Loading...

UC2706DWTRG4

Texas Instruments

UC2706DWTRG4 by Texas Instruments

UC2706DWTRG4 by Texas Instruments is a MOSFET gate driver with 16 terminals in a small outline package. It operates b/w -25°C to 85°C, utilizing bipolar technology and gull wing terminal form. Ideal for applications requiring precise control of MOSFETs in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,239 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,239

-

-

-

-

Digiode

USA . 4,672 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,672

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,034 parts In-Stock

1+ parts

$6.897

100+ parts

-

1k+ parts

$7.505

10k+ parts

-

2,034

$6.897

-

$7.505

-

DigiPath Technology Company

USA . 2,023 parts In-Stock

1+ parts

$7.594

100+ parts

$6.986

1k+ parts

-

10k+ parts

-

2,023

$7.594

$6.986

-

-

ChromeModa Solutions

Germany . 4,652 parts In-Stock

1+ parts

$7.749

100+ parts

$6.354

1k+ parts

-

10k+ parts

-

4,652

$7.749

$6.354

-

-

IDEA Electronic Components Group

UK . 992 parts In-Stock

1+ parts

$7.749

100+ parts

-

1k+ parts

$6.974

10k+ parts

-

992

$7.749

-

$6.974

-

AZTECH Wire

Italy . 301 parts In-Stock

1+ parts

$17.288

100+ parts

-

1k+ parts

-

10k+ parts

-

301

$17.288

-

-

-

One Stop Electronics

USA . 301 parts In-Stock

1+ parts

$35.500

100+ parts

-

1k+ parts

-

10k+ parts

-

301

$35.500

-

-

-

Corphita

USA . 509 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

509

-

-

-

-

Overview

Experience the unmatched quality and reliability of Texas Instruments with the UC2706DWTRG4 MOSFET Gate Driver. Designed for a wide range of applications, this small outline package offers customers superior performance and efficiency. With Texas Instruments' reputation for excellence in semiconductor manufacturing, you can trust that this product will deliver the precision and durability you need. Elevate your project with the value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for applications where weight and size are important considerations.

Surface Mount: YES

The surface mount capability allows for easy and convenient mounting on printed circuit boards, saving space and facilitating automated assembly processes.

No. of Terminals: 16

With 16 terminals, this gate driver offers a high level of connectivity and compatibility with various circuit configurations, enhancing its versatility and applicability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in demanding environments with elevated temperatures, making it suitable for a wide range of applications.

Technology: BIPOLAR

The bipolar technology used in this gate driver provides stable and precise control over MOSFETs, enabling efficient and accurate switching operations in power electronic systems.

Technical Specifications

MOSFET Gate Drivers UC2706DWTRG4 attributes and parameters. Explore more MOSFET Gate Drivers devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Sub-Category:

MOSFET Drivers

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

UC2706DWTRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20