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UC2706Q

Texas Instruments

UC2706Q by Texas Instruments

UC2706Q by Texas Instruments is a MOSFET Gate Driver with 2 functions, operating voltage range of 5-40V, and turn-on/off times of 0.14/0.13 us. Ideal for high side driver applications due to its push-pull based interface IC type and nominal output peak current limit of 1.5A.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,115 parts In-Stock

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Digiode

USA . 4,036 parts In-Stock

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4,036

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Distributors (Availability)

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Parana Technologies

USA . 1,045 parts In-Stock

1+ parts

$3.103

100+ parts

-

1k+ parts

$3.621

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1,045

$3.103

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$3.621

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DigiPath Technology Company

USA . 1,964 parts In-Stock

1+ parts

$3.417

100+ parts

$3.144

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1,964

$3.417

$3.144

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ChromeModa Solutions

Germany . 2,543 parts In-Stock

1+ parts

$3.487

100+ parts

$2.859

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2,543

$3.487

$2.859

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IDEA Electronic Components Group

UK . 163 parts In-Stock

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$3.487

100+ parts

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$3.138

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163

$3.487

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$3.138

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AZTECH Wire

Italy . 850 parts In-Stock

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$5.109

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850

$5.109

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One Stop Electronics

USA . 1,633 parts In-Stock

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$20.500

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1,633

$20.500

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A-Z Elektronik GmbH

Germany . 5,849 parts In-Stock

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5,849

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Corphita

USA . 1,861 parts In-Stock

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1,861

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Assy Fe

Spain . 1,278 parts In-Stock

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Kepictronics

USA . 283 parts In-Stock

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Overview

Experience the exceptional quality and reliability of Texas Instruments with the UC2706Q MOSFET Gate Driver. This versatile chip carrier package offers a range of applications in various industries, providing superior performance and efficiency. With a nominal supply voltage of 20V and a turn-on/off time of just 0.14/0.13 us, this high-side driver is perfect for your power management needs. Trust in Texas Instruments to deliver cutting-edge technology that meets your requirements and exceeds your expectations. Elevate your projects with the UC2706Q and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and durability are important considerations.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 40 V

With a high maximum supply voltage, this product can handle a wide range of power requirements, making it versatile for various applications.

No. of Functions: 2

Having multiple functions within a single device can help simplify circuit design and reduce the need for additional components, leading to a more efficient and cost-effective solution.

Package Shape: SQUARE

The square package shape provides a compact form factor, allowing for easy integration into tight spaces or densely packed PCB layouts.

No. of Terminals: 20

Having a high number of terminals allows for increased connectivity options and flexibility in circuit design, accommodating a wide range of configurations and applications.

Package Style (Meter): CHIP CARRIER

The chip carrier style package offers good heat dissipation capabilities, which is beneficial for high-power applications where heat management is crucial.

Minimum Supply Voltage: 5 V

The low minimum supply voltage requirement enables operation in low-power scenarios, making it suitable for battery-powered devices or energy-efficient applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions, providing reliability and longevity in harsh settings.

Minimum Operating Temperature: -25 °C

The wide operating temperature range ensures functionality in both extreme cold and hot environments, making it versatile for a variety of applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish offers good solderability and conductivity, ensuring a reliable electrical connection and ease of assembly during manufacturing.

Terminal Position: QUAD

The quad terminal position facilitates easy and secure mounting on PCBs, enhancing stability and minimizing the risk of mechanical failures.

Maximum Seated Height: 4.57 mm

The low maximum seated height allows for a slim profile, making it suitable for space-constrained applications or designs where component height is a critical factor.

Width: 8.965 mm

The compact width dimension enables efficient use of board space and allows for close placement with other components, contributing to a more compact and streamlined design.

High Side Driver: YES

Having a high side driver capability simplifies system design by allowing direct control of high-side switches, enhancing efficiency and performance in power delivery applications.

Length: 8.965 mm

The compact length dimension complements the overall small form factor of the product, enabling flexibility in placement within tight enclosures or limited space scenarios.

Technology: BIPOLAR

The bipolar technology offers high-speed switching capabilities and precise control, making it suitable for applications requiring rapid switching and accurate timing sequences.

Terminal Form: J BEND

The J bend terminal form provides mechanical stability and ease of soldering, ensuring a secure connection and reliable performance in high-vibration environments.

Nominal Supply Voltage: 20 V

The nominal supply voltage specification defines the standard operating voltage, providing a reference point for compatibility with other components and system requirements.

Turn-on Time: 0.14 us

The fast turn-on time enhances the responsiveness and efficiency of the device, enabling quick activation and precise control in time-critical applications.

Terminal Pitch: 1.27 mm

The narrow terminal pitch allows for close spacing between terminals, enabling high-density integration on PCBs and reducing the overall footprint of the device.

Moisture Sensitivity Level (MSL): 2

With a moisture sensitivity level of 2, the product can withstand moderate humidity levels during storage and manufacturing processes, ensuring long-term reliability and performance.

Nominal Output Peak Current Limit: 1.5 A

The high nominal output peak current limit allows for driving high-current loads with ease, making it suitable for power-hungry applications that demand robust performance.

Interface IC Type: PUSH-PULL BASED MOSFET DRIVER

The push-pull based MOSFET driver interface offers efficient and reliable driving of MOSFET transistors, ensuring optimal performance and power delivery in power electronics applications.

Turn-off Time: 0.13 us

The fast turn-off time enhances the responsiveness and efficiency of the device, enabling quick deactivation and precise control in time-sensitive applications.

Technical Specifications

MOSFET Gate Drivers UC2706Q attributes and parameters. Explore more MOSFET Gate Drivers devices from Texas Instruments

Specs

High Side Driver:

YES

Interface IC Type:

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e0

Length:

8.965 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Nominal Output Peak Current Limit:

1.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

40 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

20 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Turn-off Time:

.13 us

Turn-on Time:

.14 us

Width:

8.965 mm

Trade Compliance

UC2706Q Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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