple functions in one device improves efficiency and reduces the need for additional components.

Built-in Protections: OVER CURRENT; UNDER VOLTAGE

These protections help safeguard connected components and ensure the peripheral driver's longevity.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this peripheral driver can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this device to function in cold climates or industrial settings.

Nominal Output Peak Current Limit: 0.175 A

This current limit ensures safe operation and protects the peripheral driver from damage due to excessive current.

Interface IC Type: PWM BASED PERIPHERAL DRIVER

The Pulse Width Modulation-based interface allows for precise control and modulation of the output signals.

Technical Specifications

Peripheral Drivers UC2702DTR attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

OVER CURRENT; UNDER VOLTAGE

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

.175 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

8 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

42.5 V

Nominal Supply Voltage-1:

34 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

.25 us

Turn-on Time:

.25 us

Width:

3.9 mm

Trade Compliance

UC2702DTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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